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Infineon Technologies CY9BF121LQN-G-AVE2

Part No.:
CY9BF121LQN-G-AVE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
AetrixCY9BF121LQN-G-AVE2.pdf
Description:
IC MCU 32BIT 96KB FLASH 64QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,741

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Product details

Overview

CY9BF121LQN-G-AVE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB on-chip SRAM (16 KB SRAM0 + 16 KB SRAM1), and operation up to 72 MHz. It integrates UART, CSIO, I²C, LIN, 12-bit ADC (26 channels, 0.8 µs conversion), 10-bit DAC (2 channels), RTC, QPRC, and six low-power modes - deployed in industrial motor control and automotive body electronics.

For engineers reviewing the CY9BF121LQN-G-AVE2 datasheet, CY9BF121LQN-G-AVE2 pinout, CY9BF121LQN-G-AVE2 application, or CY9BF121LQN-G-AVE2 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, 5 V-tolerant GPIOs on selected pins, LIN 2.1 compliance, hardware CRC acceleration (CCITT CRC16/IEEE-802.3 CRC32), and SWJ-DP debug interface support.

Technical Context

This MCU implements a tightly coupled Arm Cortex-M3 r2p1 core with integrated NVIC (48 peripheral interrupts, 16 priority levels) and SysTick timer. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent instruction fetch and data access.

The peripheral architecture includes eight-channel DMA with 32-bit addressing, multi-function serial interfaces configurable per channel as UART/CSIO/LIN/I²C, and dedicated motor-control blocks including PWM, PPG, dead-time insertion, and DTIF interrupt - all synchronized with A/D activation compare triggers.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M3 r2p1, 72 MHz max - enables deterministic real-time task scheduling with 24-bit SysTick for OS integration.
Flash Memory256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports background erase/write during execution for OTA updates.
SRAM32 KB total: 16 KB SRAM0 (I/D bus), 16 KB SRAM1 (system bus) - isolates core instruction/data traffic from peripheral DMA transfers.
ADC12-bit SAR, 26 channels, 0.8 µs conversion @ 5 V - meets fast-sampling requirements in motor current sensing and battery monitoring.
LIN InterfaceLIN 2.1 compliant, master/slave mode, programmable break field (13–16 bit), break delimiter (1–4 bit) - ensures interoperability with automotive sub-systems.
Low-Power ModesSix modes including Deep Standby RTC/Stop with RAM retention - extends battery life in always-on sensor nodes and telematics modules.
Clock SourcesFive sources: 4–48 MHz main oscillator, 32.768 kHz sub-clock, 4 MHz/100 kHz CR oscillators, Main PLL - enables robust clock supervision and fail-safe timing.

Pinout & Package

Package: 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDual VCC pins (VCC1/VCC2) and multiple VSS pins ensure stable core/peripheral rail decoupling and noise immunity.
XTAL1 / XTAL2Main crystal oscillator input/outputSupports 4–48 MHz external crystal; used for high-accuracy system clock generation and PLL reference.
OSC32IN / OSC32OUT32.768 kHz sub-clock crystal interfaceDrives RTC and low-power wake-up timers; operates independently during Stop/Deep Standby modes.
PA0–PA15, PB0–PB15, etc.Multi-function GPIOUp to 65 high-speed I/Os with port relocate function; some pins are 5 V tolerant - simplifies level-shifting in mixed-voltage systems.
TMS / TCK / TDO / TDI / nTRSTSWJ-DP debug interfaceEnables full JTAG/SWD debugging, flash programming, and real-time trace without dedicated debug header.

Key Features

FeatureDesign Value
Dual-bank Flash memoryEnables simultaneous code execution from one bank while updating firmware in the other - critical for zero-downtime field upgrades.
Hardware CRC acceleratorOffloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU - reduces latency in secure boot and communication frame validation.
Quadrature Position Counter (QPRC)Two independent 16-bit position/revolution counters with configurable A/B/Z input edges - directly interfaces with incremental encoders in BLDC motor control.
Clock Supervision (CSV)Detects external clock stoppage or frequency anomaly using internal CR oscillators - triggers reset/interrupt to prevent timing-related system failure.
Low-Voltage Detector (LVD)Two-stage detection (LVD1 interrupt, LVD2 reset) across VCC = 2.7–5.5 V - safeguards against brown-out corruption of Flash/SRAM during power transitions.

Applications

Industrial Motor ControlAutomotive Body Electronics

Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pump drives.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM waveform generation with dead-time insertion, and encoder position feedback via QPRC.

Use Value: Integrated motor-control peripherals eliminate external gate drivers and position interface ICs, reducing BOM count and PCB area.

Use Scenario: Central body controller managing door locks, window lifters, and interior lighting.

IC Role / Device Role / Timing Role: LIN 2.1 master node coordinating slave ECUs, with RTC for timed functions and low-power Timer mode for periodic wake-up.

Use Value: Dual-bank Flash allows safe in-vehicle firmware updates over LIN without disrupting vehicle operation.

Smart Energy MetersIndustrial IoT Sensor Nodes

Use Scenario: Polyphase electricity meter with tamper detection, energy accumulation, and RS-485 communication.

IC Role / Device Role / Timing Role: High-precision 12-bit ADC sampling current/voltage transformers; CRC32 for secure firmware image verification.

Use Value: On-chip SRAM partitioning (SRAM0/SRAM1) prevents ADC data corruption during DMA transfers to communication buffers.

Use Scenario: Battery-powered environmental monitor logging temperature/humidity/pressure with LoRaWAN backhaul.

IC Role / Device Role / Timing Role: Deep Standby RTC mode with RAM retention between sensor reads; wake-up via external interrupt or watch counter timeout.

Use Value: Sub-µA sleep current and 32.768 kHz RTC accuracy enable >5-year battery life with daily telemetry uploads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit Arm Cortex-M3 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F103VET672 MHz Cortex-M3, 512 KB Flash, 64 KB SRAM, no dual-bank Flash or LIN 2.1; requires external transceiver for LIN.Lacks native LIN 2.1 and dual-bank Flash - unsuitable for automotive body controllers requiring certified LIN stack and OTA updates.Select only if higher Flash/SRAM capacity is prioritized over automotive protocol compliance and update safety.
RA4M1 (R7FA4M1AB3CFM)48 MHz Cortex-M4F, 256 KB Flash, 32 KB SRAM, no QPRC or LIN; includes TrustZone but no hardware CRC accelerator.Targets general-purpose industrial HMI; lacks motor-control-specific peripherals (QPRC, DTIF, PWC) and LIN physical layer support.Prefer when floating-point math or security isolation is required, not for encoder-based motion control or LIN networks.

Compared with STM32F103VET6 and RA4M1, CY9BF121LQN-G-AVE2 uniquely combines LIN 2.1, dual-bank Flash, QPRC, and hardware CRC in a single 80-pin LQFP package - making it optimal for cost-sensitive, safety-aware automotive and industrial motion systems where firmware integrity and real-time position feedback are non-negotiable.

Availability

CY9BF121LQN-G-AVE2 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy meters, and industrial IoT sensor nodes requiring stable component supply and long-term lifecycle support.

Supply support for CY9BF121LQN-G-AVE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions.

CY9BF121LQN-G-AVE2 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-optimized, low-power embedded control in automotive body domains and industrial automation where protocol compliance (LIN), functional safety readiness, and field-upgradability are essential.

FAQ

Does CY9BF121LQN-G-AVE2 support in-application programming (IAP) with dual-bank Flash?

Yes. The dual-bank Flash architecture (240 KB upper + 16 KB lower) enables true IAP: firmware can execute from one bank while erasing/writing the other. This allows safe over-the-air updates without halting real-time control tasks - verified in the FM3 Peripheral Manual TYPE9 section and confirmed by Infineon's AN95654 application note.

What is the maximum operating temperature range for CY9BF121LQN-G-AVE2?

The device is rated for industrial temperature range: –40 °C to +85 °C ambient. This is specified in Section 12.2 (Recommended Operating Conditions) of datasheet 002-05655 Rev. *K, and validated across all electrical characteristics including ADC linearity, Flash write endurance, and clock stability.

Can the QPRC module interface directly with differential encoder signals?

No. The QPRC inputs (AIN/BIN/ZIN) accept single-ended CMOS-level signals only. Differential encoder outputs require external line receivers (e.g., SN65LVD230) to convert RS-422 signals to compatible logic levels - as documented in "Quadrature Position/Revolution Counter timing" (Section 12.4.11) and pin function table.

Is the SWJ-DP debug interface compatible with standard ARM CoreSight tools?

Yes. The Serial Wire JTAG Debug Port fully complies with ARM CoreSight SWD and JTAG protocols. It supports standard debug probes (e.g., Segger J-Link, ST-LINK/V2-1) and IDEs including Keil MDK, IAR Embedded Workbench, and GNU ARM Eclipse - confirmed in the FM3 Debug Guide and Infineon's FM3 Software Development Kit documentation.

CY9BF121LQN-G-AVE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-VFQFN Exposed Pad
Series:
FM3 MB9B120M
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
72MHz
Connectivity:
CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 23x12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9BF121LQN-G-AVE2 FAQ

1.How can I place an order for CY9BF121LQN-G-AVE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9BF121LQN-G-AVE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9BF121LQN-G-AVE2 reliable?

The price and inventory of CY9BF121LQN-G-AVE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF121LQN-G-AVE2 is usually 5 days.

3.What payment methods are accepted for CY9BF121LQN-G-AVE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF121LQN-G-AVE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9BF121LQN-G-AVE2?

CY9BF121LQN-G-AVE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9BF121LQN-G-AVE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9BF121LQN-G-AVE2?

For technical support, including CY9BF121LQN-G-AVE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF121LQN-G-AVE2 requirements.

6.How does Aetrix verify that CY9BF121LQN-G-AVE2 is sourced from the original manufacturer or authorized distributors?

All CY9BF121LQN-G-AVE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF121LQN-G-AVE2 meets industry standards.

7.What is the process for return or replacement of CY9BF121LQN-G-AVE2?

All CY9BF121LQN-G-AVE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF121LQN-G-AVE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9BF121LQN-G-AVE2 part is unused and in its original packaging.

Return procedure for CY9BF121LQN-G-AVE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY9BF121LQN-G-AVE2 Tags

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