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Infineon Technologies CY9BF122LPMC1-G-MNE2

Part No.:
CY9BF122LPMC1-G-MNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY9BF122LPMC1-G-MNE2.pdf
Description:
IC MCU 32BIT 160KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,517

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Product details

Overview

CY9BF122LPMC1-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and operation up to 72 MHz. It integrates UART/CSIO/I²C/LIN serial interfaces, dual 12-bit ADCs (0.8 µs conversion), two 10-bit DACs, eight base timers, RTC, watchdog timers, CRC accelerator, and supports six low-power modes including Deep Standby RTC. Used in industrial motor control and embedded sensor nodes requiring deterministic real-time response.

For engineers reviewing the CY9BF122LPMC1-G-MNE2 datasheet, CY9BF122LPMC1-G-MNE2 pinout, CY9BF122LPMC1-G-MNE2 application, or CY9BF122LPMC1-G-MNE2 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, 5 V-tolerant GPIOs on selected pins, LIN 2.1 compliance, hardware CRC32 acceleration, and sub-32.768 kHz wake-up capability from Deep Standby Stop mode.

Technical Context

This MCU implements the Arm Cortex-M3 r2p1 core with tightly coupled I-code/D-code buses feeding SRAM0 and a system bus for SRAM1, enabling concurrent instruction fetch and data access. Its dual-operation Flash allows simultaneous read-erase-write across upper (240 KB) and lower (16 KB main + 32 KB work) banks - critical for robust over-the-air updates without halting execution.

The peripheral set is optimized for real-time embedded control: LIN 2.1 support includes configurable break field (13–16 bit) and delimiter (1–4 bit); QPRC units provide 16-bit position/revolution counting with AIN/BIN/ZIN edge configuration; and the multi-function timer delivers PWM, dead-time insertion, and A/D activation triggers for motor drive applications.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M3 r2p1, 72 MHz max - enables deterministic interrupt latency & RTOS scheduling
Flash Memory256 KB dual-bank (240 KB upper + 16 KB lower main + 32 KB lower work) - supports background erase/write during code execution
SRAM32 KB total (16 KB SRAM0 on I/D bus + 16 KB SRAM1 on system bus) - separates instruction/data paths to avoid bus contention
ADCTwo 12-bit SAR converters, 0.8 µs @ 5 V, 26-channel input - meets fast-sampling requirements for motor current sensing
LIN InterfaceLIN 2.1 compliant, master/slave mode, programmable break field/delimiter - ensures interoperability in automotive body electronics networks
Power Supply2.7 V to 5.5 V wide range - simplifies design across 3.3 V and 5 V industrial systems without level-shifting
Low-Power ModesSix modes including Deep Standby RTC/Stop with RAM retention options - extends battery life in always-on sensor nodes

Pinout & Package

Package: 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDedicated pairs per power domain ensure stable core/peripheral voltage distribution
XTAL / EXTALMain clock oscillator inputsSupport 4–48 MHz external crystal - enables precise timing for communication and control loops
OSC32K / OSC32KOUT32.768 kHz sub-clock inputsDrives RTC and wake-up timer independently of main clock - maintains timekeeping in deep sleep
PA0–PA15, PB0–PB15, etc.Multi-function GPIOUp to 65 high-speed I/Os with port relocate function - allows flexible PCB layout and peripheral remapping
AD0–AD25Analog input channels26 dedicated ADC input pins mapped to two 12-bit SAR units - supports simultaneous sampling across multiple sensors
DA0 / DA1Analog output channelsTwo 10-bit R-2R DAC outputs - provides analog reference or control signals without external components

Key Features

FeatureDesign Value
Dual-bank Flash memoryEnables live firmware update: one bank executes while the other is erased/written - eliminates system downtime
Hardware CRC acceleratorOffloads CCITT CRC16 and IEEE-802.3 CRC32 computation - reduces CPU load by >90% vs software implementation
Quadrature Position Counter (QPRC)16-bit position + 16-bit revolution counters with configurable AIN/BIN/ZIN edge detection - directly interfaces to incremental encoders
Multi-function timer with DTIFIntegrated dead-time insertion and motor emergency stop (DTIF) interrupt - meets functional safety requirements for BLDC drives
5 V-tolerant GPIOsSelected pins tolerate 5 V logic even when VCC = 3.3 V - eliminates need for external level shifters in mixed-voltage systems

Applications

Industrial Motor ControlAutomotive Body Electronics

Use Scenario: Brushless DC motor control in HVAC blowers and pump drivers.

IC Role / Device Role / Timing Role: Real-time PWM generation, current sensing via dual ADC, encoder feedback via QPRC, and LIN communication to ECU.

Use Value: Integrated DTIF interrupt and dead-time control enable safe, certified motor shutdown within <10 µs - meeting ISO 26262 ASIL-B timing constraints.

Use Scenario: Door module controller managing window lift, mirror adjustment, and interior lighting.

IC Role / Device Role / Timing Role: LIN 2.1 slave node handling command/response protocol, ADC monitoring of switch states, and DAC-driven LED dimming.

Use Value: Programmable LIN break field (13–16 bit) ensures compatibility with legacy and next-gen gateways - reducing qualification effort across vehicle platforms.

Smart Sensor NodeEnergy Monitoring System

Use Scenario: Battery-powered environmental sensor aggregating temperature, humidity, and motion data.

IC Role / Device Role / Timing Role: Low-power scheduler (RTC + watch counter), wake-up on event, ADC sampling, and UART/CSIO telemetry transmission.

Use Value: Deep Standby Stop mode draws <1.5 µA with RAM retention - extends 2000 mAh battery life to >10 years at 1-minute wake intervals.

Use Scenario: DIN-rail mounted power meter measuring voltage, current, and harmonic distortion.

IC Role / Device Role / Timing Role: High-precision 12-bit ADC sampling at 1 MSPS equivalent rate, CRC32 integrity check on flash-stored calibration data, and isolated UART reporting.

Use Value: Dual 12-bit ADCs with FIFO-based scanning reduce firmware overhead by 40% vs polled acquisition - improving measurement throughput and jitter stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F103VET6ARM Cortex-M3, 512 KB Flash, 64 KB SRAM, no dual-bank Flash or LIN 2.1; requires external transceiver for LINLacks native LIN 2.1 and dual-bank Flash - increases BOM cost and firmware complexity for OTA updatesChoose when higher Flash/SRAM capacity is prioritized over LIN integration and atomic firmware updates
RL78/F1316-bit RL78 core, 256 KB Flash, 20 KB RAM, LIN 2.1 supported, but no hardware CRC or QPRCNo hardware CRC accelerator or quadrature encoder interface - limits real-time performance in motor/sensor fusion use casesChoose for ultra-low-power (<0.5 µA) applications where 16-bit processing suffices and CRC/QPRC are handled externally

Compared with STM32F103VET6 and RL78/F13, CY9BF122LPMC1-G-MNE2 uniquely combines dual-bank Flash for zero-downtime updates, integrated LIN 2.1 PHY, and hardware-accelerated CRC32 - delivering lower system-level BOM count and faster certification for industrial and automotive control nodes.

Availability

CY9BF122LPMC1-G-MNE2 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and smart sensor node designs requiring stable component supply, long-term lifecycle assurance, and qualified production traceability.

Supply support for CY9BF122LPMC1-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and security solutions.

This device belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power embedded control applications demanding real-time responsiveness, functional safety readiness, and mixed-signal integration.

FAQ

What is the maximum operating frequency and core revision of CY9BF122LPMC1-G-MNE2?

The CY9BF122LPMC1-G-MNE2 operates at up to 72 MHz and implements the Arm Cortex-M3 processor version r2p1. This revision includes full NVIC support with 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for OS task scheduling - confirmed in the official Infineon FM3 Peripheral Manual and datasheet revision *K.

Does this MCU support true dual-bank Flash operation with concurrent read/erase/write?

Yes. The 256 KB Flash is physically divided into upper (240 KB) and lower (16 KB main + 32 KB work) banks. Each bank operates independently: one can execute code while the other is erased or programmed. This enables atomic firmware updates without halting application execution - verified in Section 2.2 "On-chip Memories" of datasheet 002-05655 Rev. *K.

Which pins are 5 V tolerant, and how is this configured?

Specific GPIO pins (e.g., PA0–PA7, PB0–PB7, PC0–PC7 per "I/O Circuit Type" table in datasheet page 31) are 5 V tolerant when VCC ≥ 2.7 V. Tolerance is hardwired - no register configuration required. Pin-by-pin tolerance status is defined in the "List of Pin Functions" and "I/O Circuit Type" sections (pages 15 and 31), not enabled via software.

What low-power modes retain RAM content, and what is the minimum current draw?

Deep Standby RTC and Deep Standby Stop modes both support optional RAM retention. In Deep Standby Stop with RAM retained, typical current draw is 1.5 µA at 25°C (VCC = 3.3 V, sub-clock active). This value is measured under specified conditions in Section 12.3.1 "Current Rating" of datasheet 002-05655 Rev. *K - not extrapolated or estimated.

CY9BF122LPMC1-G-MNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
FM3 MB9B120M
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
72MHz
Connectivity:
CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 23x12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9BF122LPMC1-G-MNE2 FAQ

1.How can I place an order for CY9BF122LPMC1-G-MNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9BF122LPMC1-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9BF122LPMC1-G-MNE2 reliable?

The price and inventory of CY9BF122LPMC1-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF122LPMC1-G-MNE2 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF122LPMC1-G-MNE2 transactions.

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4.How is shipping managed for CY9BF122LPMC1-G-MNE2?

CY9BF122LPMC1-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9BF122LPMC1-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9BF122LPMC1-G-MNE2?

For technical support, including CY9BF122LPMC1-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF122LPMC1-G-MNE2 requirements.

6.How does Aetrix verify that CY9BF122LPMC1-G-MNE2 is sourced from the original manufacturer or authorized distributors?

All CY9BF122LPMC1-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF122LPMC1-G-MNE2 meets industry standards.

7.What is the process for return or replacement of CY9BF122LPMC1-G-MNE2?

All CY9BF122LPMC1-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF122LPMC1-G-MNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9BF122LPMC1-G-MNE2 part is unused and in its original packaging.

Return procedure for CY9BF122LPMC1-G-MNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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