My Inquiry
My Account
Infineon Technologies CY9BF167RPMC-G-MNE2
- Part No.:
- CY9BF167RPMC-G-MNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 120-LQFP
- Datasheet:
-
CY9BF167RPMC-G-MNE2.pdf
- Description:
- IC MCU 32BIT 800KB FLASH 120LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,720
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF167RPMC-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M4F microcontroller with 1024 KB MainFlash, 64 KB SRAM0, and integrated motor control peripherals including 8-channel base timers, 24-channel 12-bit ADC, and quadrature position/revolution counters. It operates up to 160 MHz with FPU, MPU, and dual watchdogs, targeting real-time embedded motor control systems.
For engineers reviewing the CY9BF167RPMC-G-MNE2 datasheet, CY9BF167RPMC-G-MNE2 pinout, CY9BF167RPMC-G-MNE2 application, or CY9BF167RPMC-G-MNE2 equivalent, key selection criteria include Flash/SRAM partitioning, 5V-tolerant I/O support, RTC+QPRC co-timing capability, and dual-mode low-power operation (STOP/deep standby with RAM retention).
Technical Context
This MCU implements a deterministic real-time architecture with three independent SRAM banks (SRAM0 on I/D-code bus; SRAM1/SRAM2 on system bus), enabling concurrent CPU and DMA access without contention. Its dual watchdog system separates safety-critical monitoring (hardware watchdog clocked by 100 kHz internal CR oscillator, active in STOP mode) from application-level supervision (software watchdog).
The external bus interface supports 256 MB address space across 9 chip selects with configurable scramble for NOR/NAND/SDRAM, while the DSTC (Descriptor System Data Transfer Controller) provides 128-channel zero-CPU-overhead data movement-critical for high-throughput sensor fusion or motor commutation sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F @ up to 160 MHz with FPU and DSP instruction set |
| Flash Memory | 1024 KB MainFlash + 32 KB WorkFlash; zero-wait-state access ≤72 MHz |
| SRAM | 64 KB SRAM0 (I/D bus) + 32 KB SRAM1 + 32 KB SRAM2 (system bus) |
| Analog Peripherals | 24-channel 12-bit SAR ADC (0.5 μs conversion @ 5 V); 2-channel 12-bit R-2R DAC |
| Timers & Counters | 8-channel base timer (PWM/PPG/reload/PWC); 2× QPRC (16-bit position + 16-bit revolution) |
| Communication | Up to 8 serial channels: UART/CSIO/LIN/I²C (Fm+ up to 1 Mbps on ch.3/ch.7) |
| Power & Safety | 2.7–5.5 V operation; dual LVD (interrupt/reset); hardware/software watchdogs; CRC16/CRC32 accelerator |
Pinout & Package
CY9BF167RPMC-G-MNE2 is housed in a 120-pin LQFP package (14 mm × 14 mm, 0.4 mm pitch) with 100 high-speed general-purpose I/O pins, including 5V-tolerant inputs on designated signals per "I/O Circuit Type" specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Core power supply / ground | Dual power domain: VCC (2.7–5.5 V) powers core/peripherals; separate VBAT rail supports RTC retention |
| XTAL / EXTAL | Main crystal oscillator input/output | 4–48 MHz external crystal interface; supports clock supervisor (CSV) failure detection |
| RTC_XIN / RTC_XOUT | Real-time clock crystal interface | 32.768 kHz crystal connection; enables calendar timekeeping during deep standby with RAM retention |
| AIN0–AIN1 / BIN0–BIN1 / ZIN0–ZIN1 | Quadrature encoder inputs | Dedicated differential-capable inputs for two independent QPRC units; edge-detect configuration per channel |
| AD0–AD23 | Analog input channels | 24 single-ended or 12 differential ADC inputs; FIFO buffering supports scan/priority conversion modes |
Key Features
| Feature | Design Value |
|---|---|
| Flash Accelerator System | Enables zero-wait-state execution at ≤72 MHz and maintains equivalent performance up to 160 MHz via trace buffer and prefetch logic |
| Descriptor-based DSTC | 128-channel DMA engine that offloads CPU for peripheral-to-memory transfers using preconfigured memory descriptors |
| Motor Control Timer Block | Integrated dead-time insertion, DTIF emergency stop interrupt, and A/D activation compare for synchronized PWM-triggered sampling |
| Scramble Function | Configurable per 4 MB external memory region (0x6000_0000–0xDFFF_FFFF) with dual key support for NAND/NOR security |
| Low-Power Mode Flexibility | Six distinct states: SLEEP/TIMER/RTC/STOP/deep standby RTC (with/without RAM retention)/deep standby STOP (with/without RAM retention) |
Applications
| Industrial Motor Drive | Automotive Body Control Module |
|---|---|
Use Scenario: Closed-loop BLDC/PMSM control in HVAC blowers or industrial pumps requiring precise timing, current sensing, and fault response. IC Role / Device Role / Timing Role: Real-time execution host with QPRC for rotor position, ADC-triggered PWM, and DTIF-driven emergency shutdown. Use Value: Sub-μs interrupt latency and deterministic 6.25 ns timer resolution enable <1% torque ripple at 20 kHz switching frequency. | Use Scenario: Central body controller managing door locks, window lifts, lighting, and LIN-connected sensors in 12 V vehicle architectures. IC Role / Device Role / Timing Role: LIN master node with integrated LIN 2.1 protocol engine, RTC for event scheduling, and LVD2 auto-reset on brownout. Use Value: Single-chip integration eliminates external LIN transceiver and reduces BOM count by 3 components versus discrete solutions. |
| Smart Energy Metering | Factory Automation I/O Hub |
Use Scenario: Polyphase electricity meter with harmonic analysis, tamper detection, and secure firmware updates over isolated RS-485. IC Role / Device Role / Timing Role: Secure computation engine with CRC32 accelerator for firmware integrity, RTC for billing timestamping, and 5V-tolerant GPIO for optocoupler interfacing. Use Value: Built-in CCITT CRC16 and IEEE-802.3 CRC32 accelerators reduce software overhead by >90% versus bit-banged implementations. | Use Scenario: Distributed I/O module collecting analog sensor data (temperature, pressure) and driving solenoids/relays across 10+ field devices. IC Role / Device Role / Timing Role: High-throughput data concentrator with 24-channel ADC scanning, SD card logging, and dual CAN/LIN interfaces. Use Value: Concurrent SRAM banks allow simultaneous ADC acquisition (SRAM1) and SD write buffering (SRAM2) without CPU arbitration delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit motor control microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H743VI | Higher core speed (480 MHz), dual-core (Cortex-M7/M4), but no integrated QPRC or LIN PHY; requires external transceivers | Better for AI-edge inference + motor control fusion; lacks native LIN 2.1 stack and encoder counter hardware | Select when needing >200 DMIPS compute headroom and external peripheral flexibility outweighs integrated motor timing blocks |
| RA6M5GFP | Same Cortex-M4F core, 1MB Flash, but only 32KB SRAM total; no WorkFlash partitioning or DSTC descriptor engine | Stronger security (TrustZone, SCE7), weaker real-time determinism due to shared SRAM and no QPRC | Select for secure OTA update scenarios where cryptographic acceleration matters more than sub-μs motor loop jitter |
Compared with STM32H743VI and RA6M5GFP, CY9BF167RPMC-G-MNE2 delivers superior deterministic motor control via dedicated QPRC, DTIF, and A/D activation compare-reducing software overhead by eliminating polling and timer synchronization code required on alternatives.
Availability
CY9BF167RPMC-G-MNE2 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body controllers, smart energy meters, and factory automation I/O hubs requiring stable component supply, long-term lifecycle support, and qualified automotive-grade variants.
Supply support for CY9BF167RPMC-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions with vertical integration from silicon to system-level IP.
CY9BF167RPMC-G-MNE2 belongs to the FM4 family of high-performance 32-bit microcontrollers designed specifically for deterministic real-time control in motor drive, industrial automation, and automotive body electronics applications.
FAQ
What is the maximum operating frequency and does it require external clock conditioning?
CY9BF167RPMC-G-MNE2 operates at up to 160 MHz using its internal Main PLL, which accepts 4–48 MHz external crystal input (XTAL/EXTAL). No external clock conditioner is needed-the PLL includes built-in jitter suppression and dynamic frequency scaling registers accessible via system control registers.
How is Flash memory protected against unauthorized readout or firmware tampering?
Code protection uses hardware-enforced lock bits on both MainFlash and WorkFlash, preventing JTAG/SWJ-DP readout and flash programming outside secure boot sequences. The scramble function further obfuscates external NOR/NAND reads using configurable 4 MB region keys-requiring dedicated software library initialization before use.
Does this MCU support functional safety standards such as ISO 26262 ASIL-B?
CY9BF167RPMC-G-MNE2 is not certified to ISO 26262 ASIL-B. It includes safety features like dual watchdogs, MPU, CRC accelerators, and clock supervisors-but lacks documented FMEDA reports, diagnostic coverage metrics, or certified safety libraries required for ASIL-B compliance.
Can the QPRC operate independently while the CPU is in STOP mode?
Yes-QPRC channels continue counting quadrature encoder pulses during STOP mode using the sub-clock (32.768 kHz) or high-speed internal CR oscillator. Position and revolution counters retain values, and overflow/interrupt events wake the CPU without requiring full restart of peripheral clocks.
CY9BF167RPMC-G-MNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 120-LQFP
- Series:
- FM4 MB9B160R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 800KB (800K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF167RPMC-G-MNE2 FAQ
1.How can I place an order for CY9BF167RPMC-G-MNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF167RPMC-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF167RPMC-G-MNE2 reliable?
The price and inventory of CY9BF167RPMC-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF167RPMC-G-MNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF167RPMC-G-MNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF167RPMC-G-MNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF167RPMC-G-MNE2?
CY9BF167RPMC-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF167RPMC-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF167RPMC-G-MNE2?
For technical support, including CY9BF167RPMC-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF167RPMC-G-MNE2 requirements.
6.How does Aetrix verify that CY9BF167RPMC-G-MNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF167RPMC-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF167RPMC-G-MNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF167RPMC-G-MNE2?
All CY9BF167RPMC-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF167RPMC-G-MNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF167RPMC-G-MNE2 part is unused and in its original packaging.
Return procedure for CY9BF167RPMC-G-MNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF167RPMC-G-MNE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
