Infineon Technologies CY9AFB42MBPMC-G-JNE2
- Part No.:
- CY9AFB42MBPMC-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY9AFB42MBPMC-G-JNE2.pdf
- Description:
- IC MCU 32BIT 160KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,090
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AFB42MBPMC-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM, USB 2.0 Full-Speed device/host interface, 12-bit ADC (24 channels), and LCD controller (40×8 SEG/COM). It operates up to 40 MHz, supports six low-power modes, and targets embedded control in industrial HMI, metering, and appliance interfaces.
For engineers reviewing the CY9AFB42MBPMC-G-JNE2 datasheet, CY9AFB42MBPMC-G-JNE2 pinout, CY9AFB42MBPMC-G-JNE2 application, or CY9AFB42MBPMC-G-JNE2 equivalent, key selection criteria include dual-bank Flash for safe firmware updates, integrated LCDC with internal bias resistors, USB host/device dual-role capability, and 5 V-tolerant GPIOs on selected pins.
Technical Context
This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels. Its memory subsystem includes two independent SRAM banks (SRAM0/SRAM1) connected to I-code/D-code and system buses respectively, enabling concurrent CPU and DMA access without contention.
The peripheral set integrates a 2-channel watchdog (hardware + software), Clock Supervision (CSV) monitoring external clock integrity, and CRC accelerator supporting CCITT CRC16 and IEEE-802.3 CRC32 for data integrity in communication and storage paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 r2p1, 40 MHz max operation - enables deterministic real-time control with hardware divide and Thumb-2 instruction set. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - allows background write/erase while executing code from opposite bank. |
| SRAM | 32 KB total: 16 KB SRAM0 (I/D bus), 16 KB SRAM1 (system bus) - supports parallel CPU execution and DMA transfers without bus arbitration delay. |
| USB Interface | Full-Speed device/host with built-in PLL - eliminates need for external USB clock source; supports up to 6 endpoints with double buffering. |
| ADC | Two 12-bit SAR ADCs, 2.0 μs conversion @ 2.7–3.6 V - enables high-speed sensor sampling with scan/priority modes and 16-step FIFO. |
| LCDC | 40 SEG × 8 COM, internal bias resistor network, VV0–VV4 pins - drives segment-based displays without external voltage dividers or charge pumps. |
| Power Supply | VCC = 1.65–3.6 V (2.2–3.6 V for LCDC, 3.0–3.6 V for USB) - supports wide-input industrial power rails with selective peripheral activation. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dedicated analog/digital power domains with separate decoupling requirements per datasheet Section 13.3.2. |
| XTAL1/XTAL2 | Main crystal oscillator input/output | Supports 4–48 MHz external crystals; required for USB PLL and high-precision timing. |
| OSC32IN/OSC32OUT | Sub-clock crystal input/output | Connects 32.768 kHz crystal for RTC and low-power timer functions during Stop/Deep Standby modes. |
| USB_DP/USB_DM | USB 2.0 Full-Speed differential pair | On-die termination and transceiver compliant with USB 2.0 specification; requires 27 Ω series resistors per USB-IF guidelines. |
| SEG0–SEG39, COM0–COM7 | Segment and common outputs for LCD | Direct drive of passive LCD panels; internal resistor ladder sets bias voltage (VV0–VV4) - no external components needed. |
| P00–P57 | General-purpose I/O with port relocation | Up to 83 GPIOs; 5 V tolerant on designated pins (e.g., P10–P17); peripheral function mapping configurable via register. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables over-the-air firmware updates with zero downtime: erase/write one bank while executing from the other. |
| Integrated LCDC with internal bias | Reduces BOM count by eliminating external resistor networks and charge pumps for 40×8 segment displays. |
| USB device/host dual-mode | Supports field service via USB device mode and peripheral attachment (e.g., flash drives) via host mode - no external PHY required. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU, reducing latency in communication stack and firmware validation. |
| Two independent watchdog timers | Hardware watchdog (CR oscillator-clocked) remains active in all low-power modes except Deep Standby Stop - ensures fail-safe recovery even during extended sleep. |
Applications
| Industrial HMI Panels | Smart Energy Meters |
|---|---|
Use Scenario: Local operator interface on DIN-rail mounted controllers with segmented LCD display and push-button navigation. IC Role / Device Role / Timing Role: Primary MCU managing display refresh, button debouncing, real-time clock, and isolated RS-485 communication. Use Value: Integrated LCDC with internal bias and 5 V-tolerant GPIOs simplify front-panel design; dual-bank Flash enables secure field firmware upgrades. | Use Scenario: Residential electricity meter with LCD display, tamper detection, and optical/IR communication port. IC Role / Device Role / Timing Role: System controller handling metrology data acquisition (via ADC), time-stamped logging (RTC), and IR-based utility communication. Use Value: 24-channel 12-bit ADC supports multi-sensor inputs; RTC with leap-year correction ensures accurate billing intervals; low-power Stop mode extends battery life. |
| Home Appliance Control | Building Automation Sensors |
Use Scenario: Washing machine main control board requiring motor control signals, temperature sensing, and user display. IC Role / Device Role / Timing Role: Central controller coordinating PWM motor drivers, ADC-based NTC readings, and segmented LCD status display. Use Value: 16-bit PWM timers with dead-time insertion support precise motor phase control; USB device mode enables diagnostic data dump via PC. | Use Scenario: Wireless HVAC sensor node with local LCD readout, ambient light/temperature sensing, and wired RS-485 backhaul. IC Role / Device Role / Timing Role: Edge node processor aggregating sensor data, driving local display, and formatting Modbus packets for gateway transmission. Use Value: Dual watchdogs ensure reliability in unattended deployments; six low-power modes (including Deep Standby RTC) minimize energy use between measurement cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 64–128 KB Flash, no integrated LCDC or USB host, 2.0–3.6 V supply only | Lacks native segment LCD driver and USB host capability - requires external components for HMI functions | Select when cost-sensitive designs omit LCD/USB host and prioritize broad ecosystem support over integrated peripherals. |
| RA4M1 (R7FA4M1AB3CFM) | 256 KB Flash, 32 KB SRAM, USB device-only, no LCDC, 1.6–5.5 V supply | Missing USB host and LCD controller - suitable for USB-connected sensors but not self-contained HMI devices | Choose for low-power sensor nodes needing USB device connectivity and robust safety certification (IEC 61508), not display-driven control. |
Compared with STM32F103VCT6 and RA4M1, CY9AFB42MBPMC-G-JNE2 uniquely integrates LCDC with internal bias, USB device/host dual-mode, and dual-bank Flash - making it optimal for cost-constrained, display-centric embedded controllers requiring field-upgradable firmware and minimal external components.
Availability
CY9AFB42MBPMC-G-JNE2 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, home appliance control, and building automation sensors requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for CY9AFB42MBPMC-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded controllers, with global manufacturing and R&D infrastructure.
This part belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power industrial and consumer HMI applications requiring integrated LCD, USB, and robust real-time control capabilities.
FAQ
What power supply configurations are required for USB and LCDC operation?
CY9AFB42MBPMC-G-JNE2 requires VCC = 3.0–3.6 V when USB functionality is enabled, and VCC = 2.2–3.6 V when LCDC is active. These ranges are non-overlapping at the lower end - designs using both peripherals simultaneously must maintain VCC ≥ 3.0 V. Decoupling capacitors per datasheet Section 13.3.2 are mandatory for stable operation.
Does this MCU support USB host mode with standard mass-storage class devices?
Yes - the integrated USB host controller supports Bulk-transfer, Interrupt-transfer, and Isochronous-transfer protocols and can enumerate standard USB mass-storage devices (e.g., flash drives) without external PHY. Maximum packet length is 256 bytes, and automatic IN/OUT token handshake is handled in hardware.
How does the dual-bank Flash architecture enable safe firmware updates?
The 256 KB Flash is split into 240 KB upper bank and 16 KB lower bank. Code executes from one bank while the other is erased/written, preventing execution interruption. The SWAP bit in the Flash control register toggles active bank post-update, ensuring atomic transition with verified checksum before reboot.
Which pins support 5 V tolerance and how is it implemented?
Pins P10–P17 (Port 1, bits 0–7) are 5 V tolerant. This is achieved via internal clamping diodes and reinforced oxide gate structures - no external resistors needed. Tolerance applies only when VCC ≥ 2.7 V; operation outside recommended conditions may degrade reliability per datasheet Absolute Maximum Ratings.
CY9AFB42MBPMC-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM3 MB9AB40NB
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, UART/USART, USB
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 160KB (160K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 17x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AFB42MBPMC-G-JNE2 FAQ
1.How can I place an order for CY9AFB42MBPMC-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AFB42MBPMC-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AFB42MBPMC-G-JNE2 reliable?
The price and inventory of CY9AFB42MBPMC-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AFB42MBPMC-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9AFB42MBPMC-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AFB42MBPMC-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AFB42MBPMC-G-JNE2?
CY9AFB42MBPMC-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AFB42MBPMC-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AFB42MBPMC-G-JNE2?
For technical support, including CY9AFB42MBPMC-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AFB42MBPMC-G-JNE2 requirements.
6.How does Aetrix verify that CY9AFB42MBPMC-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AFB42MBPMC-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AFB42MBPMC-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9AFB42MBPMC-G-JNE2?
All CY9AFB42MBPMC-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AFB42MBPMC-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AFB42MBPMC-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9AFB42MBPMC-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AFB42MBPMC-G-JNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

