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Infineon Technologies CY9BF121MBGL-GE1
- Part No.:
- CY9BF121MBGL-GE1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 96-LFBGA
- Datasheet:
-
CY9BF121MBGL-GE1.pdf
- Description:
- IC MCU 32BIT 96KB FLASH 96FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,283
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Product details
Overview
CY9BF121MBGL-GE1 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with dual-bank 256 KB Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and integrated peripherals including 26-channel 12-bit ADC, dual 10-bit DAC, eight UART/CSIO/I²C/LIN serial interfaces, and hardware CRC accelerator. It operates at up to 72 MHz, supports six low-power modes, and targets embedded motor control and industrial sensing applications.
For engineers reviewing the CY9BF121MBGL-GE1 datasheet, CY9BF121MBGL-GE1 pinout, CY9BF121MBGL-GE1 application, or CY9BF121MBGL-GE1 equivalent, key selection considerations include its dual-operation Flash architecture, 5 V-tolerant I/O capability on selected pins, real-time clock with leap-year support, and SWJ-DP debug interface compatibility with standard ARM toolchains.
Technical Context
The CY9BF121MBGL-GE1 implements an Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS integration. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent instruction fetch and data access.
Peripheral integration includes a dedicated 8-channel DMA controller with 32-bit addressing, quadrature position/revolution counters with 16-bit position and revolution registers, and dual watchdog timers-one hardware-based (low-speed CR oscillator) active in all low-power modes except Deep Standby RTC/Stop, and one software-configurable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, up to 72 MHz operation with 24-bit SysTick timer for OS task scheduling |
| Flash Memory | 256 KB dual-bank Flash (240 KB upper + 16 KB lower), enabling simultaneous read/erase/write per bank |
| SRAM | 32 KB total: 16 KB SRAM0 (I-code/D-code bus), 16 KB SRAM1 (system bus), independently accessible |
| ADC | Two 12-bit successive-approximation ADCs, 0.8 μs conversion time at 5 V, with 16-step FIFO for scan mode |
| DAC | Two 10-bit R-2R DACs, supporting analog output generation without external components |
| Serial Interfaces | Eight multi-function channels: configurable as UART, CSIO, LIN (Rev. 2.1), or I²C (up to 400 kbps Fast Mode) |
| Power Supply | 2.7 V to 5.5 V wide-range operation; 5 V-tolerant I/O on designated pins per pin function table |
Pinout & Package
Package: 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs per functional block to minimize noise coupling and ensure stable core/peripheral operation |
| XTAL / EXTAL | Main clock input/output | Supports 4–48 MHz external crystal or oscillator for precise timing; enables PLL input for higher-frequency system clocks |
| OSC32K / RTC32K | Sub-clock input/output | Connects 32.768 kHz crystal for RTC and low-power wake-up timer functions with ±20 ppm accuracy |
| PA0–PA15, PB0–PB15, etc. | Multi-function GPIO | Up to 65 high-speed I/O pins with port relocate function, individual pull-up control, and direct pin-level read capability |
| SWDIO / SWCLK | Debug interface | Serial Wire Debug (SWD) signals compliant with ARM CoreSight, enabling non-intrusive debugging and flash programming |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables background firmware updates without halting CPU execution-critical for field-upgradable industrial controllers |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU, reducing integrity-check latency in communication stacks |
| Quadrature Position Counter (QPRC) | Direct encoder interface with 16-bit position/revolution counters and configurable A/B/Z input edge detection for motor feedback |
| Real-Time Clock (RTC) | Full BCD calendar (Year/Month/Day/Hour/Minute/Second/Weekday) with leap-year correction and programmable alarm interrupt |
| Low-power modes | Six distinct states (Sleep, Timer, RTC, Stop, Deep Standby RTC, Deep Standby Stop) with RAM retention options for rapid wake-up |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with position feedback and current sensing. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing PWM generation, ADC sampling, and QPRC-based rotor position tracking. Use Value: Integrated 12-bit ADC (0.8 μs), dual 10-bit DAC, and hardware dead-time insertion reduce external component count and timing jitter in gate driver control paths. | Use Scenario: Battery-powered environmental sensor hub aggregating temperature, humidity, and vibration data. IC Role / Device Role / Timing Role: System-on-chip host managing sensor I²C reads, local data preprocessing, and low-power wireless transmission scheduling. Use Value: Six low-power modes with sub-32.768 kHz RTC wake-up and 2.7–5.5 V operation enable >5-year battery life in intermittent-sampling deployments. |
| Automotive Body Control Module | Programmable Logic Controller (PLC) I/O Base |
Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN communication. IC Role / Device Role / Timing Role: LIN master node interfacing with slave ECUs while managing local GPIO, PWM dimming, and fault monitoring. Use Value: Native LIN 2.1 support with configurable break field (13–16 bit) and built-in error detection ensures robust automotive network interoperability. | Use Scenario: DIN-rail mounted I/O expansion unit with digital input filtering, analog input scaling, and Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Protocol bridge and signal conditioner between field sensors/actuators and main PLC CPU via UART with hardware flow control. Use Value: Full-duplex UART with RTS/CTS on channel 4 and 16-step FIFO enable deterministic Modbus response timing under heavy I/O load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit Arm Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | Single-bank 256 KB Flash, no dual-operation capability; 48 MHz max CPU frequency; no hardware CRC accelerator | Lacks dual-bank Flash update capability and integrated LIN protocol support; requires external transceiver for LIN | Select when cost sensitivity outweighs need for background firmware updates or automotive LIN compliance |
| RP2040 | Dual-core Arm Cortex-M0+, 2 MB Flash (external QSPI), no native LIN or RTC with calendar; USB device interface included | Designed for USB-connected consumer devices; lacks industrial-grade peripherals like QPRC, LVD2 reset, or CSV clock supervision | Select for USB HID or audio applications where low-cost dual-core processing matters more than automotive/industrial timing integrity |
Compared with STM32F103VCT6 and RP2040, the CY9BF121MBGL-GE1 uniquely combines dual-bank Flash for safe OTA updates, LIN 2.1 compliance with hardware break generation, and clock supervision (CSV) for fail-safe timing-making it optimal for certified industrial and automotive body electronics.
Availability
CY9BF121MBGL-GE1 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, automotive body modules, and PLC I/O bases requiring stable component supply across extended product lifecycles.
Supply support for CY9BF121MBGL-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded controllers, with global R&D and manufacturing infrastructure.
The CY9BF121MBGL-GE1 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power industrial automation and automotive body electronics requiring high peripheral integration and functional safety readiness.
FAQ
What is the maximum operating frequency and supported clock sources?
The CY9BF121MBGL-GE1 operates at up to 72 MHz using its Arm Cortex-M3 core. Clock sources include two external oscillators (main clock: 4–48 MHz; sub-clock: 32.768 kHz), two internal CR oscillators (4 MHz high-speed, 100 kHz low-speed), and a main PLL that accepts either external or internal clock inputs for frequency multiplication.
Does this MCU support hardware-based LIN communication without external transceivers?
No-the CY9BF121MBGL-GE1 integrates a LIN protocol controller (Rev. 2.1) with break field generation and error detection, but requires an external LIN transceiver (e.g., TLE7259-3GE) to drive the physical bus. The MCU handles protocol framing, checksum, and timing; the transceiver manages voltage level translation and bus arbitration.
How does the dual-bank Flash architecture improve firmware reliability?
Dual-bank Flash allows one bank (e.g., upper 240 KB) to run active firmware while the other (lower 16 KB work area) is erased and reprogrammed. This enables seamless background firmware updates without CPU interruption or system reset, critical for uptime-critical industrial controllers and remote IoT endpoints.
Is the Real-Time Clock (RTC) capable of maintaining time during deep power-down modes?
Yes-the RTC remains fully operational in Deep Standby RTC mode, powered by the 32.768 kHz sub-clock and retaining calendar time (Year/Month/Day/Hour/Minute/Second/Weekday) with leap-year correction. RAM retention in this mode is configurable, allowing selective data preservation without full system wake-up.
CY9BF121MBGL-GE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 96-LFBGA
- Series:
- FM3 MB9B120M
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 26x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF121MBGL-GE1 FAQ
1.How can I place an order for CY9BF121MBGL-GE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF121MBGL-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF121MBGL-GE1 reliable?
The price and inventory of CY9BF121MBGL-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF121MBGL-GE1 is usually 5 days.
3.What payment methods are accepted for CY9BF121MBGL-GE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF121MBGL-GE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF121MBGL-GE1?
CY9BF121MBGL-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF121MBGL-GE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF121MBGL-GE1?
For technical support, including CY9BF121MBGL-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF121MBGL-GE1 requirements.
6.How does Aetrix verify that CY9BF121MBGL-GE1 is sourced from the original manufacturer or authorized distributors?
All CY9BF121MBGL-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF121MBGL-GE1 meets industry standards.
7.What is the process for return or replacement of CY9BF121MBGL-GE1?
All CY9BF121MBGL-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF121MBGL-GE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF121MBGL-GE1 part is unused and in its original packaging.
Return procedure for CY9BF121MBGL-GE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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