My Inquiry
My Account
Infineon Technologies CY9BF121KPMC-G-MNE2
- Part No.:
- CY9BF121KPMC-G-MNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
CY9BF121KPMC-G-MNE2.pdf
- Description:
- IC MCU 32BIT 96KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF121KPMC-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), 72 MHz max CPU frequency, and integrated peripherals including UART, I²C, LIN, CSIO, 12-bit ADC (26 channels), 10-bit DAC (2 channels), and RTC. It targets low-power embedded motor control and industrial sensing applications.
For engineers reviewing the CY9BF121KPMC-G-MNE2 datasheet, CY9BF121KPMC-G-MNE2 pinout, CY9BF121KPMC-G-MNE2 application, or CY9BF121KPMC-G-MNE2 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, 5 V-tolerant GPIOs on selected pins, hardware CRC acceleration (CRC16/CRC32), six low-power modes (including Deep Standby RTC), and LIN 2.1 compliance for automotive body electronics.
Technical Context
This MCU implements an Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features dual-operation Flash enabling concurrent read/erase/write across upper (240 KB) and lower (16 KB main + 32 KB work) banks, and split SRAM architecture (SRAM0 on I/D buses, SRAM1 on system bus) to reduce bus contention.
The peripheral set includes eight-channel DMA with burst/block/demand transfer modes, quadrature position/revolution counters (QPRC) with 16-bit position/revolution registers and configurable AIN/BIN/ZIN edge detection, and multi-function timers supporting PWM, PPG, input capture, and A/D activation - all optimized for real-time motor control loop execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, up to 72 MHz - enables deterministic real-time execution with <100 ns interrupt latency. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower main + 32 KB lower work) - supports background firmware update without halting application code. |
| SRAM | 32 KB total (16 KB SRAM0 + 16 KB SRAM1), split-bus architecture - isolates instruction/data traffic from system peripherals to prevent bottlenecks. |
| ADC | 12-bit SAR, 26 channels, 0.8 μs conversion @ 5 V - delivers high-speed analog acquisition for closed-loop motor current/voltage sensing. |
| LIN Interface | LIN 2.1 compliant, master/slave mode, programmable break field (13–16 bit) and delimiter (1–4 bit) - meets automotive sub-system communication requirements. |
| Low-Power Modes | Six modes including Deep Standby RTC with RAM retention - extends battery life in always-on sensor nodes while preserving timekeeping and critical state. |
| Clock Sources | Five options: 4–48 MHz external crystal, 32.768 kHz sub-clock, 4 MHz/100 kHz internal CR oscillators, and Main PLL - enables robust clock supervision and fail-safe timing fallback. |
Pinout & Package
Package: 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual VCC pins (Pins 1, 79) and multiple VSS (Pins 2, 39, 40, 78) ensure stable core/peripheral rail decoupling and noise immunity. |
| XTAL / EXTAL | Main oscillator input/output | Drives 4–48 MHz crystal; enables precise timing for USB, motor control, and communication interfaces. |
| OSC32 / OSC32B | Sub-clock oscillator input/output | Connects 32.768 kHz crystal for RTC and low-power wake-up timer operation independent of main clock domain. |
| PA0–PA15, PB0–PB15, etc. | Multi-function GPIO | 65 total high-speed I/Os with port relocate function - allows flexible PCB routing and peripheral remapping without hardware change. |
| AD0–AD25 | Analog input channels | 26 dedicated ADC inputs mapped across ports; some share pins with digital functions - supports simultaneous sampling of motor phase currents and temperature sensors. |
| DA0 / DA1 | Analog output channels | Two 10-bit R-2R DAC outputs - generate reference voltages or analog control signals for actuator drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables Over-The-Air (OTA) firmware updates with zero downtime: one bank executes while the other is erased/written. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU - reduces data integrity check latency by >90% vs software implementation. |
| Quadrature Position Counter (QPRC) | Configurable 16-bit position/revolution counters with AIN/BIN/ZIN edge detection - directly interfaces with incremental encoders for precise motor shaft position tracking. |
| Clock Supervision (CSV) | Monitors external clock stability using internal CR oscillators - triggers reset/interrupt on frequency deviation or stoppage, ensuring fail-safe timing behavior. |
| 5 V-tolerant I/O pins | Selected GPIOs tolerate 5 V logic even when VCC = 2.7–5.5 V - simplifies interface with legacy 5 V sensors, transceivers, and displays without level shifters. |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Brushless DC (BLDC) motor commutation in HVAC blowers and power tools. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms via PWM timers, ADC-triggered current sampling, and QPRC-based rotor position feedback. Use Value: Achieves <1 μs interrupt response and synchronized ADC/PWM timing - critical for torque ripple reduction and efficiency optimization. | Use Scenario: Door module control with window lift, mirror adjustment, and interior lighting. IC Role / Device Role / Timing Role: LIN 2.1 master node managing slave ECUs, coordinating power sequencing, and monitoring switch inputs/sensor status. Use Value: Built-in LIN protocol engine and 32.768 kHz RTC enable precise sleep/wake cycles and timestamped event logging for diagnostics. |
| Smart Sensor Node | Energy Monitoring System |
Use Scenario: Battery-powered environmental sensor hub aggregating temperature, humidity, and motion data. IC Role / Device Role / Timing Role: Low-power coordinator collecting analog/digital sensor data, performing local preprocessing, and transmitting via UART/I²C to gateway. Use Value: Deep Standby RTC mode draws <1.2 μA while maintaining time and RAM state - extends 2000 mAh battery life to >5 years. | Use Scenario: DIN-rail mounted electricity meter with voltage/current measurement and tamper detection. IC Role / Device Role / Timing Role: High-accuracy 12-bit ADC sampling AC waveforms at 10 kSPS, CRC-protected data storage, and secure firmware updates. Use Value: Dual-bank Flash and hardware CRC32 ensure certified firmware integrity and zero-interruption field upgrades per IEC 62056 standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit Arm Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or LIN support. | Lacks native LIN 2.1 and hardware CRC - requires software emulation and external components for automotive body networks. | Prefer for cost-sensitive general-purpose control where LIN is not required and OTA updates are handled externally. |
| RA4M1 (R7FA4M1AB3CFM) | 48 MHz Cortex-M4F, 256 KB Flash, 32 KB SRAM, includes CAN FD but no LIN or dual-bank Flash. | Offers floating-point unit and CAN FD, but missing LIN 2.1 and deep-standby RTC - unsuitable for legacy automotive LIN clusters. | Select when CAN FD integration and DSP capability outweigh LIN dependency and ultra-low-power RTC retention needs. |
Compared with STM32F103VCT6 and RA4M1, CY9BF121KPMC-G-MNE2 uniquely combines LIN 2.1, dual-bank Flash, and Deep Standby RTC in a single chip - making it optimal for automotive body modules requiring certified firmware updates and long-term battery-backed operation.
Availability
CY9BF121KPMC-G-MNE2 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart sensor nodes, and energy monitoring systems requiring stable component supply, long lifecycle support, and qualified automotive-grade sourcing.
Supply support for CY9BF121KPMC-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and embedded controllers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The CY9BF121KPMC-G-MNE2 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-optimized, low-power embedded control in automotive body electronics and industrial automation where LIN connectivity and firmware update resilience are mandatory.
FAQ
What is the maximum operating frequency and supported voltage range?
The CY9BF121KPMC-G-MNE2 operates at up to 72 MHz and supports a wide supply voltage range of 2.7 V to 5.5 V. This allows direct interfacing with both 3.3 V logic systems and legacy 5 V peripherals without level-shifting circuitry, and ensures reliable operation across varying battery or industrial power rail conditions.
Does this MCU support true hardware LIN 2.1 communication?
Yes - the CY9BF121KPMC-G-MNE2 integrates a dedicated LIN controller compliant with LIN 2.1 specification, including programmable break field (13–16 bits), break delimiter (1–4 bits), automatic checksum generation, and master/slave mode selection - eliminating need for external LIN transceivers or software protocol stacks.
How does the dual-bank Flash architecture improve firmware reliability?
Dual-bank Flash enables one bank to run active firmware while the other is erased and reprogrammed - allowing atomic, zero-downtime firmware updates. This prevents corruption during power loss and meets functional safety requirements for automotive and industrial field-deployed devices without requiring external memory or complex bootloader logic.
Is the RTC functional in Deep Standby Stop mode?
No - RTC remains active only in Deep Standby RTC mode, where it continues counting time and retains RAM content. In Deep Standby Stop mode, the RTC is halted, though the 32.768 kHz sub-clock oscillator may remain enabled depending on configuration; wake-up must be triggered by external interrupt or watchdog timeout instead of RTC alarm.
CY9BF121KPMC-G-MNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-LQFP
- Series:
- FM3 MB9B120M
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 35
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 14x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF121KPMC-G-MNE2 FAQ
1.How can I place an order for CY9BF121KPMC-G-MNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF121KPMC-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF121KPMC-G-MNE2 reliable?
The price and inventory of CY9BF121KPMC-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF121KPMC-G-MNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF121KPMC-G-MNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF121KPMC-G-MNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF121KPMC-G-MNE2?
CY9BF121KPMC-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF121KPMC-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF121KPMC-G-MNE2?
For technical support, including CY9BF121KPMC-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF121KPMC-G-MNE2 requirements.
6.How does Aetrix verify that CY9BF121KPMC-G-MNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF121KPMC-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF121KPMC-G-MNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF121KPMC-G-MNE2?
All CY9BF121KPMC-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF121KPMC-G-MNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF121KPMC-G-MNE2 part is unused and in its original packaging.
Return procedure for CY9BF121KPMC-G-MNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF121KPMC-G-MNE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
