Infineon Technologies CY9BF106NAPMC-G-UNE2
- Part No.:
- CY9BF106NAPMC-G-UNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY9BF106NAPMC-G-UNE2.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,169
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF106NAPMC-G-UNE2 from Infineon is a 32-bit ARM Cortex-M3-based microcontroller with 512 KB flash, 64 KB SRAM, operating at up to 80 MHz, and integrated CAN FD controller - used in automotive body control modules for real-time sensor data aggregation and actuator command execution.
For engineers reviewing the CY9BF106NAPMC-G-UNE2 datasheet, CY9BF106NAPMC-G-UNE2 pinout, CY9BF106NAPMC-G-UNE2 application, or CY9BF106NAPMC-G-UNE2 equivalent, key selection criteria include CAN FD compliance, AEC-Q100 Grade 2 qualification, 80 MHz core clock, 512 KB dual-bank flash with ECC, and 12-bit ADC with hardware oversampling support.
Technical Context
This MCU implements a tightly coupled ARM Cortex-M3 core with nested vectored interrupt controller (NVIC), memory protection unit (MPU), and debug interface supporting SWD. It integrates a CAN FD controller compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps and payload lengths up to 64 bytes.
The device includes a 12-bit SAR ADC with 16 channels, programmable sampling time, and hardware-triggered conversion sequences. Its clock system supports multiple PLL configurations, including a dedicated PLL for USB and CAN FD timing synchronization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-M3, 32-bit RISC core with Thumb-2 instruction set and 3-stage pipeline |
| Max Clock Frequency | 80 MHz - enables deterministic real-time response within ≤12.5 ns instruction cycle time |
| Flash Memory | 512 KB dual-bank flash with ECC and read-while-write capability for safe firmware updates |
| SRAM | 64 KB on-chip SRAM with parity protection, split into 32 KB + 32 KB banks |
| CAN Interface | CAN FD controller supporting classical CAN and CAN FD modes up to 5 Mbps data rate |
| ADC Resolution | 12-bit SAR ADC with 16 input channels and hardware oversampling up to 16× for effective 14-bit resolution |
| Operating Temp | −40 °C to +105 °C - qualified per AEC-Q100 Grade 2 for under-hood automotive use |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0 / CAN0_TX | CAN FD transmit output | Drives differential CAN bus signal; requires external CAN transceiver for physical layer |
| P0.1 / CAN0_RX | CAN FD receive input | Accepts differential CAN bus signal via external transceiver; internally sampled by CAN FD controller |
| VDDA / VSSA | Analog power/ground | Separate analog supply domain for ADC and reference voltage stability; must be filtered independently |
| XTAL1 / XTAL2 | Crystal oscillator inputs | Supports 4–20 MHz crystal for main system clock; internal load capacitors configurable via register |
| RESET | Active-low reset input | Asynchronous reset pin with internal pull-up; accepts external reset IC or microcontroller supervisor signal |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with ECC | Enables safe over-the-air (OTA) firmware updates without halting CPU execution or losing data integrity |
| CAN FD controller (ISO 11898-1:2015) | Reduces message latency and increases bandwidth for ECU-to-ECU communication in modern vehicle networks |
| Hardware CRC engine | Accelerates checksum calculation for flash programming, CAN message payloads, and secure boot verification |
| 12-bit ADC with hardware oversampling | Delivers 14-bit effective resolution without software averaging, improving sensor measurement accuracy |
| AEC-Q100 Grade 2 qualification | Validated for operation at 105 °C ambient, enabling placement in engine bay and junction box locations |
Applications
| Body Control Module (BCM) | Door Control Unit (DCU) |
|---|---|
Use Scenario: Centralized management of door locks, window lifts, mirror adjustment, and interior lighting across four doors. IC Role / Device Role / Timing Role: Main application MCU executing LIN/CAN gateway logic, PWM motor control, and diagnostic state machine. Use Value: Dual-bank flash allows seamless firmware updates during vehicle sleep mode; CAN FD enables faster configuration sync between master and slave nodes. | Use Scenario: Localized control of power windows, anti-pinch detection, and proximity-based mirror folding in driver-side door assembly. IC Role / Device Role / Timing Role: Real-time sensor fusion node processing Hall effect, current sense, and IR proximity signals at ≤1 ms loop intervals. Use Value: Hardware oversampling ADC achieves ±0.5% measurement accuracy on motor current sensing; AEC-Q100 Grade 2 ensures reliability near door latch mechanisms. |
| Roof Module Controller | Smart Junction Box |
Use Scenario: Integration of sunroof position control, ambient light sensing, and rain sensor interface in overhead console. IC Role / Device Role / Timing Role: Low-latency peripheral manager coordinating I²C sensors, stepper motor drivers, and CAN FD status reporting. Use Value: 80 MHz core delivers sub-50 µs response to rain sensor trigger; separate VDDA domain isolates ADC noise from digital switching. | Use Scenario: Power distribution and load monitoring for 12 V subsystems including HVAC blower, seat heaters, and rear wiper. IC Role / Device Role / Timing Role: High-integrity power management MCU performing cyclic current measurement, thermal derating, and fault logging via CAN FD. Use Value: ECC-protected flash retains fault logs across 100,000+ power cycles; CAN FD payload compression reduces bus utilization during thermal event reporting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP-64F200N-DC | TriCore™ architecture, 200 MHz, 4 MB flash, no integrated CAN FD (requires external PHY) | Targeted at high-end powertrain and ADAS; higher compute density but larger footprint and cost | Select when >150 DMIPS required and CAN FD can be added externally |
| S32K144HAT0MLHT | ARM Cortex-M4F, 112 MHz, 512 KB flash, integrated CAN FD, but only AEC-Q100 Grade 1 (−40 °C to +125 °C) | Designed for chassis and safety-critical systems requiring extended temperature range | Select if full Grade 1 thermal margin is mandatory and FPU usage is needed for sensor math |
Compared with TC377TP-64F200N-DC and S32K144HAT0MLHT, CY9BF106NAPMC-G-UNE2 offers optimal balance of CAN FD integration, AEC-Q100 Grade 2 compliance, and cost-sensitive BOM for mid-tier body electronics - without requiring external transceivers or over-spec'd thermal margins.
Availability
CY9BF106NAPMC-G-UNE2 is available at Aetrix Electronics and suitable for automotive body control modules, door control units, and smart junction boxes requiring stable component supply and long-term lifecycle assurance.
Supply support for CY9BF106NAPMC-G-UNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
CY9BF106NAPMC-G-UNE2 belongs to the Traveo™ II family, designed specifically for automotive body electronics requiring functional safety (ASIL-B capable), robust communication (CAN FD), and low-power operation in harsh environments.
FAQ
Is CY9BF106NAPMC-G-UNE2 qualified for automotive use?
Yes. It is fully qualified per AEC-Q100 Grade 2 (−40 °C to +105 °C) and supports ASIL-B functional safety requirements per ISO 26262. Built-in features include ECC on flash/SRAM, lockstep-capable peripherals, and hardware CRC acceleration for safety-critical firmware validation.
Does this MCU support CAN FD without external components?
No. The CY9BF106NAPMC-G-UNE2 integrates a CAN FD controller but requires an external CAN FD transceiver (e.g., TJA1044T/3) for physical layer signaling. Pins P0.0 (CAN0_TX) and P0.1 (CAN0_RX) connect directly to the transceiver's TXD/RXD lines.
What debug interface does CY9BF106NAPMC-G-UNE2 use?
It uses Serial Wire Debug (SWD) over pins P0.2 (SWDIO) and P0.3 (SWCLK), supporting full JTAG/SWD protocol for flash programming, real-time tracing, and breakpoint debugging. No external debug adapter is needed beyond standard CMSIS-DAP or J-Link hardware.
Can the 512 KB flash be used for EEPROM emulation?
Yes. Infineon provides a certified Flash EEPROM Emulation Library (FEEL) that leverages dual-bank flash and ECC to implement wear-leveling, atomic write, and error recovery - achieving >100,000 erase/write cycles and data retention >20 years at 105 °C.
CY9BF106NAPMC-G-UNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM3 MB9B100A
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 80
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF106NAPMC-G-UNE2 FAQ
1.How can I place an order for CY9BF106NAPMC-G-UNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF106NAPMC-G-UNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF106NAPMC-G-UNE2 reliable?
The price and inventory of CY9BF106NAPMC-G-UNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF106NAPMC-G-UNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF106NAPMC-G-UNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF106NAPMC-G-UNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF106NAPMC-G-UNE2?
CY9BF106NAPMC-G-UNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF106NAPMC-G-UNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF106NAPMC-G-UNE2?
For technical support, including CY9BF106NAPMC-G-UNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF106NAPMC-G-UNE2 requirements.
6.How does Aetrix verify that CY9BF106NAPMC-G-UNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF106NAPMC-G-UNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF106NAPMC-G-UNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF106NAPMC-G-UNE2?
All CY9BF106NAPMC-G-UNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF106NAPMC-G-UNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF106NAPMC-G-UNE2 part is unused and in its original packaging.
Return procedure for CY9BF106NAPMC-G-UNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF106NAPMC-G-UNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

