Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY9BF122LPMC-G-MNE2

Part No.:
CY9BF122LPMC-G-MNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY9BF122LPMC-G-MNE2.pdf
Description:
IC MCU 32BIT 96KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,190

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY9BF122LPMC-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and integrated peripherals including 26-channel 12-bit ADC (0.8 µs conversion), dual DAC, eight UART/CSIO/I²C/LIN serial channels, and six low-power modes. It operates from 2.7 V to 5.5 V and supports up to 72 MHz core frequency for real-time motor control and embedded sensing applications.

For engineers reviewing the CY9BF122LPMC-G-MNE2 datasheet, CY9BF122LPMC-G-MNE2 pinout, CY9BF122LPMC-G-MNE2 application, or CY9BF122LPMC-G-MNE2 equivalent, key selection criteria include dual-bank Flash execution capability, 5 V-tolerant GPIO count (up to 65 pins in 80-pin LQFP), LIN 2.1 compliance, RTC with leap-year support, and SWJ-DP debug interface compatibility.

Technical Context

The CY9BF122LPMC-G-MNE2 implements an Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features dual-operation Flash enabling concurrent read-erase-write across upper (240 KB) and lower (16 KB main + 32 KB work) banks, and split SRAM architecture (SRAM0 on I/D bus, SRAM1 on system bus) for deterministic code/data access.

Peripheral integration includes a dedicated DMA controller with 8 channels supporting burst/demand transfers up to 4 GB address space, quadrature position/revolution counters with 16-bit position and revolution registers, and multi-function timers with PWM, PPG, input capture, and A/D activation compare functions - all optimized for closed-loop motor control and industrial I/O timing.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M3 r2p1, up to 72 MHz - enables deterministic real-time task execution with hardware divide and Thumb-2 instruction set.
Flash Memory 256 KB dual-bank (240 KB upper + 16 KB lower main + 32 KB lower work), 0-wait-state read - supports live firmware update without halting execution.
SRAM 32 KB total: 16 KB SRAM0 (I/D bus), 16 KB SRAM1 (system bus) - isolates critical code/data paths to prevent bus contention.
ADC 2 × 12-bit SAR ADC, 26 channels, 0.8 µs conversion @ 5 V - delivers high-speed sampling for sensor fusion and motor current monitoring.
Serial Interfaces 8-channel multi-function serial interface (UART/CSIO/LIN/I²C), with 4 FIFO-equipped channels - enables simultaneous protocol handling for CAN gateway, LIN slave, and debug UART.
Power Supply 2.7 V to 5.5 V operation - allows direct interfacing with 3.3 V logic and legacy 5 V industrial sensors without level shifters.
Low-Power Modes 6 modes including Deep Standby RTC with RAM retention - extends battery life in metering and remote monitoring nodes.

Pinout & Package

This device is packaged in an 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are fully relocatable via register configuration, supporting flexible PCB layout and peripheral remapping.

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Dual VCC/VSS pairs per side ensure stable core and I/O rail decoupling; 5 V-tolerant I/O pins marked in "List of Pin Functions".
XTAL / EXTAL Main clock oscillator input/output Accepts 4–48 MHz crystal or external clock source; drives PLL for high-frequency operation with low jitter.
RTCXIN / RTCXOUT Real-time clock oscillator Connects to 32.768 kHz crystal for autonomous timekeeping during Stop and Deep Standby RTC modes.
SWDIO / SWCLK Serial Wire Debug interface Enables non-intrusive debugging and programming via ARM SWJ-DP; no JTAG pins required for standard development.
PA0–PA15, PB0–PB15, etc. General-purpose I/O with relocation 65 total GPIOs; each pin's peripheral assignment (e.g., UART0_TX, ADC0_IN0) is software-configurable via port function registers.

Key Features

Feature Design Value
Dual-bank Flash memory Enables background firmware updates: erase/write one bank while executing from the other - eliminates system downtime during field upgrades.
LIN 2.1 compliant serial interface Hardware-supported break field (13–16 bit) and delimiter (1–4 bit) generation - ensures interoperability with automotive body electronics networks.
Quadrature Position Counter (QPRC) Two independent 16-bit position + 16-bit revolution counters with configurable A/B/Z input edge detection - directly interfaces with incremental encoders in servo drives.
CRC accelerator (CRC16/32) Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU - reduces firmware overhead for communication integrity checks and flash image validation.
Low-voltage detector (LVD) Two-stage detection (LVD1 interrupt, LVD2 reset) with programmable thresholds - prevents erratic behavior during brown-out conditions in industrial power supplies.

Applications

Industrial Motor Control Automotive Body Electronics

Use Scenario: Brushless DC motor commutation with current sensing and thermal monitoring in HVAC blowers.

IC Role / Device Role / Timing Role: Real-time PWM generation, ADC-sampled phase current acquisition, and LIN-based diagnostic reporting.

Use Value: Integrated QPRC and multi-function timers eliminate external counter ICs; dual-bank Flash enables silent firmware patching during maintenance windows.

Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting via LIN cluster.

IC Role / Device Role / Timing Role: LIN master node managing up to 16 slave devices, with ADC monitoring switch inputs and temperature sensors.

Use Value: Hardware LIN 2.1 support ensures timing-critical break field generation; 5 V-tolerant I/O simplifies connection to legacy switches and lamps.

Smart Energy Metering Factory Automation I/O Module

Use Scenario: Three-phase electricity meter with RTC timestamping, tamper detection, and secure firmware updates.

IC Role / Device Role / Timing Role: RTC with leap-year support for billing accuracy; dual-bank Flash for A/B firmware images.

Use Value: Deep Standby RTC mode maintains timekeeping at <1 µA; CRC accelerator validates OTA update integrity before Flash write.

Use Scenario: DIN-rail mounted digital I/O expansion unit with isolated inputs/outputs and Modbus RTU over RS-485.

IC Role / Device Role / Timing Role: UART channel configured as RS-485 transceiver interface; GPIOs used for opto-isolated status reporting.

Use Value: 65 GPIOs with port relocation allow flexible pin mapping to match PCB layout; wide 2.7–5.5 V supply accommodates industrial 24 V DC-DC converters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit Arm Cortex-M3 microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32F103VET6 72 MHz Cortex-M3, 512 KB Flash, 64 KB SRAM, no dual-bank Flash or LIN hardware support. Lacks native LIN 2.1 and QPRC; requires software LIN stack and external encoder interface. Prefer when larger Flash/SRAM is needed and LIN is not required; adds BOM cost for external isolation or timing ICs.
RP2040 Dual-core Arm Cortex-M0+, 2 MB Flash, 264 KB SRAM, no hardware LIN or RTC with leap-year support. No dedicated LIN peripheral or autonomous RTC; relies on software emulation for protocol timing. Choose for cost-sensitive consumer IoT where USB host capability outweighs automotive/industrial timing precision.

Compared with STM32F103VET6 and RP2040, CY9BF122LPMC-G-MNE2 provides hardware-accelerated LIN 2.1, dual-bank Flash for zero-downtime updates, and integrated QPRC - reducing firmware complexity and external component count in motor control and automotive body modules.

Availability

CY9BF122LPMC-G-MNE2 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and factory automation I/O modules requiring stable component supply and long-term lifecycle support.

Supply support for CY9BF122LPMC-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions with vertical integration from silicon to system-level IP.

CY9BF122LPMC-G-MNE2 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power industrial and automotive embedded controllers requiring robust peripheral integration and field-upgradable firmware.

FAQ

Does CY9BF122LPMC-G-MNE2 support in-system programming via UART?

Yes, it supports bootloader-based firmware updates via UART using the built-in ROM bootloader. The bootloader activates on power-up when BOOT0 pin is held high, allowing reprogramming without debug hardware. It supports Flash write/erase operations and CRC verification of incoming data, but does not enable dual-bank swap during active execution - that requires application-level control of bank switching.

What is the maximum operating temperature range for this MCU?

The CY9BF122LPMC-G-MNE2 is rated for industrial temperature range: –40 °C to +85 °C ambient. This is confirmed in Section 12.2 "Recommended Operating Conditions" of the datasheet (Document No. 002-05655 Rev. *K), with derating applied above 70 °C for sustained 72 MHz operation under worst-case VCC and load conditions.

Can the 10-bit DAC outputs drive analog actuators directly?

No, the two 10-bit R-2R DACs provide voltage outputs only (no current drive capability). Each DAC output has typical 1 kΩ source impedance and must be buffered with an external op-amp to drive loads below 10 kΩ. The datasheet specifies ±1 LSB INL and monotonicity, but no guaranteed output current - making direct actuator drive unsafe without amplification.

Is the unique 41-bit ID accessible via standard debug interface?

Yes, the factory-programmed 41-bit unique ID is readable via SWD using the CoreSight ROM Table and Debug Port APB access. It resides at address 0x000000E0 in the system control space and is accessible in both run and debug modes without special unlock sequences - enabling secure device authentication and license binding in production firmware.

CY9BF122LPMC-G-MNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
FM3 MB9B120M
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
72MHz
Connectivity:
CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 23x12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9BF122LPMC-G-MNE2 FAQ

1.How can I place an order for CY9BF122LPMC-G-MNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9BF122LPMC-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9BF122LPMC-G-MNE2 reliable?

The price and inventory of CY9BF122LPMC-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF122LPMC-G-MNE2 is usually 5 days.

3.What payment methods are accepted for CY9BF122LPMC-G-MNE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF122LPMC-G-MNE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9BF122LPMC-G-MNE2?

CY9BF122LPMC-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9BF122LPMC-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9BF122LPMC-G-MNE2?

For technical support, including CY9BF122LPMC-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF122LPMC-G-MNE2 requirements.

6.How does Aetrix verify that CY9BF122LPMC-G-MNE2 is sourced from the original manufacturer or authorized distributors?

All CY9BF122LPMC-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF122LPMC-G-MNE2 meets industry standards.

7.What is the process for return or replacement of CY9BF122LPMC-G-MNE2?

All CY9BF122LPMC-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF122LPMC-G-MNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9BF122LPMC-G-MNE2 part is unused and in its original packaging.

Return procedure for CY9BF122LPMC-G-MNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY9BF122LPMC-G-MNE2 Tags

  • CY9BF122LPMC-G-MNE2
  • CY9BF122LPMC-G-MNE2 PDF
  • CY9BF122LPMC-G-MNE2 Datasheet
  • CY9BF122LPMC-G-MNE2 Specifications
  • CY9BF122LPMC-G-MNE2 Images
  • Infineon Technologies
  • Infineon Technologies CY9BF122LPMC-G-MNE2
  • Buy CY9BF122LPMC-G-MNE2
  • CY9BF122LPMC-G-MNE2 Price
  • CY9BF122LPMC-G-MNE2 Distributor
  • CY9BF122LPMC-G-MNE2 Supplier
  • CY9BF122LPMC-G-MNE2 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER