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Infineon Technologies CY9AFB44NAPMC-G-MNE2
- Part No.:
- CY9AFB44NAPMC-G-MNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY9AFB44NAPMC-G-MNE2.pdf
- Description:
- IC MCU 32BIT 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:900
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Product details
Overview
CY9AFB44NAPMC-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB on-chip SRAM (16 KB SRAM0 + 16 KB SRAM1), USB 2.0 Full-Speed device/host interface, and integrated LCD controller supporting up to 40 SEG × 8 COM. It operates at up to 40 MHz, supports six low-power modes including Deep Standby RTC, and targets embedded control in industrial HMI and portable instrumentation.
For engineers reviewing the CY9AFB44NAPMC-G-MNE2 datasheet, CY9AFB44NAPMC-G-MNE2 pinout, CY9AFB44NAPMC-G-MNE2 application, or CY9AFB44NAPMC-G-MNE2 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, USB device/host dual-role capability, 24-channel 12-bit ADC with 2.0 µs conversion time, and 83 GPIOs with port relocation in 100-pin LQFP package.
Technical Context
This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent CPU and DMA access without contention.
The peripheral set includes an 8-channel DMA controller with burst/block/demand transfer modes, a multi-function serial interface supporting UART/CSIO/I²C across eight channels, and dual 12-bit ADC units with FIFO-based scanning and priority conversion - all operating within 1.65 V–3.6 V supply range and qualified for industrial temperature (-40°C to +85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 r2p1, up to 40 MHz - enables deterministic real-time execution with Thumb-2 instruction set and hardware divide. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - allows background write/erase of one bank while executing from the other. |
| SRAM | 32 KB total (16 KB SRAM0 on I/D bus + 16 KB SRAM1 on system bus) - supports concurrent CPU fetch and DMA transfers without bus arbitration delay. |
| USB Interface | Full-Speed device/host dual-mode with built-in PLL - eliminates external clock generator; supports up to 6 endpoints with double buffering and automatic token handshake. |
| ADC | Two 12-bit SAR units, 2.0 µs conversion @ 2.7–3.6 V, 24-channel input - delivers high-speed analog sensing with scan/priority modes and 16-step FIFO for burst acquisition. |
| Low-Power Modes | Six modes including Deep Standby RTC with RAM retention - enables sub-µA sleep current while maintaining real-time clock and wake-up capability via external interrupt or timer. |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) - provides 83 GPIOs with 5 V-tolerant capability on selected pins and full peripheral pinout flexibility via port relocation. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3. Pin assignment follows CY9AB40NB Series Pin Assignment (Document No. 002-05631 Rev. *D, Pages 8–14), with dedicated VCC/VSS pairs, dual crystal inputs (XIN/XOUT, XIN2/XOUT2), USB D+/D−, LCDC SEG/COM drivers, and configurable multifunction I/Os.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply and ground | Dedicated power domains per functional block; decoupling required per datasheet layout guidelines to ensure noise immunity in mixed-signal operation. |
| XIN / XOUT | Main system clock oscillator input/output | Supports 4–48 MHz external crystal; drives ARM core, peripherals, and USB PLL; requires load capacitors per crystal spec. |
| XIN2 / XOUT2 | Sub-clock oscillator input/output | 32.768 kHz crystal connection for RTC and low-power timer operation; remains active in Stop and Deep Standby modes. |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential data lines | On-die termination and transceiver; require 27 Ω series resistors and proper PCB length matching for EMI compliance. |
| SEG0–SEG39 / COM0–COM7 | LCD segment and common drivers | Integrated analog drivers support static and multiplexed LCDs up to 40×8; internal bias resistor network eliminates external components. |
| P00–P57, P60–P66, P70–P76 | Multi-function GPIO with port relocation | 83 total pins; each configurable as digital I/O, peripheral function (UART, I²C, etc.), or analog input; 5 V-tolerant on designated pins only. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables over-the-air firmware updates without halting application execution - critical for field-deployed industrial controllers. |
| USB device/host dual-mode | Eliminates need for external USB PHY or host controller IC - reduces BOM count and board space in diagnostic tools and configuration interfaces. |
| Port relocation function | Allows dynamic remapping of peripheral functions (e.g., UART0, I²C1) to alternate GPIO sets - simplifies PCB layout and avoids signal congestion in dense designs. |
| 24-channel 12-bit ADC with FIFO | Supports simultaneous sampling of multiple sensors (e.g., temperature, pressure, voltage) with hardware-triggered scan sequences and buffer overflow protection. |
| Six low-power consumption modes | Deep Standby RTC mode draws <1.5 µA while retaining RTC time, RAM contents, and wake-up capability - extends battery life in portable HMIs beyond 5 years. |
Applications
| Industrial HMI Panel | Portable Diagnostic Tool |
|---|---|
Use Scenario: Touch-enabled front-panel display with keypad input and sensor monitoring in factory automation cabinets. IC Role / Device Role / Timing Role: Main system controller managing LCD refresh, button debouncing, ADC sampling, and USB-based configuration upload. Use Value: Integrated LCDC driver and 40×8 segment support eliminate external display controller; dual-bank Flash enables safe field firmware updates without downtime. | Use Scenario: Handheld test instrument measuring voltage, current, and temperature, with PC connectivity for data logging. IC Role / Device Role / Timing Role: Central data acquisition and communication hub performing real-time ADC reads, USB mass storage emulation, and battery-aware power management. Use Value: 24-channel 12-bit ADC with 2.0 µs conversion and 16-step FIFO captures burst sensor data; USB device/host dual-mode allows both PC sync and peripheral attachment (e.g., flash drive). |
| Smart Energy Meter UI | Building Automation Node |
Use Scenario: Local display and control interface on electricity/water meters with tamper detection and secure firmware updates. IC Role / Device Role / Timing Role: Secure embedded controller handling LCD output, tamper switch polling, cryptographic CRC acceleration, and encrypted OTA update verification. Use Value: Built-in CRC32 accelerator offloads integrity checks from CPU; dual-bank Flash ensures atomic firmware swap even during power interruption. | Use Scenario: DIN-rail mounted HVAC controller with temperature/humidity sensing, relay actuation, and Modbus RTU over UART. IC Role / Device Role / Timing Role: Real-time environmental controller running closed-loop PID algorithms, driving relays via GPIO, and communicating via RS-485 (via UART + transceiver). Use Value: Eight UART/CSIO/I²C serial channels allow concurrent Modbus, sensor interface (I²C), and debug console; 83 GPIOs support direct relay and LED control without expanders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VET6 | ARM Cortex-M3, 512 KB Flash, 64 KB SRAM, no integrated LCDC or USB host; requires external PHY for USB device. | Lacks native LCD driver and USB host - unsuitable for standalone HMI with display and peripheral attachment. | Select when USB host or integrated LCDC are unnecessary and larger Flash/SRAM are prioritized. |
| RA4M1 (R7FA4M1AB3CFM) | ARM Cortex-M4F, 256 KB Flash, 32 KB SRAM, no USB host, no LCDC; includes TrustZone and higher DSP performance. | Targets security-critical IoT edge nodes rather than display-centric control; lacks display and dual-role USB. | Prefer for applications requiring cryptographic acceleration or floating-point math, not display or USB peripheral hosting. |
Compared with STM32F103VET6 and RA4M1, CY9AFB44NAPMC-G-MNE2 uniquely integrates LCD controller, USB device/host, and dual-bank Flash in a single 100-pin LQFP - reducing component count and PCB area for compact HMI and portable instrumentation where display and field-upgradable firmware are mandatory.
Availability
CY9AFB44NAPMC-G-MNE2 is available at Aetrix Electronics and suitable for industrial HMI panels, portable diagnostic tools, smart energy meter UIs, and building automation nodes requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for CY9AFB44NAPMC-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and industrial control solutions.
CY9AFB44NAPMC-G-MNE2 belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power embedded control applications requiring integrated analog peripherals, human-machine interface support, and robust field-upgrade capability.
FAQ
What is the maximum operating frequency and supported voltage range?
The CY9AFB44NAPMC-G-MNE2 operates at up to 40 MHz with a supply voltage range of 1.65 V to 3.6 V. When USB functionality is used, VCC must be maintained between 3.0 V and 3.6 V; for LCD operation, the valid range is 2.2 V to 3.6 V. These ranges are specified in the Recommended Operating Conditions section (Page 67) of datasheet 002-05631 Rev. *D.
Does this MCU support USB host mode without external components?
Yes - the CY9AFB44NAPMC-G-MNE2 includes a fully integrated USB 2.0 Full-Speed host controller with built-in PLL, supporting bulk/interrupt/isochronous transfers and automatic IN/OUT token handshake. No external PHY or clock generator is required, though external 27 Ω series resistors on D+/D− are mandatory per USB specification.
How many ADC channels are available and what is their conversion speed?
This MCU integrates two independent 12-bit successive approximation ADC units supporting up to 24 total input channels. Each unit achieves a minimum conversion time of 2.0 µs at 2.7–3.6 V supply, with configurable scan and priority modes plus dedicated FIFO buffers (16-step for scan, 4-step for priority) as documented on Page 23 of the datasheet.
Is the device qualified for industrial temperature operation?
Yes - CY9AFB44NAPMC-G-MNE2 is rated for operation from −40°C to +85°C ambient temperature, meeting industrial-grade reliability requirements. This qualification is confirmed in the Absolute Maximum Ratings (Page 66) and Recommended Operating Conditions (Page 67) of datasheet 002-05631 Rev. *D, and applies to the full 100-pin LQFP package variant.
CY9AFB44NAPMC-G-MNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM3 MB9AB40NB
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, UART/USART, USB
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 83
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AFB44NAPMC-G-MNE2 FAQ
1.How can I place an order for CY9AFB44NAPMC-G-MNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AFB44NAPMC-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AFB44NAPMC-G-MNE2 reliable?
The price and inventory of CY9AFB44NAPMC-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AFB44NAPMC-G-MNE2 is usually 5 days.
3.What payment methods are accepted for CY9AFB44NAPMC-G-MNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AFB44NAPMC-G-MNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AFB44NAPMC-G-MNE2?
CY9AFB44NAPMC-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AFB44NAPMC-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AFB44NAPMC-G-MNE2?
For technical support, including CY9AFB44NAPMC-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AFB44NAPMC-G-MNE2 requirements.
6.How does Aetrix verify that CY9AFB44NAPMC-G-MNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AFB44NAPMC-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AFB44NAPMC-G-MNE2 meets industry standards.
7.What is the process for return or replacement of CY9AFB44NAPMC-G-MNE2?
All CY9AFB44NAPMC-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AFB44NAPMC-G-MNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AFB44NAPMC-G-MNE2 part is unused and in its original packaging.
Return procedure for CY9AFB44NAPMC-G-MNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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