Infineon Technologies CY9BF167RPMC-GNE2
- Part No.:
- CY9BF167RPMC-GNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 120-LQFP
- Datasheet:
-
CY9BF167RPMC-GNE2.pdf
- Description:
- IC MCU 32BIT 800KB FLASH 120LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,850
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF167RPMC-GNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M4F microcontroller with FPU, 1024 KB MainFlash, 64 KB SRAM0, and integrated motor control peripherals including 8-channel base timers, 24-channel 12-bit ADC, and QPRC for encoder position sensing. It operates up to 160 MHz and supports LIN 2.1, UART, I²C, and CSIO interfaces for industrial motor drives and embedded control systems.
For engineers reviewing the CY9BF167RPMC-GNE2 datasheet, CY9BF167RPMC-GNE2 pinout, CY9BF167RPMC-GNE2 application, or CY9BF167RPMC-GNE2 equivalent, key selection criteria include Flash/SRAM partitioning (MainFlash + 32 KB WorkFlash), dual watchdog architecture (hardware + software), RTC with leap-year support, VCC range of 2.7–5.5 V, and 120-pin LQFP package with 5V-tolerant I/O pins.
Technical Context
The CY9BF167RPMC-GNE2 implements a dual-bus memory architecture: MainFlash (1024 KB) with accelerator enabling zero-wait access up to 72 MHz, and separate 32 KB WorkFlash with configurable wait states (0–6 cycles) scaling with clock frequency. Its peripheral subsystem integrates DSTC (128-channel descriptor-based DMA), CRC accelerator (CRC16/32), and SD card interface compliant with SD Host Controller Standard v3.00.
Motor control capability is enabled by two multi-function timer units supporting PWM generation, dead-time insertion, A/D activation triggers, and DTIF emergency stop interrupts. Real-time operation is reinforced by independent RTC (with calendar, alarm, and wake-up), dual watchdogs (CR-based hardware WDT active in STOP mode), and six low-power modes including Deep Standby RTC with optional RAM retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM® Cortex®-M4F @ up to 160 MHz with FPU and DSP instructions |
| Flash Memory | 1024 KB MainFlash + 32 KB WorkFlash; MainFlash supports zero-wait access ≤72 MHz |
| SRAM | 64 KB SRAM0 (I/D-code bus), 32 KB SRAM1, 32 KB SRAM2 (System bus) |
| Analog Peripherals | 24-channel 12-bit SAR ADC (0.5 µs conversion @ 5 V); 2-channel 12-bit R-2R DAC |
| Timers & Counters | 8-channel base timer (PWM/PPG/reload/PWC); 2× QPRC (16-bit position + 16-bit revolution) |
| Communication | Up to 8 serial channels: UART, CSIO (SPI), LIN 2.1, I²C (Fast-mode Plus up to 1 Mbps) |
| Power & Safety | VCC = 2.7–5.5 V; dual LVD (interrupt/reset); Clock Supervisor (OSC failure/frequency anomaly detection) |
Pinout & Package
This device is housed in a 120-pin LQFP package (14 mm × 14 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions are defined across multiple power domains (VCC, VSS, VBAT), clock inputs (XIN/XOUT, SUBXIN/SUBXOUT), reset (INITX), debug (SWDIO/SWCLK), and configurable I/O groups supporting peripheral relocation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INITX | Reset Input | Active-low external reset trigger; initiates power-on reset sequence |
| XIN / XOUT | Main Oscillator Interface | Connects to 4–48 MHz crystal or external clock source for main PLL input |
| SUBXIN / SUBXOUT | Sub-clock Oscillator | 32.768 kHz crystal interface for RTC and low-power mode timing |
| VBAT | Backup Power Supply | Supplies RTC, 32 kHz oscillator, backup registers (32 bytes), and port circuit during main power loss |
| SWDIO / SWCLK | Debug Interface | Serial Wire Debug I/O and clock; enables JTAG/SWD programming and ETM trace |
| P00–P99 | Configurable I/O Ports | Up to 100 high-speed GPIOs; 5V-tolerant on selected pins; supports peripheral function relocation |
Key Features
| Feature | Design Value |
|---|---|
| Dual Flash Architecture | MainFlash (1024 KB) + WorkFlash (32 KB) enable secure code updates and runtime parameter storage without interrupting execution |
| Descriptor-Based DSTC | 128-channel data transfer controller bypasses CPU for high-throughput peripheral-to-memory transfers (e.g., ADC → SRAM → SD card) |
| Motion Control Timer Units | Two multi-function timer blocks provide synchronized PWM, dead-time, A/D trigger, and DTIF emergency stop for BLDC/PMSM drives |
| Real-Time Clock with Calendar | Full BCD-encoded RTC (Year/Month/Day/Hour/Minute/Second/Weekday) with leap-year correction and alarm interrupt down to minute granularity |
| Hardware CRC Accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU-critical for firmware OTA integrity and SD card data validation |
Applications
| Industrial Motor Drive | Smart Energy Metering |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and industrial pumps. IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms, managing gate drivers via PWM, sampling current/voltage via 24-channel ADC, and triggering emergency stop via DTIF. Use Value: Integrated QPRC and motor timers eliminate external counter ICs; 160 MHz M4F core ensures <5 µs current loop execution time at 20 kHz PWM frequency. | Use Scenario: Multi-tariff electricity meter with real-time billing, tamper detection, and secure firmware updates over PLC or RF. IC Role / Device Role / Timing Role: System-on-chip handling metrology calculations, RTC-based tariff switching, LIN communication with display module, and encrypted OTA update verification via CRC accelerator. Use Value: Dual watchdogs (hardware + software) guarantee fail-safe reset during brown-out; VBAT-backed RTC maintains accurate time stamping during mains outage. |
| Automotive Body Control Module | Factory Automation I/O Hub |
Use Scenario: Centralized door/window/mirror control unit meeting AEC-Q100 Grade 2 requirements (via Infineon qualification). IC Role / Device Role / Timing Role: LIN 2.1 master node coordinating slave ECUs; manages window lift anti-pinch via ADC-sampled motor current and QPRC-based position tracking. Use Value: LIN peripheral includes break field/delimiter programmability (13–16 bit / 1–4 bit) for custom protocol extensions; 5V-tolerant I/O simplifies interface with legacy automotive sensors. | Use Scenario: DIN-rail mounted I/O concentrator aggregating digital inputs, analog sensor readings, and PWM outputs for PLC-connected machinery. IC Role / Device Role / Timing Role: Edge intelligence node performing local PID control, timestamped event logging to SD card, and Ethernet gateway bridging via external PHY. Use Value: External bus interface supports 256 MB address space for NOR flash boot loader and SDRAM buffer; 120-pin LQFP provides ample routing for isolated I/O banks and ESD protection components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RA6M4 Group (R7FA6M4AF3CFB) | 200 MHz Cortex-M4F, 1 MB Flash, 384 KB SRAM, no WorkFlash; lacks QPRC and LIN peripheral | Better for high-throughput HMI or connectivity tasks; unsuitable for encoder-based motion control without external QEI | Select when prioritizing larger unified RAM and USB/Ethernet MAC over motor-specific peripherals |
| STM32H743VI | 480 MHz Cortex-M7, 2 MB Flash, 1 MB RAM, dual-core option; no dedicated LIN peripheral or WorkFlash | Targeted at AI edge inference or complex GUI rendering; requires external LIN transceiver and software protocol stack | Choose for maximum compute throughput and advanced graphics; avoid if LIN 2.1 hardware offload and Flash partitioning are required |
Compared with RA6M4 and STM32H743VI, CY9BF167RPMC-GNE2 delivers optimized integration for cost-sensitive motor control: on-die LIN 2.1, QPRC, and WorkFlash enable deterministic firmware updates and position-critical timing without external components or software overhead.
Availability
CY9BF167RPMC-GNE2 is available at Aetrix Electronics and suitable for industrial motor drives, smart energy metering, and automotive body control modules requiring stable component supply, long-term lifecycle support, and qualified automotive-grade variants.
Supply support for CY9BF167RPMC-GNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions.
The CY9BF167RPMC-GNE2 belongs to the FM4 family of high-performance ARM Cortex-M4F microcontrollers, designed specifically for real-time industrial control, motor drive, and automotive body electronics where deterministic timing, peripheral integration, and functional safety readiness are critical.
FAQ
What is the maximum operating frequency and how is it achieved?
The CY9BF167RPMC-GNE2 achieves 160 MHz operation using its internal Main PLL, which accepts 4–48 MHz input from the main oscillator. The PLL output feeds the CPU, memory, and peripheral clocks. Flash accelerator enables zero-wait-state execution up to 72 MHz; above that, the accelerator maintains equivalent performance via prefetch and trace buffer (16 KB), ensuring deterministic instruction fetch at full speed.
Does this MCU support hardware LIN 2.1 without external transceivers?
Yes - the CY9BF167RPMC-GNE2 includes a fully integrated LIN 2.1 controller with built-in break field generation (13–16 bit), delimiter control (1–4 bit), and automatic checksum calculation. However, an external LIN transceiver (e.g., TLE7259-3GE) is still required to drive the physical bus line, as the MCU's LIN peripheral handles only the protocol layer and signal conditioning.
How does the WorkFlash differ from MainFlash in usage and protection?
WorkFlash (32 KB) is architecturally separate from MainFlash and intended for runtime data storage (e.g., calibration tables, firmware parameters). It shares the same code protection mechanism but uses distinct wait-state configuration per frequency band (0–6 cycles). Unlike MainFlash, WorkFlash supports faster erase/write cycles and is commonly used for over-the-air update staging while MainFlash remains locked for active code execution.
Can the QPRC operate independently during STOP mode?
No - the QPRC requires the peripheral clock domain to be active and is disabled in STOP mode. However, it remains fully operational in SLEEP, TIMER, and RTC low-power modes. For position tracking during deepest sleep, designers must use RTC wake-up intervals to briefly resume QPRC operation, or rely on VBAT-powered peripherals like the RTC itself - but QPRC is not VBAT-powered.
CY9BF167RPMC-GNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 120-LQFP
- Series:
- FM4 MB9B160R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 800KB (800K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF167RPMC-GNE2 FAQ
1.How can I place an order for CY9BF167RPMC-GNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF167RPMC-GNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF167RPMC-GNE2 reliable?
The price and inventory of CY9BF167RPMC-GNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF167RPMC-GNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF167RPMC-GNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF167RPMC-GNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF167RPMC-GNE2?
CY9BF167RPMC-GNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF167RPMC-GNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF167RPMC-GNE2?
For technical support, including CY9BF167RPMC-GNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF167RPMC-GNE2 requirements.
6.How does Aetrix verify that CY9BF167RPMC-GNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF167RPMC-GNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF167RPMC-GNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF167RPMC-GNE2?
All CY9BF167RPMC-GNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF167RPMC-GNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF167RPMC-GNE2 part is unused and in its original packaging.
Return procedure for CY9BF167RPMC-GNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF167RPMC-GNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

