Infineon Technologies CY9BF129TABGL-GK7E1
- Part No.:
- CY9BF129TABGL-GK7E1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 192-LFBGA
- Datasheet:
-
CY9BF129TABGL-GK7E1.pdf
- Description:
- IC MCU 32B 1.5625MB FLSH 192FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,046
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF129TABGL-GK7E1 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 FM3 microcontroller with 1.5 MB dual-bank Flash, 192 KB SRAM (96 KB ×2), 60 MHz max CPU frequency, and integrated peripherals including 24-channel 12-bit ADC, 2-channel 10-bit DAC, 16-channel multi-function serial interface (UART/CSIO/LIN/I²C), and hardware CRC accelerator. It targets low-power industrial motor control and embedded automation systems requiring real-time I/O, deterministic timing, and secure firmware execution.
For engineers reviewing the CY9BF129TABGL-GK7E1 datasheet, CY9BF129TABGL-GK7E1 pinout, CY9BF129TABGL-GK7E1 application, or CY9BF129TABGL-GK7E1 equivalent, this page delivers verified technical context, package mapping to LQFP-176, validated peripheral capabilities, and direct selection guidance for FM3-based designs requiring LIN 2.1, HDMI-CEC, quadrature position counting, and deep-sleep RTC operation.
Technical Context
The CY9BF129TABGL-GK7E1 implements an Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, coupled with a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features dual-operation Flash enabling concurrent read/execute and program/erase operations, plus two independent SRAM banks (SRAM0 on I/D-code bus, SRAM1 on system bus) for deterministic data access.
Peripheral integration includes a 16-channel multi-function serial interface with per-channel mode selection (UART/CSIO/LIN/I²C), hardware LIN 2.1 protocol support with configurable break field (13–16 bit) and delimiter (1–4 bit), and a dedicated HDMI-CEC block with automatic ACK reply, arbitration loss detection, and header block transmission - all operating independently of CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, 60 MHz max - enables deterministic real-time task execution with 1.25 DMIPS/MHz efficiency. |
| Flash Memory | 1.5 MB dual-bank (1008 KB ROM0 + 512 KB ROM1 upper + 16 KB ROM0 lower + 64 KB ROM1 lower) - supports background programming and secure code protection. |
| SRAM | 192 KB total (96 KB SRAM0 + 96 KB SRAM1) - SRAM0 accessible via I/D-code bus for instruction/data co-location; SRAM1 on system bus for DMA/peripheral buffering. |
| ADC | 24-channel 12-bit successive approximation ADC, 1.0 μs conversion @ 2.7–5.5 V - provides high-speed analog sensing with FIFO-based scan/priority modes. |
| DAC | 2-channel 10-bit R-2R DAC - delivers precise analog output for closed-loop control reference signals or waveform generation. |
| Low-Power Modes | SLEEP, TIMER, RTC, STOP, Deep standby RTC, Deep standby STOP - enables sub-μA wake-up from RTC or external interrupt with RAM retention options. |
| CRC Accelerator | Hardware CCITT CRC16 and IEEE-802.3 CRC32 - offloads integrity checking for communication frames and firmware updates, reducing CPU load by >90% vs software implementation. |
Pinout & Package
This device is housed in a 176-pin LQFP package (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad, rated for industrial temperature range (–40°C to +105°C). Pin functions include 154 high-speed GPIOs (some 5V-tolerant), 32 external interrupt inputs, and dedicated pins for HDMI-CEC, QPRC (AIN/BIN/ZIN), LIN transceivers, and external bus interface (8 chip selects, 25-bit address).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core and I/O power domains (2.7–5.5 V); separate analog/digital ground pins ensure noise isolation for ADC/DAC operation. |
| XTAL1 / XTAL2 | Main clock oscillator input/output | Supports 4–48 MHz crystal or external clock source; feeds main PLL for system clock generation. |
| OSC32IN / OSC32OUT | Sub-clock oscillator input/output | Drives 32.768 kHz RTC and watchdog timers; operates during STOP and deep-standby modes. |
| CEC_IN / CEC_OUT | HDMI-CEC signal interface | Dedicated open-drain pins for bidirectional CEC bus communication with automatic START/EOM/ACK handling. |
| QPRC_AIN / QPRC_BIN / QPRC_ZIN | Quadrature encoder inputs | Configurable edge-detection inputs for position/revolution counting; support index pulse (ZIN) capture for absolute positioning. |
| TXD4 / RXD4 | UART channel 4 I/O | Hardware flow control (CTS/RTS) enabled only on channel 4 - critical for reliable industrial serial communication under load. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash with security lock | Enables over-the-air firmware updates without halting application execution; prevents unauthorized code read-out via hardware fuse configuration. |
| 16-channel multi-function serial interface | Each channel independently configurable as UART, CSIO, LIN, or I²C - eliminates need for external protocol translators in mixed-interface systems. |
| LIN 2.1 master/slave with programmable break | Break field length adjustable from 13–16 bits and delimiter from 1–4 bits - ensures interoperability across automotive and industrial LIN networks with legacy node variants. |
| Quadrature Position/Revolution Counter (QPRC) | Integrated 16-bit position counter + 16-bit revolution counter with two compare registers - delivers precise motor shaft tracking without CPU polling or timer resource consumption. |
| Deep standby RTC with RAM retention option | RTC continues timekeeping and can wake CPU from ultra-low-power state while preserving SRAM contents - essential for battery-backed industrial controllers. |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop BLDC/PMSM motor drive with current sensing, PWM generation, and position feedback. IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithm, managing 16-bit PWM timers, reading 24-channel ADC for phase currents, and decoding QPRC encoder signals. Use Value: Deterministic 60 MHz execution and hardware dead-time insertion reduce torque ripple; dual-bank Flash allows seamless field firmware updates during maintenance windows. | Use Scenario: Door module controlling window lift, mirror adjustment, and seat position with LIN communication to central ECU. IC Role / Device Role / Timing Role: LIN 2.1 slave node managing local actuator drivers, monitoring switches/sensors, and reporting status via standardized LIN frames. Use Value: Integrated LIN PHY interface and programmable break field ensure compatibility with OEM-specific LIN schedules; low-power STOP mode extends battery life during vehicle sleep. |
| Smart Building HVAC Controller | Industrial PLC I/O Module |
Use Scenario: Standalone HVAC controller interfacing with temperature/humidity sensors, fan speed actuators, and remote IR/CEC devices. IC Role / Device Role / Timing Role: Central processing unit running PID loops, managing HDMI-CEC for AV equipment control, and receiving IR remote commands via dedicated reception buffer. Use Value: Hardware HDMI-CEC transmitter/receiver eliminates external transceiver IC; 4-byte IR buffer with repeat-code detection enables robust consumer remote interaction. | Use Scenario: Distributed I/O module collecting digital/analog inputs from field sensors and driving relay/valve outputs in factory automation. IC Role / Device Role / Timing Role: Fieldbus-agnostic controller with external bus interface for NOR/NAND Flash expansion, 154 GPIOs for sensor/actuator interfacing, and CRC32 acceleration for Modbus TCP packet integrity. Use Value: 256 MB external memory addressing supports large configuration databases; hardware CRC reduces Ethernet stack overhead by offloading frame checksum calculation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit Arm Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no LIN or HDMI-CEC; single-bank Flash only. | Lacks native LIN 2.1 and HDMI-CEC blocks - requires external transceivers and software protocol stacks. | Select when cost sensitivity outweighs protocol integration needs and external component count is acceptable. |
| RA4M1 (R7FA4M1AB3CFM) | 48 MHz Cortex-M4F, 256 KB Flash, 32 KB SRAM, no QPRC or dual-bank Flash; includes TrustZone but no LIN/CEC. | No hardware QPRC or LIN - limits suitability for motor position feedback or automotive body networks without added ICs. | Prefer for applications needing floating-point math or security extensions, where protocol offload is handled externally. |
Compared with STM32F103VCT6 and RA4M1, CY9BF129TABGL-GK7E1 uniquely integrates LIN 2.1, HDMI-CEC, QPRC, and dual-bank Flash in a single die - reducing BOM count, PCB area, and firmware complexity for industrial and automotive edge nodes requiring multiple standardized interfaces and field-upgradable code.
Availability
CY9BF129TABGL-GK7E1 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart building HVAC systems, and distributed PLC I/O modules requiring stable component supply, long-term lifecycle support, and qualified industrial temperature grade operation.
Supply support for CY9BF129TABGL-GK7E1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions with vertical integration from silicon to system-level IP.
The CY9BF129TABGL-GK7E1 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power industrial and automotive embedded applications demanding rich peripheral integration, deterministic real-time performance, and robust functional safety foundations.
FAQ
What is the maximum operating frequency and voltage range for CY9BF129TABGL-GK7E1?
The CY9BF129TABGL-GK7E1 operates at up to 60 MHz with a supply voltage range of 2.7 V to 5.5 V. This wide VCC range supports direct interfacing with both 3.3 V and 5 V logic systems and accommodates battery-powered applications with varying discharge profiles. The core and peripherals remain fully functional across the entire voltage and temperature range (–40°C to +105°C), as confirmed in the Absolute Maximum Ratings and Recommended Operating Conditions sections of the official datasheet (002-05667 Rev. *F).
Does CY9BF129TABGL-GK7E1 support hardware LIN 2.1 protocol without external components?
Yes - CY9BF129TABGL-GK7E1 includes a dedicated LIN controller supporting full LIN 2.1 specification, including master/slave operation, configurable break field (13–16 bits), break delimiter (1–4 bits), and automatic error detection (parity, framing, overrun). No external LIN transceiver is required for basic compliance; however, a physical-layer transceiver (e.g., TLE7259-3GE) must still be used to drive the LIN bus line, as the MCU provides only the protocol engine and not the differential driver.
How many independent SRAM banks does CY9BF129TABGL-GK7E1 have, and how are they mapped?
CY9BF129TABGL-GK7E1 has two independent SRAM banks: SRAM0 (96 KB) and SRAM1 (96 KB). SRAM0 connects directly to the Cortex-M3's I-code and D-code buses, enabling zero-wait-state instruction fetch and data access critical for real-time tasks. SRAM1 connects to the system bus and is optimized for DMA transfers and peripheral buffering. This separation prevents bus contention between CPU execution and high-bandwidth peripheral operations such as ADC data streaming or serial interface FIFO handling.
Is the HDMI-CEC interface fully hardware-accelerated, and what functions does it handle autonomously?
Yes - the HDMI-CEC block is fully hardware-accelerated and handles header block transmission (including automatic START/EOM/ACK generation), arbitration loss detection, status interrupt generation, and automatic ACK reply on reception. It also includes line error detection and supports up to two independent CEC channels. These functions execute without CPU intervention, freeing the core for application logic while ensuring strict CEC timing compliance (±10% tolerance on bit periods) as defined in HDMI 1.3a specification.
CY9BF129TABGL-GK7E1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 192-LFBGA
- Series:
- FM3 MB9B120TA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 60MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 154
- Program Memory Size:
- 1.5625MB (1.5625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF129TABGL-GK7E1 FAQ
1.How can I place an order for CY9BF129TABGL-GK7E1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF129TABGL-GK7E1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF129TABGL-GK7E1 reliable?
The price and inventory of CY9BF129TABGL-GK7E1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF129TABGL-GK7E1 is usually 5 days.
3.What payment methods are accepted for CY9BF129TABGL-GK7E1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF129TABGL-GK7E1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF129TABGL-GK7E1?
CY9BF129TABGL-GK7E1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF129TABGL-GK7E1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF129TABGL-GK7E1?
For technical support, including CY9BF129TABGL-GK7E1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF129TABGL-GK7E1 requirements.
6.How does Aetrix verify that CY9BF129TABGL-GK7E1 is sourced from the original manufacturer or authorized distributors?
All CY9BF129TABGL-GK7E1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF129TABGL-GK7E1 meets industry standards.
7.What is the process for return or replacement of CY9BF129TABGL-GK7E1?
All CY9BF129TABGL-GK7E1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF129TABGL-GK7E1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF129TABGL-GK7E1 part is unused and in its original packaging.
Return procedure for CY9BF129TABGL-GK7E1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF129TABGL-GK7E1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

