My Inquiry
My Account
Infineon Technologies CY9BF122LPMC1-GNE2
- Part No.:
- CY9BF122LPMC1-GNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY9BF122LPMC1-GNE2.pdf
- Description:
- IC MCU 32BIT 160KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,670
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF122LPMC1-GNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller in the FM3 family, operating up to 72 MHz with 256 KB dual-bank Flash (240 KB upper + 16 KB lower), 32 KB on-chip SRAM (16 KB SRAM0 + 16 KB SRAM1), and integrated peripherals including UART/CSIO/I²C/LIN interfaces, 12-bit ADC (26 channels, 0.8 µs conversion), and dual 10-bit DACs. It targets low-power embedded motor control and industrial sensing applications.
For engineers reviewing the CY9BF122LPMC1-GNE2 datasheet, CY9BF122LPMC1-GNE2 pinout, CY9BF122LPMC1-GNE2 application, or CY9BF122LPMC1-GNE2 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, 5 V-tolerant I/O support, RTC with leap-year handling, six low-power modes (including Deep Standby RTC), and hardware CRC acceleration for CCITT CRC16 and IEEE-802.3 CRC32.
Technical Context
The CY9BF122LPMC1-GNE2 implements an Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent CPU and DMA access without contention.
Peripherals are tightly coupled to the core via dedicated buses: the 8-channel DMA controller operates independently of the CPU; the QPRC modules support quadrature encoder position measurement with configurable AIN/BIN/ZIN edge detection; and the multi-function timers provide PWM, PPG, input capture, and A/D activation compare functions optimized for motor control loop timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, 72 MHz max - enables deterministic real-time execution with low-latency interrupt response for closed-loop control. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports background erase/write for live firmware updates without halting execution. |
| SRAM | 32 KB total (16 KB SRAM0 on I/D bus + 16 KB SRAM1 on system bus) - allows parallel instruction fetch and data access, improving throughput in interrupt-heavy code. |
| ADC | 12-bit SAR, 26 channels, 0.8 µs conversion @ 5 V - delivers high-speed analog acquisition for multi-sensor monitoring in industrial nodes. |
| DAC | Two 10-bit R-2R DACs - provides precise analog output for calibration signals or actuator biasing without external components. |
| Low-Power Modes | Six modes including Deep Standby RTC with RAM retention - extends battery life in always-on sensor nodes while preserving timekeeping and critical state. |
| Clock Sources | Five sources: 4–48 MHz main oscillator, 32.768 kHz sub-clock, 4 MHz/100 kHz CR oscillators, Main PLL - ensures robust timing across operating conditions and power states. |
Pinout & Package
Package: 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core and I/O domain supply pins; supports wide 2.7–5.5 V operation with internal voltage regulation. |
| XTAL / EXTAL | Main clock oscillator input/output | Connects to external 4–48 MHz crystal or oscillator; enables precise timing for communication and control loops. |
| OSC32K / OSC32KOUT | Sub-clock oscillator input/output | Drives 32.768 kHz RTC and watch counter; maintains timekeeping during deep sleep with minimal current draw. |
| PA0–PA15, PB0–PB15, etc. | Multi-function GPIO | Up to 65 high-speed I/O pins with port relocate function and per-pin pull-up control; some pins are 5 V tolerant for mixed-voltage interfacing. |
| SWDIO / SWCLK | Serial Wire Debug interface | Enables non-intrusive debugging and programming via standard ARM SWJ-DP; no dedicated JTAG pins required. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash architecture | Enables simultaneous read from one bank while erasing/writing the other - critical for over-the-air firmware updates without system downtime. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation - reduces CPU load by >90% for integrity checks on received packets or stored firmware images. |
| Quadrature Position Counter (QPRC) | Configurable 16-bit position/revolution counters with AIN/BIN/ZIN edge detection - directly interfaces to incremental encoders for motor shaft position feedback. |
| Real-Time Clock with leap-year logic | Maintains accurate calendar time (Year/Month/Day/Hour/Minute/Second/Weekday) across decades - eliminates software-based date correction in time-stamped logging applications. |
| Multi-mode low-power support | Deep Standby RTC mode draws <1.5 µA while retaining RAM and RTC - extends battery life in remote environmental sensors to multi-year operation. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and conveyor drives. IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms, generating PWM waveforms with dead-time insertion, and sampling current/voltage via ADC. Use Value: Integrated multi-function timers with DTIF interrupt and hardware PWM enable fast, deterministic motor commutation at 20 kHz switching frequency. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and air quality with periodic wireless transmission. IC Role / Device Role / Timing Role: System-on-chip managing sensor acquisition, data preprocessing, RTC-triggered wake-up, and low-power radio interface control. Use Value: Deep Standby RTC mode with RAM retention allows 10-year battery life using coin-cell power while maintaining accurate timestamps and sensor calibration data. |
| Automotive Body Electronics | Industrial PLC I/O Module |
Use Scenario: LIN bus gateway controlling seat/mirror actuators and reading switch inputs in automotive body control modules. IC Role / Device Role / Timing Role: LIN master node implementing ISO 17987-4 protocol with break field generation and error detection on ch.0–ch.3. Use Value: Hardware LIN support with configurable 13–16 bit break length and 1–4 bit delimiter meets OEM-specific physical layer requirements without software overhead. | Use Scenario: DIN-rail mounted digital I/O expansion module for programmable logic controllers with isolated inputs and relay outputs. IC Role / Device Role / Timing Role: Central intelligence unit handling opto-isolated input scanning, watchdog supervision, and serial Modbus RTU communication over RS-485. Use Value: Dual UART with hardware flow control (RTS/CTS on ch.4) and built-in baud rate generator ensure reliable 115.2 kbps Modbus communication under EMI-prone factory floor conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit Arm Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or hardware LIN; requires external crystal for full accuracy. | Lacks integrated LIN PHY and dual-bank Flash - unsuitable for live firmware updates or automotive LIN gateways without external transceivers. | Select when higher SRAM headroom is needed and LIN/dual-bank Flash are not required. |
| RP2040 | Dual-core Arm Cortex-M0+, 2 MB Flash, 264 KB SRAM, no hardware RTC or LIN; USB device only - no CAN/LIN/UART multiprotocol support. | No hardware LIN, no RTC with calendar logic, no low-power deep standby - cannot replace in time-critical or battery-operated sensor nodes. | Select for cost-sensitive consumer IoT where USB host interface and dual-core simplicity outweigh industrial timing/peripheral needs. |
Compared with STM32F103VCT6 and RP2040, CY9BF122LPMC1-GNE2 uniquely combines dual-bank Flash for fail-safe updates, hardware LIN protocol engine, and Deep Standby RTC with sub-µA power - making it optimal for automotive body electronics and long-life industrial sensors where firmware reliability and precise timekeeping are non-negotiable.
Availability
CY9BF122LPMC1-GNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, automotive body electronics, and PLC I/O modules requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for CY9BF122LPMC1-GNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and microcontrollers, with global R&D and manufacturing infrastructure.
The CY9BF122LPMC1-GNE2 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power industrial automation and motor control applications requiring rich analog and communication peripherals.
FAQ
What is the maximum operating frequency and supported voltage range?
The CY9BF122LPMC1-GNE2 operates at up to 72 MHz and supports a wide supply voltage range of 2.7 V to 5.5 V. This allows direct interfacing with both 3.3 V logic systems and legacy 5 V industrial sensors and actuators without level-shifting circuitry. The internal voltage regulator maintains stable core operation across this range.
Does this MCU support hardware LIN communication without external transceivers?
Yes - the CY9BF122LPMC1-GNE2 integrates full LIN 2.1 protocol support in its CSIO/UART peripherals, including hardware break field generation (13–16 bit), delimiter control (1–4 bit), and automatic error detection. An external LIN transceiver is still required for physical layer signaling, but all protocol-layer functions are handled in silicon.
How does the dual-bank Flash architecture improve firmware update reliability?
Dual-bank Flash allows one bank (e.g., upper 240 KB) to run active firmware while the other (lower 16 KB work area) is erased and reprogrammed. This enables atomic, zero-downtime updates - critical for remote devices where reboot-induced service interruption is unacceptable. The security function also prevents unauthorized code reads during update sequences.
What low-power modes are available and what is the lowest achievable current draw?
Six low-power modes are supported: Sleep, Timer, RTC, Stop, Deep Standby RTC, and Deep Standby Stop. In Deep Standby RTC mode with RAM retention, typical current draw is <1.5 µA at 25°C using the 32.768 kHz sub-clock - verified per datasheet Section 12.3.1. This mode preserves RTC time, RAM contents, and wake-up capability via external interrupt or timer match.
CY9BF122LPMC1-GNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- FM3 MB9B120M
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit
- Speed:
- 72MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 50
- Program Memory Size:
- 160KB (160K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 23x12b SAR; D/A 2x10b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF122LPMC1-GNE2 FAQ
1.How can I place an order for CY9BF122LPMC1-GNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF122LPMC1-GNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF122LPMC1-GNE2 reliable?
The price and inventory of CY9BF122LPMC1-GNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF122LPMC1-GNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF122LPMC1-GNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF122LPMC1-GNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF122LPMC1-GNE2?
CY9BF122LPMC1-GNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF122LPMC1-GNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF122LPMC1-GNE2?
For technical support, including CY9BF122LPMC1-GNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF122LPMC1-GNE2 requirements.
6.How does Aetrix verify that CY9BF122LPMC1-GNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF122LPMC1-GNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF122LPMC1-GNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF122LPMC1-GNE2?
All CY9BF122LPMC1-GNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF122LPMC1-GNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF122LPMC1-GNE2 part is unused and in its original packaging.
Return procedure for CY9BF122LPMC1-GNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF122LPMC1-GNE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
