My Inquiry
My Account
Infineon Technologies CY9AFB42LBPMC1-G-JNE2
- Part No.:
- CY9AFB42LBPMC1-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY9AFB42LBPMC1-G-JNE2.pdf
- Description:
- IC MCU 32BIT 160KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,418
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AFB42LBPMC1-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB on-chip SRAM, USB 2.0 Full-Speed device/host interface, 12-bit ADC (24 channels), and LCD controller supporting up to 40×8 segments. It operates at up to 40 MHz, supports six low-power modes, and targets embedded control in industrial HMI and metering systems.
For engineers reviewing the CY9AFB42LBPMC1-G-JNE2 datasheet, CY9AFB42LBPMC1-G-JNE2 pinout, CY9AFB42LBPMC1-G-JNE2 application, or CY9AFB42LBPMC1-G-JNE2 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, integrated USB host/device capability without external PHY, 5 V-tolerant GPIOs on selected pins, and hardware CRC acceleration for data integrity in communication stacks.
Technical Context
This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem includes two independent SRAM banks (SRAM0 for instruction/data, SRAM1 for system bus access) and dual-operation Flash enabling concurrent read/erase/write per bank.
The peripheral set integrates USB 2.0 Full-Speed with built-in PLL, HDMI-CEC/remote receiver (2 channels), RTC with leap-year support, and a DMA controller with 8 channels supporting byte/half-word/word transfers across 4 GB address space - all optimized for deterministic real-time response in resource-constrained embedded applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 r2p1, 40 MHz max operation - enables deterministic interrupt latency and RTOS compatibility. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports background firmware update without halting execution. |
| SRAM | 32 KB total: 16 KB SRAM0 (I/D bus), 16 KB SRAM1 (system bus) - isolates core data paths from peripheral DMA traffic. |
| USB Interface | Full-Speed device/host with built-in PLL - eliminates need for external clock generator or PHY in USB-enabled designs. |
| ADC | Two 12-bit SAR units, 24-channel input, 2.0 μs conversion @ 2.7–3.6 V - suitable for sensor acquisition in industrial monitoring. |
| Low-Power Modes | Six modes including Deep Standby RTC/Stop with RAM retention options - extends battery life in portable or energy-harvested devices. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - standard surface-mount footprint compatible with automated assembly. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual VCC domains (core/analog) with dedicated VSS returns - reduces noise coupling between digital and analog sections. |
| XTAL1 / XTAL2 | Main crystal oscillator input/output | Supports 4–48 MHz external crystal - provides precise timing source for CPU, USB, and peripherals. |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential pair | Integrated transceiver with internal termination - requires no external resistors or ESD protection diodes. |
| SEG0–SEG39 / COM0–COM7 | LCD segment/common drivers | Direct drive for 40×8 segment LCD with internal bias resistor network - eliminates external LCD bias components. |
| P00–P57 | General-purpose I/O with port relocate | Up to 83 GPIOs; 5 V-tolerant on designated pins - enables direct interfacing with legacy 5 V logic or sensors. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables over-the-air firmware updates with zero downtime by erasing/writing one bank while executing from the other. |
| USB device/host with integrated PLL | Reduces BOM count by eliminating external clock synthesizer and simplifies layout with single differential pair routing. |
| Hardware CRC accelerator (CRC16/CRC32) | Offloads integrity checking from CPU during UART/USB packet reception or Flash data verification, improving throughput. |
| Port relocate function | Allows dynamic assignment of peripheral functions (UART, I²C, CSIO) to alternate GPIO pins - increases PCB routing flexibility. |
| HDMI-CEC and remote control receiver | Integrates protocol-specific logic for consumer electronics control, reducing firmware complexity for IR/CEC-based UIs. |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
Use Scenario: Local operator interface on factory floor equipment with segmented LCD display and button inputs. IC Role / Device Role / Timing Role: Main controller managing LCD refresh, keypad scanning, USB configuration download, and real-time logging via RTC. Use Value: Dual-bank Flash allows field firmware upgrades without interrupting panel operation; integrated LCDC drives 40×8 segments without external driver IC. | Use Scenario: Electricity meter with tamper detection, pulse counting, and local data export via USB stick. IC Role / Device Role / Timing Role: System-on-chip handling metrology ADC sampling, time-of-use billing via RTC, and USB mass storage class file transfer. Use Value: Two independent 12-bit ADCs acquire voltage/current simultaneously; USB host mode reads meter data directly from FAT32-formatted USB drives. |
| Remote-Controlled Appliance | Building Automation Sensor Node |
Use Scenario: HVAC controller receiving IR remote commands and driving relay outputs based on temperature setpoints. IC Role / Device Role / Timing Role: Embedded controller executing closed-loop temperature regulation while decoding NEC/RC5 IR protocols and HDMI-CEC commands. Use Value: Dedicated HDMI-CEC/remote receiver hardware processes IR pulses and CEC frames in hardware, freeing CPU cycles for control algorithms. | Use Scenario: Wireless-ready environmental sensor node collecting temperature/humidity data and entering ultra-low-power sleep between transmissions. IC Role / Device Role / Timing Role: Low-power host processor acquiring sensor data via ADC, timestamping with RTC, and preparing packets for RF subsystem wake-up. Use Value: Deep Standby RTC mode retains RAM and RTC state on <1 μA current - extends battery life to multi-year operation with periodic wake-ups. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VET6 | ARM Cortex-M3, 512 KB Flash, 64 KB SRAM, no integrated USB PHY, no LCDC, no HDMI-CEC | Requires external USB transceiver and LCD driver; better suited for general-purpose control without display or consumer IR interfaces | Select when higher Flash/SRAM capacity is needed and display/IR features are unnecessary. |
| RA4M1 (R7FA4M1AB3CFM) | ARM Cortex-M4F, 256 KB Flash, 32 KB SRAM, USB FS device only, no host mode, no LCDC, no HDMI-CEC | Lacks USB host and LCD controller; adds FPU and TrustZone but omits key FM3-family peripherals | Choose for floating-point math-intensive tasks where USB host and LCD are handled externally. |
Compared with STM32F103VET6 and RA4M1, CY9AFB42LBPMC1-G-JNE2 uniquely integrates USB host/device, LCD controller, and HDMI-CEC/remote receiver in a single chip - reducing component count and firmware overhead for HMI and consumer appliance designs.
Availability
CY9AFB42LBPMC1-G-JNE2 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, remote-controlled appliances, and building automation sensor nodes requiring stable component supply and long-term lifecycle support.
Supply support for CY9AFB42LBPMC1-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D infrastructure.
This part belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power embedded control applications requiring integrated human-machine interface peripherals like LCD drivers and USB connectivity.
FAQ
Does CY9AFB42LBPMC1-G-JNE2 support USB host mode with mass storage class?
Yes. The integrated USB 2.0 Full-Speed host controller supports Bulk-transfer and automatically handles IN/OUT token handshake packets. With appropriate firmware, it can enumerate and communicate with FAT32-formatted USB flash drives using standard mass storage class protocols.
What is the maximum operating voltage when using the LCD controller?
The LCDC requires VCC between 2.2 V and 3.6 V. Operation below 2.2 V disables LCD drive capability, though core logic remains functional. The internal dividing resistor network and bias voltage pins (VV0–VV4) are calibrated for this range to ensure stable contrast and segment drive strength.
Can the dual-bank Flash be used for secure boot validation?
Yes. The security function for code protection allows locking Flash banks individually. Boot code can reside in the lower bank (16 KB) and validate firmware images in the upper bank before execution, enabling robust secure boot with rollback protection via bank swapping.
Is hardware flow control supported on all UART channels?
No. Hardware flow control (CTS/RTS) is supported only on UART channel 4, as confirmed in the peripheral manual. Channels 0–3 and 5–7 lack RTS/CTS signal mapping; software handshaking or buffer management must be used for those interfaces.
CY9AFB42LBPMC1-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- FM3 MB9AB40NB
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, UART/USART, USB
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 160KB (160K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AFB42LBPMC1-G-JNE2 FAQ
1.How can I place an order for CY9AFB42LBPMC1-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AFB42LBPMC1-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AFB42LBPMC1-G-JNE2 reliable?
The price and inventory of CY9AFB42LBPMC1-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AFB42LBPMC1-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9AFB42LBPMC1-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AFB42LBPMC1-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AFB42LBPMC1-G-JNE2?
CY9AFB42LBPMC1-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AFB42LBPMC1-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AFB42LBPMC1-G-JNE2?
For technical support, including CY9AFB42LBPMC1-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AFB42LBPMC1-G-JNE2 requirements.
6.How does Aetrix verify that CY9AFB42LBPMC1-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AFB42LBPMC1-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AFB42LBPMC1-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9AFB42LBPMC1-G-JNE2?
All CY9AFB42LBPMC1-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AFB42LBPMC1-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AFB42LBPMC1-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9AFB42LBPMC1-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AFB42LBPMC1-G-JNE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
