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Infineon Technologies CY9AF341NBBGL-GE1

Part No.:
CY9AF341NBBGL-GE1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
112-LFBGA
Datasheet:
AetrixCY9AF341NBBGL-GE1.pdf
Description:
IC MCU 32BIT 96KB FLASH 112PFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,321

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Product details

Overview

CY9AF341NBBGL-GE1 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM, USB 2.0 Full-Speed device/host interface, 24-channel 12-bit ADC (2.0 μs conversion), and support for six low-power modes including Deep Standby RTC. It targets embedded motor control and industrial HMI systems requiring real-time responsiveness and secure firmware execution.

For engineers reviewing the CY9AF341NBBGL-GE1 datasheet, CY9AF341NBBGL-GE1 pinout, CY9AF341NBBGL-GE1 application, or CY9AF341NBBGL-GE1 equivalent, key selection criteria include dual-bank Flash update capability, USB host/device coexistence, 100-pin LQFP package I/O count (83 GPIO), RTC with leap-year support, and hardware CRC acceleration for data integrity in field-deployed firmware.

Technical Context

The CY9AF341NBBGL-GE1 implements an ARM Cortex-M3 r2p1 core operating up to 40 MHz with integrated NVIC supporting 48 peripheral interrupts and 16 priority levels. Its memory subsystem includes dual-bank Flash enabling concurrent read/erase/write operations and two independent SRAM banks (SRAM0 on I/D-code bus, SRAM1 on system bus).

Peripheral integration includes a full-featured USB 2.0 controller with built-in PLL, eight-channel DMA with 32-bit addressing, HDMI-CEC/remote receiver (2 channels), and a Clock Supervisor (CSV) that monitors external clock failure and frequency anomaly using internal CR oscillators.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M3 r2p1, 40 MHz max - enables deterministic real-time task scheduling with low-latency interrupt handling.
Flash Memory256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state - supports seamless firmware updates without halting application execution.
SRAM32 KB total (16 KB SRAM0 + 16 KB SRAM1), split bus architecture - isolates instruction/data access from system peripherals to reduce bus contention.
ADC24-channel 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - delivers high-speed analog sensing for motor current/voltage monitoring.
USB InterfaceFull-Speed device/host, 6 endpoints (EP0–EP5), built-in PLL - eliminates need for external clock synthesis when using main oscillator.
Low-Power ModesSix modes including Deep Standby RTC with RAM retention - extends battery life in always-on sensor nodes while preserving timekeeping and context.
Clock SourcesFive sources: 4–48 MHz main XTAL, 32.768 kHz sub-clock, 4 MHz/100 kHz CR oscillators, Main PLL - enables robust clock redundancy and fail-safe timing.

Pinout & Package

Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDual VCC pins (pins 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100)
XTAL1 / XTAL2Main crystal oscillator input/outputDrives 4–48 MHz external crystal; required for USB PLL lock and precise timing-critical peripherals.
OSC32IN / OSC32OUT32.768 kHz sub-clock crystal interfaceEnables RTC operation and wake-up from Deep Standby modes with ±20 ppm accuracy.
USB_DP / USB_DMUSB 2.0 Full-Speed differential pairDirect connection to USB connector; supports both device and host roles without external transceiver.
PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE15, PF0–PF15, PG0–PG15, PH0–PH15, PJ0–PJ15, PK0–PK3General-purpose I/O with port relocate83 configurable GPIOs; port relocation allows flexible peripheral mapping to avoid PCB routing conflicts.
INITXExternal reset inputActive-low asynchronous reset pin; overrides all internal reset sources including power-on and watchdog events.

Key Features

FeatureDesign Value
Dual-bank Flash memoryEnables over-the-air (OTA) firmware updates with zero downtime by executing from one bank while programming the other.
Hardware CRC acceleratorOffloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU, reducing firmware validation latency by >90% in communication stacks.
USB device/host dual modeAllows single-chip implementation of USB-based configuration tools (device mode) and field diagnostics (host mode) without external PHY.
RTC with leap-year supportMaintains accurate calendar time across century boundaries without software correction, critical for energy metering and logging applications.
Port relocate functionPermits dynamic assignment of UART, I²C, CSIO, and timer outputs to any GPIO group, simplifying PCB layout and enabling pin-compatible variants.

Applications

Industrial Motor ControlSmart Energy Metering

Use Scenario: Closed-loop control of BLDC motors in HVAC compressors with real-time current sensing and PWM generation.

IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithm, managing 24-channel ADC sampling, and driving 16-bit PWM timers with dead-time insertion.

Use Value: Dual-bank Flash enables field firmware upgrades without stopping motor operation; 2.0 μs ADC ensures precise current loop timing at 50 kHz switching frequency.

Use Scenario: Residential electricity meter with tamper detection, tariff switching, and secure data logging via USB.

IC Role / Device Role / Timing Role: System controller handling metrology calculations, RTC-based billing intervals, and encrypted USB mass storage transfers.

Use Value: Hardware CRC32 validates firmware and log integrity; Deep Standby RTC preserves time and meter state during power outages.

Factory Automation HMIBuilding Management System Node

Use Scenario: Touch-enabled panel controlling PLC I/O modules via RS-485 and displaying real-time process data.

IC Role / Device Role / Timing Role: Human-machine interface processor running FreeRTOS, managing UART/CSIO peripherals, and rendering UI via parallel LCD interface.

Use Value: 83 GPIOs accommodate resistive touch controller, LED indicators, and expansion headers; USB device mode enables local configuration via PC.

Use Scenario: Wireless gateway node aggregating temperature/humidity sensors and forwarding data via Ethernet or LoRaWAN.

IC Role / Device Role / Timing Role: Edge processing unit performing sensor fusion, time-stamped event logging, and scheduled USB firmware sync.

Use Value: Sub-clock RTC maintains accurate timestamps across network disconnects; hardware watchdog ensures recovery from sensor bus lockups.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F303VCT6ARM Cortex-M4F core, 72 MHz, 256 KB Flash, no USB host, 16-bit sigma-delta ADCLacks USB host and dual-bank Flash; superior analog performance but no OTA update capabilitySelect when high-precision analog measurement outweighs field-upgrade requirements
RA4M1 (R7FA4M1AB3CFM)ARM Cortex-M4, 48 MHz, 256 KB Flash, USB device only, 12-bit ADC (1.0 μs), no hardware CRCNo USB host or hardware CRC accelerator; includes TrustZone security but lacks Deep Standby RTCSelect for secure boot and code protection where USB host and long-term RTC retention are non-critical

Compared with STM32F303VCT6 and RA4M1, CY9AF341NBBGL-GE1 uniquely combines USB device/host duality, dual-bank Flash for safe OTA, and Deep Standby RTC with RAM retention-making it optimal for field-deployed industrial controllers requiring unattended firmware updates and persistent timekeeping.

Availability

CY9AF341NBBGL-GE1 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, factory automation HMI, and building management system nodes requiring stable component supply and long-term lifecycle support.

Supply support for CY9AF341NBBGL-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and industrial control solutions.

The CY9AF341NBBGL-GE1 belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power embedded applications demanding real-time performance, secure firmware execution, and rich peripheral integration in industrial and consumer equipment.

FAQ

What is the maximum operating frequency of the CY9AF341NBBGL-GE1 core?

The CY9AF341NBBGL-GE1 features an ARM Cortex-M3 r2p1 core rated for up to 40 MHz operation under recommended conditions (VCC = 2.7–3.6 V, ambient temperature ≤ 85°C). This frequency is achieved using the main PLL driven by either an external 4–48 MHz crystal or the internal 4 MHz CR oscillator. The core maintains full functionality-including NVIC, SysTick, and debug interfaces-at this speed.

Does the CY9AF341NBBGL-GE1 support USB host functionality without external components?

Yes. The CY9AF341NBBGL-GE1 integrates a full-featured USB 2.0 Full-Speed host controller with built-in PLL, eliminating the need for external clock synthesis or PHY components. It supports bulk, interrupt, and isochronous transfers, automatic device enumeration, IN/OUT token handshake processing, and 256-byte packet length-all directly from the MCU's USB_DP/USB_DM pins.

How does the dual-bank Flash architecture enable firmware updates?

The dual-bank Flash (240 KB upper + 16 KB lower) allows simultaneous execution from one bank while erasing/writing to the other. During OTA updates, the active application runs from Bank A while new firmware is validated and written to Bank B. Upon reset, the boot loader selects Bank B, achieving zero-downtime field upgrades without external memory or bootloader partitioning complexity.

Which low-power modes retain RTC functionality and RAM contents?

The CY9AF341NBBGL-GE1 supports RTC retention in Deep Standby RTC mode, where the 32.768 kHz sub-clock continues running and the RTC registers remain powered. RAM retention is configurable: users may select "keep RAM" or "clear RAM" upon entry. In contrast, Deep Standby Stop mode retains neither RTC nor RAM unless explicitly enabled via register settings before entering the mode.

CY9AF341NBBGL-GE1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
112-LFBGA
Series:
FM3 MB9A340NB
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9AF341NBBGL-GE1 FAQ

1.How can I place an order for CY9AF341NBBGL-GE1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9AF341NBBGL-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9AF341NBBGL-GE1 reliable?

The price and inventory of CY9AF341NBBGL-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF341NBBGL-GE1 is usually 5 days.

3.What payment methods are accepted for CY9AF341NBBGL-GE1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF341NBBGL-GE1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9AF341NBBGL-GE1?

CY9AF341NBBGL-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9AF341NBBGL-GE1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9AF341NBBGL-GE1?

For technical support, including CY9AF341NBBGL-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF341NBBGL-GE1 requirements.

6.How does Aetrix verify that CY9AF341NBBGL-GE1 is sourced from the original manufacturer or authorized distributors?

All CY9AF341NBBGL-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF341NBBGL-GE1 meets industry standards.

7.What is the process for return or replacement of CY9AF341NBBGL-GE1?

All CY9AF341NBBGL-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF341NBBGL-GE1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9AF341NBBGL-GE1 part is unused and in its original packaging.

Return procedure for CY9AF341NBBGL-GE1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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