My Inquiry
My Account
Infineon Technologies CY9AFB44MBBGL-GK9E1
- Part No.:
- CY9AFB44MBBGL-GK9E1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 96-LFBGA
- Datasheet:
-
CY9AFB44MBBGL-GK9E1.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 96FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,517
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AFB44MBBGL-GK9E1 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM, USB 2.0 Full-Speed device/host interface, 24-channel 12-bit ADC, and LCD controller supporting up to 40×8 segments. It operates at up to 40 MHz, supports six low-power modes, and targets embedded control in industrial HMI and metering systems.
For engineers reviewing the CY9AFB44MBBGL-GK9E1 datasheet, CY9AFB44MBBGL-GK9E1 pinout, CY9AFB44MBBGL-GK9E1 application, or CY9AFB44MBBGL-GK9E1 equivalent, key selection considerations include dual-bank Flash execution capability, USB host/device coexistence, 5 V-tolerant GPIO allocation, RTC with leap-year support, and hardware CRC acceleration for data integrity in field-deployed firmware updates.
Technical Context
This MCU implements an ARM Cortex-M3 r2p1 core with integrated NVIC (48 peripheral interrupts + 1 NMI), SysTick timer, and dual-bus SRAM architecture (SRAM0 on I/D-code bus, SRAM1 on system bus). It uses a multi-source clock system including 4–48 MHz main oscillator, 32.768 kHz sub-clock, and built-in CR oscillators supervised by Clock Super Visor (CSV) for fail-safe timing.
The peripheral set includes eight base timers (PWM/PPG/reload/PWC), eight-channel DMA with burst/block/demand transfer modes, HDMI-CEC/remote receiver (2 channels), and a dedicated LCDC with internal bias resistors and blinking control - all accessible via relocatable GPIO pins with per-pin pull-up and 5 V tolerance on designated lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 r2p1, 40 MHz max operation - enables deterministic real-time task scheduling with 24-bit SysTick for OS kernel timing. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - allows background firmware update without halting application execution. |
| SRAM | 32 KB total (16 KB SRAM0 + 16 KB SRAM1), split-bus architecture - isolates instruction/data fetches from system DMA traffic to prevent bus contention. |
| ADC | 24-channel, 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - supports high-speed sensor sampling with FIFO-based scan mode (16-step buffer). |
| USB Interface | Full-Speed device/host with built-in PLL, 6 endpoints (EP0–EP5), double-buffered EP1–EP5 - enables simultaneous HID-class peripheral and host-side flash programming over single USB PHY. |
| Low-Power Modes | Six modes: Sleep, Timer, RTC, Stop, Deep Standby RTC, Deep Standby Stop - provides selectable RAM retention and wake-up sources including RTC alarm and external interrupt. |
| Operating Voltage | 1.65–3.6 V (2.2–3.6 V with LCDC active; 3.0–3.6 V with USB active) - accommodates battery-backed and wide-input industrial power rails. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual VCC domains (core/analog) with separate VSS returns - enables noise isolation between digital logic and ADC/LCDC analog sections. |
| XTAL / EXTAL | Main clock input/output | 4–48 MHz crystal interface with internal load capacitors - eliminates need for external caps in most designs; supports bypass mode for external clock source. |
| OSC32K / OSC32KIN | Sub-clock input | 32.768 kHz crystal connection for RTC and low-power wake-up - retains timekeeping during Deep Standby modes with sub-μA current draw. |
| USB_DP / USB_DM | USB differential pair | Full-Speed USB 2.0 physical layer with integrated termination and slew-rate control - meets USB-IF electrical compliance without external resistors or ESD protection diodes. |
| SEG0–SEG39 / COM0–COM7 | LCDC segment/com output | Direct drive for 40×8 segment LCD with internal voltage divider and bias generation - eliminates external LCD bias circuitry and reduces BOM count. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables Over-The-Air (OTA) firmware updates with zero downtime: one bank executes while the other is erased/written. |
| Port relocate function | Allows dynamic remapping of UART, I²C, CSIO, and timer outputs to any GPIO group - simplifies PCB layout and avoids signal congestion on fixed pinouts. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU - reduces firmware validation latency by >90% vs software-only implementation. |
| HDMI-CEC/Remote receiver | Integrated protocol engine with automatic ACK, arbitration loss detection, and 4-byte repeat-code buffer - eliminates need for external CEC transceiver IC in smart appliance remote control subsystems. |
| Clock Super Visor (CSV) | Monitors external main clock stability using internal CR oscillator as reference - triggers reset on frequency drift or stop condition, ensuring fail-safe operation in safety-critical control loops. |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
Use Scenario: Local operator interface on motor drives or PLC add-on modules with segmented LCD display and push-button navigation. IC Role / Device Role / Timing Role: Main controller executing real-time motor control loop while driving 40×8 LCD and managing USB-CDC virtual COM port for configuration. Use Value: Dual-bank Flash enables field firmware upgrades without removing the panel; built-in LCDC bias eliminates external resistor network, reducing component count by 6+ parts. | Use Scenario: Residential electricity meter with tamper detection, tariff switching, and local IR/USB data export. IC Role / Device Role / Timing Role: System-on-chip handling metrology ADC sampling, RTC-based billing intervals, secure firmware storage, and USB/IR communication stack. Use Value: 24-channel 12-bit ADC supports multi-phase voltage/current sensing; RTC with leap-year correction ensures accurate monthly billing across calendar boundaries. |
| Building Automation Controller | Medical Patient Monitor Front-End |
Use Scenario: DIN-rail mounted HVAC controller interfacing with temperature/humidity sensors, relays, and Modbus RTU over UART. IC Role / Device Role / Timing Role: Central processing unit running FreeRTOS, managing 8-channel DMA for sensor polling, and servicing UART/CSIO peripherals with relocatable pin mapping. Use Value: Six low-power modes allow deep sleep between sensor reads (<5 μA in RTC mode); hardware flow control on UART ch.4 supports reliable RS-485 Modbus communication. | Use Scenario: Portable vital signs monitor with ECG, SpO₂, and temperature inputs, segmented display, and USB mass storage for waveform export. IC Role / Device Role / Timing Role: Real-time acquisition controller synchronizing ADC conversions, buffering data in SRAM1, and formatting USB MSC packets via dual-bank Flash-resident firmware. Use Value: 2.0 μs ADC conversion time enables 500 kSPS aggregate sampling; USB host mode allows direct SD card read/write without external bridge IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VET6 | ARM Cortex-M3, 512 KB Flash, 64 KB SRAM, no native USB host, no LCDC, no HDMI-CEC | Lacks integrated LCD driver and USB host - requires external display controller and USB hub IC for similar functionality | Select when USB host and segmented LCD are not required; higher Flash/SRAM margin available |
| RA4M1 (R7FA4M1AB3CFP) | ARM Cortex-M4F, 256 KB Flash, 32 KB SRAM, USB device only, no LCDC, no CEC | Missing USB host and LCD controller - cannot replace CY9AFB44MBBGL-GK9E1 in HMI or dual-role USB applications | Choose for floating-point math-intensive tasks where USB host and LCD are handled externally |
Compared with STM32F103VET6 and RA4M1, CY9AFB44MBBGL-GK9E1 uniquely integrates USB device/host, 40×8 LCDC, and HDMI-CEC in a single 100-pin package - eliminating three external ICs in HMI-centric designs while maintaining identical Flash/SRAM capacity and low-power profile.
Availability
CY9AFB44MBBGL-GK9E1 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, building automation controllers, and portable medical front-ends requiring stable component supply across multi-year production cycles.
Supply support for CY9AFB44MBBGL-GK9E1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D infrastructure.
The CY9AB40NB series - including CY9AFB44MBBGL-GK9E1 - was designed specifically for cost-sensitive, low-power embedded control applications requiring integrated human-machine interface peripherals and field-upgradable firmware.
FAQ
Does CY9AFB44MBBGL-GK9E1 support USB host mode with full-speed peripherals?
Yes. The device integrates a USB 2.0 Full-Speed host controller supporting bulk, interrupt, and isochronous transfers, automatic IN/OUT token handshake, and 256-byte packet length. It detects device connect/disconnect events and supports wake-up from low-power modes via USB activity.
What is the maximum resolution and refresh capability of the integrated LCD controller?
The LCDC supports up to 40 segment × 8 common outputs with programmable bias (VV4–VV0), internal dividing resistors, and blinking control. It drives static or multiplexed LCDs directly without external bias generation, with configurable frame rate and duty cycle per COM line.
Can the dual-bank Flash be used for secure firmware updates without application interruption?
Yes. The dual-bank architecture allows concurrent execution from one bank while erasing/writing the other. Bootloader code can validate new firmware in the inactive bank before atomic bank swap, ensuring zero-downtime field updates with rollback capability.
Is the 5 V-tolerant GPIO feature available on all pins or only specific ones?
Only designated pins are 5 V tolerant - specifically P00–P07, P10–P17, P20–P27, P30–P37, P40–P47, P50–P57, P60–P67, P70–P77, P80–P87, and P90–P97 as defined in the Pin Assignment table (Page 8 of datasheet 002-05631 Rev. *D). Other pins are strictly 3.6 V max.
CY9AFB44MBBGL-GK9E1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 96-LFBGA
- Series:
- FM3 MB9AB40NB
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, UART/USART, USB
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 17x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AFB44MBBGL-GK9E1 FAQ
1.How can I place an order for CY9AFB44MBBGL-GK9E1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AFB44MBBGL-GK9E1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AFB44MBBGL-GK9E1 reliable?
The price and inventory of CY9AFB44MBBGL-GK9E1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AFB44MBBGL-GK9E1 is usually 5 days.
3.What payment methods are accepted for CY9AFB44MBBGL-GK9E1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AFB44MBBGL-GK9E1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AFB44MBBGL-GK9E1?
CY9AFB44MBBGL-GK9E1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AFB44MBBGL-GK9E1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AFB44MBBGL-GK9E1?
For technical support, including CY9AFB44MBBGL-GK9E1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AFB44MBBGL-GK9E1 requirements.
6.How does Aetrix verify that CY9AFB44MBBGL-GK9E1 is sourced from the original manufacturer or authorized distributors?
All CY9AFB44MBBGL-GK9E1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AFB44MBBGL-GK9E1 meets industry standards.
7.What is the process for return or replacement of CY9AFB44MBBGL-GK9E1?
All CY9AFB44MBBGL-GK9E1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AFB44MBBGL-GK9E1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AFB44MBBGL-GK9E1 part is unused and in its original packaging.
Return procedure for CY9AFB44MBBGL-GK9E1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AFB44MBBGL-GK9E1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
