Infineon Technologies CY9BF124MPMC1-G-JNE2
- Part No.:
- CY9BF124MPMC1-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY9BF124MPMC1-G-JNE2.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,103
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF124MPMC1-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), 72 MHz max CPU frequency, and integrated peripherals including UART/CSIO/I²C/LIN, 26-channel 12-bit ADC, dual DAC, RTC, and eight base timers. It targets low-power embedded motor control and industrial sensor nodes requiring real-time responsiveness and code security.
For engineers reviewing the CY9BF124MPMC1-G-JNE2 datasheet, CY9BF124MPMC1-G-JNE2 pinout, CY9BF124MPMC1-G-JNE2 application, or CY9BF124MPMC1-G-JNE2 equivalent, key selection criteria include dual-bank Flash for safe firmware updates, 5 V-tolerant I/O on selected pins, hardware CRC accelerator for data integrity, and six low-power modes supporting sub-μA deep standby with RTC retention.
Technical Context
This MCU implements the Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features dual-operation Flash enabling concurrent read-erase-write across upper (240 KB) and lower (16 KB main + 32 KB work) banks, and split SRAM architecture (SRAM0 on I/D bus, SRAM1 on system bus) to reduce core-peripheral contention.
The peripheral set includes eight-channel DMA with 32-bit addressing, quadrature position/revolution counters (QPRC) with 16-bit position/revolution registers and configurable A/B/Z input edge detection, and multi-function serial interfaces supporting UART (with RTS/CTS flow control on ch.4), LIN 2.1 (master/slave, programmable break field), CSIO, and I²C (100/400 kbps).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, up to 72 MHz - enables deterministic real-time execution with Thumb-2 instruction set and low-latency interrupt handling. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower main + 32 KB lower work), 0-wait-state read - supports background firmware update without halting application code. |
| SRAM | 32 KB total: 16 KB SRAM0 (I/D bus), 16 KB SRAM1 (system bus) - isolates core fetches from peripheral DMA transfers to prevent bus contention. |
| ADC | 26-channel 12-bit SAR ADC, 0.8 μs conversion @ 5 V, FIFO support (16-step scan / 4-step priority) - suitable for high-speed analog monitoring in motor control loops. |
| Low-Power Modes | Six modes: Sleep, Timer, RTC, Stop, Deep Standby RTC, Deep Standby Stop - enables sub-1 μA current draw in Deep Standby with RTC active and RAM retention option. |
| Clock Sources | Five sources: 4–48 MHz external main clock, 32.768 kHz sub-clock, 4 MHz/100 kHz internal CR oscillators, Main PLL - provides flexible timing architecture for precision timing and power optimization. |
| Security & Integrity | Flash code protection, 41-bit unique ID, CCITT CRC16/IEEE-802.3 CRC32 hardware accelerator - reduces CPU load for firmware validation and communication checksumming. |
Pinout & Package
Package: 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3. Pin functions are fully relocatable via port mapping registers, enabling flexible PCB layout and peripheral assignment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core and I/O supply (2.7–5.5 V); separate VCC/VSS pairs per port group reduce noise coupling and improve EMI resilience. |
| XTAL / EXTAL | Main oscillator input/output | Accepts 4–48 MHz crystal or external clock; enables precise timing for USB, communication, and motor control synchronization. |
| RTC_XTAL / RTC_EXTAL | Sub-clock oscillator input/output | 32.768 kHz crystal interface dedicated to RTC and low-power wake-up timers; operates independently during deep sleep. |
| SWDIO / SWCLK | Serial Wire Debug interface | 2-pin debug port supporting full JTAG/SWD functionality for in-circuit programming and real-time trace without dedicated reset pin. |
| P00–P77 | General-purpose I/O ports | Up to 65 high-speed GPIOs; 5 V-tolerant on designated pins (e.g., P00–P07, P10–P17); port relocate function allows dynamic peripheral pin assignment. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables over-the-air (OTA) firmware updates with zero downtime: one bank executes while the other is erased/written. |
| Port relocation capability | Allows runtime remapping of peripheral functions (UART, LIN, QPRC, etc.) to any compatible GPIO, simplifying board layout and design reuse. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU, reducing latency in secure boot and CAN/LIN message validation. |
| Quadrature Position Counter (QPRC) | Two independent 16-bit position/revolution counters with configurable A/B/Z edge detection - eliminates need for external encoder interface ICs in motor feedback systems. |
| Multi-mode low-power operation | Deep Standby RTC mode draws <1.5 μA while retaining RTC time and optionally SRAM contents - extends battery life in remote sensor nodes. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
|
Use Scenario: Closed-loop BLDC motor drive with Hall-effect or encoder feedback, thermal monitoring, and field-oriented control (FOC) execution. IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithm, managing PWM generation, capturing quadrature encoder signals via QPRC, and sampling current/voltage via 12-bit ADC. Use Value: Integrated QPRC and 26-channel ADC eliminate external signal conditioning ICs; dual-bank Flash enables safe firmware updates during maintenance windows. |
Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and CO₂ data, transmitting via UART-to-LoRaWAN gateway. IC Role / Device Role / Timing Role: System-on-chip host managing sensor I²C reads, RTC-based wakeup scheduling, low-power UART transmission, and CRC-secured packet generation. Use Value: Deep Standby RTC mode (<1.5 μA) extends 2-year battery life; hardware CRC32 ensures reliable OTA configuration updates over lossy wireless links. |
| Automotive Body Control Module | Home Appliance Controller |
|
Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN communication to central body ECU. IC Role / Device Role / Timing Role: LIN 2.1 master node generating break fields and handling slave responses, driving H-bridge drivers via PWM, and monitoring switch inputs. Use Value: On-chip LIN transceiver support (via GPIO + external transceiver) and programmable break delimiter (1–4 bit) ensure compliance with OEM-specific LIN timing requirements. |
Use Scenario: Washing machine main controller coordinating motor speed, water valve actuation, temperature sensing, and user interface display. IC Role / Device Role / Timing Role: Central MCU running state machine, generating variable-frequency PWM for inverter-driven motor, reading thermistor ADC channels, and managing UART debug output. Use Value: 5 V-tolerant GPIOs interface directly with legacy appliance sensors/actuators; dual-bank Flash allows factory reprogramming without removing MCU from PCB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit Arm Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash; lacks QPRC and LIN protocol engine. | Requires external logic for encoder counting; LIN must be implemented in software with higher CPU overhead. | Choose when larger SRAM and broader ecosystem support outweigh need for hardware LIN/QPRC. |
| RA4M1 (R7FA4M1AB3CFM) | 48 MHz Cortex-M4F, 256 KB Flash, 32 KB SRAM, no dual-bank Flash; includes capacitive touch IP but no LIN/QPRC. | Superior floating-point performance for advanced filtering; lacks native LIN and quadrature counter hardware. | Prefer for sensor fusion or audio processing; avoid if LIN bus integration or encoder feedback is mandatory. |
Compared with STM32F103VCT6 and RA4M1, CY9BF124MPMC1-G-JNE2 uniquely delivers hardware-accelerated LIN 2.1 and QPRC alongside dual-bank Flash-critical for automotive body electronics and motorized appliances where firmware safety and real-time encoder processing are non-negotiable.
Availability
CY9BF124MPMC1-G-JNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, automotive body electronics, and home appliance controllers requiring stable component supply and long-term lifecycle assurance.
Supply support for CY9BF124MPMC1-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions with strong industrial and automotive qualifications.
This device belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power embedded control applications in motor drives, building automation, and consumer appliances where reliability and peripheral integration are critical.
FAQ
Does CY9BF124MPMC1-G-JNE2 support true hardware LIN 2.1 protocol handling?
Yes. The MCU integrates dedicated LIN protocol logic supporting automatic break field generation (13–16 bit length), break delimiter (1–4 bit), and error detection (parity, framing, overrun). It operates in both master and slave modes without CPU intervention, reducing firmware complexity and jitter in automotive body networks.
What is the maximum operating voltage and I/O tolerance for this MCU?
The device operates from 2.7 V to 5.5 V on VCC. Selected GPIO pins-including P00–P07 and P10–P17-are explicitly rated 5 V tolerant per the "I/O Circuit Type" table in the datasheet, enabling direct interfacing with legacy 5 V sensors and actuators without level shifters.
Can the dual-bank Flash be used for atomic firmware updates in the field?
Yes. The dual-bank architecture allows one bank (e.g., upper 240 KB) to run active firmware while the other (lower 16 KB main + 32 KB work) is erased and rewritten. Bootloader logic can validate new firmware and swap execution banks atomically using the Flash control registers and reset vector remapping.
Is the RTC functional in all low-power modes?
No. The RTC remains active only in RTC mode and Deep Standby RTC mode. It is disabled in Sleep, Timer, Stop, and Deep Standby Stop modes. In Deep Standby RTC mode, it continues counting with typical current draw <1.5 μA and optional SRAM retention, making it ideal for calendar-aware wake-up in battery-powered devices.
CY9BF124MPMC1-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM3 MB9B120M
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 26x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF124MPMC1-G-JNE2 FAQ
1.How can I place an order for CY9BF124MPMC1-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF124MPMC1-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF124MPMC1-G-JNE2 reliable?
The price and inventory of CY9BF124MPMC1-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF124MPMC1-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF124MPMC1-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF124MPMC1-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF124MPMC1-G-JNE2?
CY9BF124MPMC1-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF124MPMC1-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF124MPMC1-G-JNE2?
For technical support, including CY9BF124MPMC1-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF124MPMC1-G-JNE2 requirements.
6.How does Aetrix verify that CY9BF124MPMC1-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF124MPMC1-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF124MPMC1-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF124MPMC1-G-JNE2?
All CY9BF124MPMC1-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF124MPMC1-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF124MPMC1-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9BF124MPMC1-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF124MPMC1-G-JNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

