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Infineon Technologies CY9AFB41LBPMC-G-JNE2

Part No.:
CY9AFB41LBPMC-G-JNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY9AFB41LBPMC-G-JNE2.pdf
Description:
IC MCU 32BIT 96KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,114

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Product details

Overview

CY9AFB41LBPMC-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM, USB 2.0 Full-Speed device/host interface, 12-bit ADC (24 channels), and LCD controller (40×8). It operates up to 40 MHz, supports six low-power modes, and targets embedded control in industrial HMIs, sensor nodes, and USB-connected peripherals.

For engineers reviewing the CY9AFB41LBPMC-G-JNE2 datasheet, CY9AFB41LBPMC-G-JNE2 pinout, CY9AFB41LBPMC-G-JNE2 application, or CY9AFB41LBPMC-G-JNE2 equivalent, key selection criteria include dual-bank Flash for safe firmware updates, integrated USB transceiver with built-in PLL, 5 V-tolerant GPIOs on select pins, and RTC with leap-year support - all validated in the FM3 Peripheral Manual TYPE6 classification.

Technical Context

This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels. Its memory subsystem includes two independent SRAM banks (SRAM0/SRAM1) connected to I-code/D-code and system buses respectively, enabling concurrent CPU and DMA access without contention.

The peripheral set is optimized for real-time embedded control: dual 12-bit ADCs with FIFO-based scanning and priority conversion, HDMI-CEC/remote receiver with 4-byte buffer and repeat-code detection, and a CRC accelerator supporting CCITT CRC16 and IEEE-802.3 CRC32 for data integrity in communication and storage paths.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M3 r2p1, 40 MHz max - enables deterministic real-time task scheduling with SysTick timer for OS integration.
Flash Memory256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - allows background write/erase of one bank while executing from the other.
SRAM32 KB total (16 KB SRAM0 + 16 KB SRAM1), split bus architecture - isolates instruction/data fetch from system DMA traffic.
USB InterfaceFull-Speed device/host with built-in PLL, 6 endpoints (EP0–EP5), double-buffered EP1–EP5 - supports HID, CDC, and mass-storage class implementations without external PHY.
ADCTwo 12-bit SAR converters, 2.0 μs conversion time @ 2.7–3.6 V, 24-channel input - meets sub-10 μs sampling requirements for motor current sensing and analog monitoring.
Low-Power ModesSix modes including Deep Standby RTC/Stop with RAM retention options - extends battery life in always-on sensor nodes and RTC-critical applications.
Operating Voltage1.65–3.6 V (2.2–3.6 V with LCDC active, 3.0–3.6 V with USB active) - supports single-supply designs across mixed-peripheral use cases.

Pinout & Package

Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC, VSSPower supply and groundDedicated power/ground pairs per quadrant minimize noise coupling in mixed-signal operation.
XTAL1/XTAL2Main clock oscillator inputsSupports 4–48 MHz crystal or external clock source; required for USB PLL and high-speed peripherals.
OSC32IN/OSC32OUTSub-clock oscillator inputsConnects to 32.768 kHz crystal for RTC and low-power wake-up timing.
USB_DP/USB_DMUSB 2.0 Full-Speed differential pairIntegrated transceiver with internal termination - no external resistors needed for standard USB cable connection.
LCDD0–LCDD31LCD segment driversDrive up to 40 segments × 8 commons; internal bias generation eliminates external resistor network.
PA0–PA15, PB0–PB15, etc.General-purpose I/O with port relocate83 total GPIOs; function remapping allows flexible PCB layout and peripheral routing without pin conflicts.

Key Features

FeatureDesign Value
Dual-bank Flash memoryEnables over-the-air firmware updates with zero downtime: erase/write one bank while executing from the other.
USB device/host with built-in PLLEliminates need for external clock generator or USB PHY; supports composite devices with multiple interfaces.
Two independent SRAM banksPrevents CPU-DMA bus contention during high-throughput transfers (e.g., ADC-to-memory streaming).
HDMI-CEC/Remote receiverHardware-accelerated CEC frame parsing and repeat-code detection reduce CPU load in consumer remote control systems.
RTC with leap-year correctionMaintains accurate calendar time across decades without host software intervention or periodic calibration.

Applications

Industrial HMI PanelUSB-Capable Sensor Node

Use Scenario: Touch-enabled factory display with real-time process status, alarm logging, and local configuration.

IC Role / Device Role / Timing Role: Main controller managing LCD refresh (40×8), button input scanning, USB CDC virtual COM port for PC configuration, and RTC timestamping of events.

Use Value: Dual-bank Flash allows field firmware updates without halting HMI operation; 5 V-tolerant GPIOs interface directly with legacy industrial I/O modules.

Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and CO₂, then uploading via USB to host PC.

IC Role / Device Role / Timing Role: Data acquisition hub performing 12-bit ADC conversions on 24 channels, storing logs in SRAM, and presenting as USB mass-storage device.

Use Value: Six low-power modes extend battery life beyond 1 year; built-in USB transceiver removes need for external PHY IC and associated BOM cost.

Consumer Remote Control HubSmart Appliance Timer Module

Use Scenario: IR/CEC gateway translating smartphone BLE commands into HDMI-CEC signals for TV/audio control.

IC Role / Device Role / Timing Role: Protocol translator with hardware CEC transmitter/receiver and IR demodulator, using RTC for scheduled power-on/off.

Use Value: Hardware CEC block handles arbitration, ACK, and EOM generation autonomously - reduces firmware complexity and improves compliance with HDMI spec.

Use Scenario: Oven/microwave timer module requiring precise cooking duration tracking, buzzer alerts, and keypad interface.

IC Role / Device Role / Timing Role: Real-time scheduler with RTC calendar, PWM-controlled buzzer, and 83 GPIOs driving LED display and membrane keypad.

Use Value: Leap-year-aware RTC ensures accurate long-term scheduling; port relocate function simplifies PCB routing for dense front-panel layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F103VET6ARM Cortex-M3, 512 KB Flash, 64 KB SRAM, no native USB host, no HDMI-CEC, no LCD controllerRequires external USB PHY for host mode; lacks integrated LCD and CEC blocks - needs additional ICs for same feature setSelect when USB device-only and higher Flash/SRAM are prioritized over integrated peripherals.
RA4M1 (R7FA4M1AB3CFM)ARM Cortex-M4F, 256 KB Flash, 32 KB SRAM, USB device/host, no LCD controller, no HDMI-CECHigher CPU performance and FPU, but missing LCD and CEC hardware - unsuitable for direct HMI or CEC gateway replacementSelect for floating-point math-intensive tasks where LCD/CEC are handled externally or omitted.

Compared with STM32F103VET6 and RA4M1, CY9AFB41LBPMC-G-JNE2 uniquely integrates LCD driver, HDMI-CEC transceiver, and dual-bank Flash in a single 100-pin LQFP package - reducing BOM count and PCB area for cost-sensitive, feature-dense embedded controllers.

Availability

CY9AFB41LBPMC-G-JNE2 is available at Aetrix Electronics and suitable for industrial HMI panels, USB-connected sensor nodes, and smart appliance timer modules requiring stable component supply, long-lifecycle support, and qualified automotive-grade traceability.

Supply support for CY9AFB41LBPMC-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

This part belongs to the FM3 family - a line of 32-bit ARM Cortex-M3 microcontrollers designed specifically for cost-sensitive, low-power embedded control applications requiring integrated analog, USB, LCD, and CEC functionality.

FAQ

Does CY9AFB41LBPMC-G-JNE2 support USB host mode without external components?

Yes. The device includes a full-speed USB 2.0 host controller with built-in transceiver and PLL, eliminating the need for external PHY or clock generator. It supports bulk, interrupt, and isochronous transfers, automatic IN/OUT token handling, and device connect/disconnect detection - all implemented in hardware per the FM3 Peripheral Manual TYPE6 specification.

What is the maximum resolution and drive capability of the integrated LCD controller?

The LCDC supports up to 40 segments × 8 commons in static or multiplexed mode, with programmable bias voltage generation (VV0–VV4 pins) and internal dividing resistors. It drives standard STN and segment LCDs directly without external charge pumps or bias networks, and includes blinking control for visual status indication.

Can the dual-bank Flash be used for secure firmware updates?

Yes. The dual-bank architecture (240 KB upper + 16 KB lower) enables atomic firmware updates: new code is written and verified in one bank while the system runs from the other. The boot vector is switchable via dedicated register, allowing fail-safe rollback if update validation fails - a capability confirmed in the CY9AB40NB Series datasheet Rev. *D.

Which low-power modes retain RTC and RAM contents simultaneously?

Deep Standby RTC mode retains both RTC calendar/timekeeping and configurable SRAM contents (SRAM0 and/or SRAM1) while drawing sub-1 μA current from the VBAT rail. This mode uses the 32.768 kHz sub-clock and is exited via RTC alarm or external interrupt - ideal for battery-backed event logging and scheduled wake-up applications.

CY9AFB41LBPMC-G-JNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
FM3 MB9AB40NB
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9AFB41LBPMC-G-JNE2 FAQ

1.How can I place an order for CY9AFB41LBPMC-G-JNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9AFB41LBPMC-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9AFB41LBPMC-G-JNE2 reliable?

The price and inventory of CY9AFB41LBPMC-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AFB41LBPMC-G-JNE2 is usually 5 days.

3.What payment methods are accepted for CY9AFB41LBPMC-G-JNE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AFB41LBPMC-G-JNE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9AFB41LBPMC-G-JNE2?

CY9AFB41LBPMC-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9AFB41LBPMC-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9AFB41LBPMC-G-JNE2?

For technical support, including CY9AFB41LBPMC-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AFB41LBPMC-G-JNE2 requirements.

6.How does Aetrix verify that CY9AFB41LBPMC-G-JNE2 is sourced from the original manufacturer or authorized distributors?

All CY9AFB41LBPMC-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AFB41LBPMC-G-JNE2 meets industry standards.

7.What is the process for return or replacement of CY9AFB41LBPMC-G-JNE2?

All CY9AFB41LBPMC-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AFB41LBPMC-G-JNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9AFB41LBPMC-G-JNE2 part is unused and in its original packaging.

Return procedure for CY9AFB41LBPMC-G-JNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY9AFB41LBPMC-G-JNE2 Tags

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