My Inquiry
My Account
Infineon Technologies CY9AFA44NBBGL-GE1
- Part No.:
- CY9AFA44NBBGL-GE1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 96-LFBGA
- Datasheet:
-
CY9AFA44NBBGL-GE1.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 96FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,891
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AFA44NBBGL-GE1 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), 40 MHz max CPU frequency, and integrated LCD controller supporting up to 40 SEG × 8 COM. It targets low-power embedded control in industrial HMI and appliance panels.
For engineers reviewing the CY9AFA44NBBGL-GE1 datasheet, CY9AFA44NBBGL-GE1 pinout, CY9AFA44NBBGL-GE1 application, or CY9AFA44NBBGL-GE1 equivalent, key selection criteria include dual-bank Flash for safe firmware updates, 8-channel DMA with 32-bit addressing, 24-channel 12-bit ADC with 2.0 μs conversion time, RTC with leap-year support, and 6 low-power modes including Deep Standby RTC with RAM retention.
Technical Context
This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent instruction fetch and data access.
The peripheral set includes an 8-channel DMA controller operating on a dedicated bus, dual 12-bit ADC units with FIFO-based scan/priority conversion, and a programmable LCDC with internal bias resistors and blinking control - all operating within 1.65 V–3.6 V supply range, with 2.2 V minimum when LCDC is active.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 r2p1, 40 MHz max - enables deterministic real-time control with Thumb-2 instruction set and hardware divide. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports simultaneous erase/write/read for robust OTA updates. |
| SRAM | 32 KB total (16 KB SRAM0 on I/D bus + 16 KB SRAM1 on system bus) - enables concurrent code execution and data buffering. |
| ADC | 24-channel 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - delivers high-speed sensor acquisition with scan/priority modes and 16-step FIFO. |
| LCDC | 40 SEG × 8 COM, internal bias resistors, blink control - drives segment-based displays without external components. |
| Low-Power Modes | 6 modes including Deep Standby RTC with optional RAM retention - extends battery life in always-on display applications. |
| Clock Sources | 5 sources: 4–48 MHz main oscillator, 32.768 kHz sub-clock, 4 MHz/100 kHz CR oscillators, Main PLL - ensures timing flexibility and fail-safe clock supervision. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated analog/digital power pins; separate VCC/VSS pairs per functional block reduce noise coupling. |
| XTAL / EXTAL | Main clock oscillator input/output | Drives 4–48 MHz crystal; supports external clock input mode for precise timing source selection. |
| OSC32K / OSC32KIN | Sub-clock oscillator input/output | Connects to 32.768 kHz crystal for RTC and low-power wake-up timing. |
| SEG0–SEG39 / COM0–COM7 | LCD segment/common drivers | Direct drive outputs for multiplexed segment LCDs; internal resistor ladder eliminates external bias network. |
| P00–P97 | General-purpose I/O with port relocate | 83 GPIOs with per-pin pull-up control, direct read capability, and flexible peripheral mapping via register configuration. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash architecture | Enables background firmware update: one bank executes while the other is erased/written, eliminating application interruption. |
| Independent SRAM banks | SRAM0 (I/D bus) hosts code and stack; SRAM1 (system bus) buffers DMA transfers - prevents bus contention during high-throughput operations. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU, reducing integrity-check latency for communication and storage. |
| 8-channel DMA with 32-bit addressing | Transfers up to 4 GB of memory space without CPU intervention, supporting burst/block/demand modes for peripherals like ADC and UART. |
| RTC with leap-year handling | Maintains accurate calendar time across century boundaries; supports date/time-triggered interrupts and continuous time update during write. |
Applications
| Industrial HMI Panels | Smart Appliance Control |
|---|---|
Use Scenario: Touchless control interface for HVAC systems with segmented LCD display and temperature/humidity sensing. IC Role / Device Role / Timing Role: Central controller managing sensor acquisition, LCD refresh, button debounce, and serial communication to main host. Use Value: Dual-bank Flash allows field firmware updates without display blackout; 24-channel ADC reads multiple sensors simultaneously with 2.0 μs resolution. | Use Scenario: Oven control unit with 40-segment LCD showing cooking time, temperature, and mode status. IC Role / Device Role / Timing Role: Primary MCU executing safety logic, driving LCD segments, monitoring door switches, and logging runtime data to Flash. Use Value: Integrated LCDC eliminates external driver IC; Deep Standby RTC maintains clock and alarm during power-off with RAM retention for last-state recovery. |
| Energy Metering Displays | Building Automation Nodes |
Use Scenario: DIN-rail mounted electricity meter with segmented LCD showing kWh, voltage, current, and tariff indicators. IC Role / Device Role / Timing Role: Dedicated display and data-logging controller interfacing with metrology IC via SPI/I2C and updating LCD every 200 ms. Use Value: 8-channel DMA moves ADC and metrology data to SRAM1 without CPU load; RTC triggers hourly energy snapshot with leap-year-corrected timestamps. | Use Scenario: Wireless gateway node controlling lighting, blinds, and occupancy sensors in commercial offices. IC Role / Device Role / Timing Role: Local decision engine running schedule-based automation, reading digital inputs, and driving relay outputs via GPIO. Use Value: Six low-power modes enable <10 μA sleep current; port relocate function simplifies PCB layout by remapping UART/CSIO to optimal pin locations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY9AA40NB-LSI | Same FM3 family, 100-pin LQFP, but lacks LCDC and HDMI-CEC; 128 KB Flash, 16 KB SRAM. | Suitable for non-display control tasks where cost optimization outweighs LCD integration. | Select when display functionality is unnecessary and BOM cost reduction is critical. |
| STM32F103VCT6 | ARM Cortex-M3, 256 KB Flash, 48 KB SRAM, no integrated LCDC; supports external LCD controllers via FSMC. | Requires external driver IC for segment LCDs; better suited for graphic TFT interfaces with external SDRAM. | Choose when migrating to ST ecosystem or needing higher SRAM for complex algorithms. |
Compared with CY9AFA44NBBGL-GE1, CY9AA40NB-LSI reduces feature count and memory to cut cost for non-LCD roles, while STM32F103VCT6 trades integrated display support for broader peripheral flexibility and larger SRAM - making it preferable for algorithm-intensive, non-segment-display applications.
Availability
CY9AFA44NBBGL-GE1 is available at Aetrix Electronics and suitable for industrial HMI panels, smart appliance control, energy metering displays, and building automation nodes requiring stable component supply and long-term lifecycle support.
Supply support for CY9AFA44NBBGL-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and industrial control solutions, with global manufacturing and R&D infrastructure.
The CY9AFA44NBBGL-GE1 belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power embedded control applications requiring integrated LCD drivers and robust firmware update capability.
FAQ
What is the maximum operating frequency and supported voltage range?
The CY9AFA44NBBGL-GE1 operates at up to 40 MHz and supports a wide supply range of 1.65 V to 3.6 V. When the LCD controller is active, the minimum supply voltage increases to 2.2 V to ensure stable bias generation and segment drive strength. All DC and AC characteristics in the datasheet are validated across this full operating range.
Does this MCU support in-system programming and secure firmware updates?
Yes - the dual-bank Flash architecture enables true in-system programming: one bank runs application code while the other is erased and reprogrammed via UART, CSIO, or I2C. Code protection features include Flash security bits that prevent unauthorized read-out, and the CRC accelerator verifies firmware integrity before activation.
Can the LCD controller drive custom segment layouts beyond 40×8?
No - the integrated LCDC is fixed at 40 SEG × 8 COM with selectable 4-COM or 8-COM modes. It does not support dynamic reconfiguration beyond these dimensions or graphic pixel mapping. For non-standard or larger displays, external segment drivers or a different MCU with programmable display engine must be used.
Which debug interface is supported, and is JTAG available?
The CY9AFA44NBBGL-GE1 supports Serial Wire JTAG Debug Port (SWJ-DP) only - JTAG TAP is not implemented. SWJ-DP provides full debug access including breakpoints, watchpoints, and memory inspection via standard ARM CoreSight tools. ETM trace is not supported on this variant, as confirmed in the datasheet revision notes.
CY9AFA44NBBGL-GE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 96-LFBGA
- Series:
- FM3 MB9AA40NB
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, UART/USART
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 83
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AFA44NBBGL-GE1 FAQ
1.How can I place an order for CY9AFA44NBBGL-GE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AFA44NBBGL-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AFA44NBBGL-GE1 reliable?
The price and inventory of CY9AFA44NBBGL-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AFA44NBBGL-GE1 is usually 5 days.
3.What payment methods are accepted for CY9AFA44NBBGL-GE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AFA44NBBGL-GE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AFA44NBBGL-GE1?
CY9AFA44NBBGL-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AFA44NBBGL-GE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AFA44NBBGL-GE1?
For technical support, including CY9AFA44NBBGL-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AFA44NBBGL-GE1 requirements.
6.How does Aetrix verify that CY9AFA44NBBGL-GE1 is sourced from the original manufacturer or authorized distributors?
All CY9AFA44NBBGL-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AFA44NBBGL-GE1 meets industry standards.
7.What is the process for return or replacement of CY9AFA44NBBGL-GE1?
All CY9AFA44NBBGL-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AFA44NBBGL-GE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AFA44NBBGL-GE1 part is unused and in its original packaging.
Return procedure for CY9AFA44NBBGL-GE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AFA44NBBGL-GE1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
