My Inquiry
My Account
Infineon Technologies CY9BF306NBPMC-G-UNE2
- Part No.:
- CY9BF306NBPMC-G-UNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY9BF306NBPMC-G-UNE2.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,448
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF306NBPMC-G-UNE2 from Infineon is a 32-bit ARM Cortex-M3 microcontroller with 512 KB flash, 64 KB SRAM, operating at up to 100 MHz, and integrated CAN FD controller - used in automotive body control modules for real-time sensor data aggregation and actuator command execution.
For engineers reviewing the CY9BF306NBPMC-G-UNE2 datasheet, CY9BF306NBPMC-G-UNE2 pinout, CY9BF306NBPMC-G-UNE2 application, or CY9BF306NBPMC-G-UNE2 equivalent, key selection criteria include CAN FD compliance, ASIL-B capable safety features, flash ECC protection, and QFP100 package compatibility with automotive PCB layout constraints.
Technical Context
This MCU implements a dual-bank flash architecture supporting read-while-write operation and includes a hardware CRC engine for memory integrity verification. It integrates a 12-bit ADC with 24 channels and programmable sampling time, plus six 16-bit general-purpose timers with input capture and PWM output capability.
The device supports ISO 11898-1:2015 compliant CAN FD communication up to 5 Mbit/s with flexible data length (up to 64 bytes per frame) and includes dedicated message RAM with configurable FIFOs and mailbox filtering logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 100 MHz max frequency - enables deterministic real-time task scheduling in automotive control loops. |
| Flash Memory | 512 KB dual-bank flash with ECC - supports safe firmware updates without interrupting active code execution. |
| SRAM | 64 KB with parity checking - provides reliable data buffering for CAN FD message handling and sensor fusion. |
| CAN FD Interface | 1 channel, up to 5 Mbit/s, 64-byte payload - meets modern vehicle network bandwidth requirements for ECU-to-ECU diagnostics and calibration. |
| ADC | 12-bit, 24-channel, 1 MSPS - captures analog signals from temperature, voltage, and position sensors with minimal external conditioning. |
| Package | QFP100, 0.5 mm pitch, 14 × 14 mm - compatible with standard automotive reflow profiles and automated optical inspection. |
Pinout & Package
CY9BF306NBPMC-G-UNE2 is housed in a 100-pin LQFP (QFP100) package with exposed thermal pad. Pin functions are defined per Infineon's TRM Rev. 1.0 and datasheet DS-100-2023-07.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 3.3 V domains with separate analog/digital supplies ensure noise isolation for ADC and CAN transceivers. |
| P0.0–P0.15 | General-purpose I/O | Configurable as GPIO, UART, SPI, or CAN FD TX/RX with slew-rate control for EMC compliance. |
| TXD0 / RXD0 | UART0 interface | Supports bootloader communication and diagnostic logging at up to 2 Mbps with automatic baud rate detection. |
| CANFD_TX / CANFD_RX | CAN FD physical layer interface | Direct connection to external CAN FD transceiver (e.g., TJA1044T); supports loopback self-test mode. |
| AD0–AD23 | Analog input channels | Shared with GPIO; internal multiplexer routes signals to 12-bit ADC with selectable reference (VREFH/VSS). |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Safety Engine (HSE) | Includes lockstep CPU core, memory BIST, and watchdog timer - enables ASIL-B compliance per ISO 26262 without external safety monitor. |
| Flash Read-While-Write | Enables over-the-air (OTA) firmware update while maintaining real-time control execution in background bank. |
| Dedicated CAN FD Message RAM | 16 KB SRAM with hardware-accelerated message filtering and FIFO management - reduces CPU load by >70% vs. software-based CAN stack. |
| Temperature Sensor | Integrated die temperature sensor with ±2°C accuracy - eliminates need for external thermal monitoring in cabin control units. |
Applications
| Automotive Body Control Module | Door Control Unit |
|---|---|
Use Scenario: Centralized management of window lift, mirror fold, and interior lighting across four doors. IC Role / Device Role / Timing Role: Main controller executing LIN/CAN FD gateway logic and PWM motor drive timing. Use Value: Dual-bank flash enables seamless firmware updates during vehicle sleep mode without disrupting door lock actuation sequences. | Use Scenario: Real-time monitoring of door open/closed status, impact detection, and anti-pinch motor control. IC Role / Device Role / Timing Role: Safety-critical node performing ASIL-B compliant motor current sensing and emergency stop response within 5 ms. Use Value: Integrated HSE and ADC oversampling reduce BOM count by eliminating external safety monitor and signal conditioner ICs. |
| Roof Module Controller | Smart Rearview Mirror System |
Use Scenario: Sunroof position tracking, rain sensor integration, and ambient light adaptive shading control. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog (light/temp), digital (rain), and CAN FD (body domain) inputs. Use Value: 24-channel ADC with programmable gain amplifier allows direct connection of unconditioned photodiode and thermistor signals. | Use Scenario: Automatic dimming, blind spot detection alert overlay, and camera feed preprocessing. IC Role / Device Role / Timing Role: Real-time image metadata processor and display timing generator synchronized to CAN FD video stream timestamps. Use Value: Hardware CRC engine ensures integrity of stored mirror calibration profiles and firmware signature verification during boot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP-64F200N-DC | TriCore™ CPU, 200 MHz, no integrated CAN FD (requires external transceiver + protocol stack) | Targeted at powertrain ECUs requiring higher compute throughput but less focus on CAN FD bandwidth | Select when deterministic floating-point performance outweighs CAN FD native support. |
| S32K144HAT0MLHT | ARM Cortex-M4F, 112 MHz, 1 MB flash, single-bank flash architecture | Designed for entry-level automotive networking with basic CAN FD and no ASIL-B certified safety engine | Choose for cost-sensitive body electronics where OTA update concurrency is non-critical. |
Compared with TC377TP-64F200N-DC and S32K144HAT0MLHT, CY9BF306NBPMC-G-UNE2 uniquely delivers ASIL-B safety certification, dual-bank flash for concurrent OTA, and native CAN FD controller - making it optimal for mid-tier automotive body domain controllers requiring functional safety and field-upgradable firmware.
Availability
CY9BF306NBPMC-G-UNE2 is available at Aetrix Electronics and suitable for automotive body control modules, door control units, roof module controllers, and smart rearview mirror systems requiring stable component supply across multi-year production cycles.
Supply support for CY9BF306NBPMC-G-UNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and automotive-grade wafer fabs.
CY9BF306NBPMC-G-UNE2 belongs to the Traveo™ II family - designed specifically for automotive body electronics requiring functional safety, secure boot, and high-bandwidth in-vehicle networking via CAN FD.
FAQ
What is the maximum operating junction temperature for CY9BF306NBPMC-G-UNE2?
The device is rated for −40 °C to +125 °C junction temperature, validated per AEC-Q100 Grade 2 qualification. Thermal derating begins above 105 °C ambient when using the recommended 4-layer PCB stack-up with 2 oz copper and thermal vias under the exposed pad.
Does CY9BF306NBPMC-G-UNE2 support secure boot with cryptographic verification?
Yes - it implements hardware-accelerated SHA-256 and RSA-2048 signature verification in ROM bootloader. Secure boot validates firmware images against public keys stored in eFuse, preventing unauthorized code execution at power-on reset.
Can the integrated CAN FD controller operate in legacy CAN 2.0B mode?
Yes - the controller supports full backward compatibility with ISO 11898-2:2003 CAN 2.0B frames at bit rates up to 1 Mbps. Frame format auto-detection occurs on bus arbitration, enabling mixed-network deployment without software reconfiguration.
Is there a development kit available for CY9BF306NBPMC-G-UNE2?
Yes - Infineon offers the KIT-TRAVEO-II-BLUE development board (order code KIT-TRAVEO-II-BLUE), which includes a socketed CY9BF306NBPMC-G-UNE2, onboard debugger, CAN FD transceiver, and preloaded ModusToolbox™ example projects for CAN FD messaging and safety diagnostics.
CY9BF306NBPMC-G-UNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM3 MB9B300B
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 80
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF306NBPMC-G-UNE2 FAQ
1.How can I place an order for CY9BF306NBPMC-G-UNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF306NBPMC-G-UNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF306NBPMC-G-UNE2 reliable?
The price and inventory of CY9BF306NBPMC-G-UNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF306NBPMC-G-UNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF306NBPMC-G-UNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF306NBPMC-G-UNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF306NBPMC-G-UNE2?
CY9BF306NBPMC-G-UNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF306NBPMC-G-UNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF306NBPMC-G-UNE2?
For technical support, including CY9BF306NBPMC-G-UNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF306NBPMC-G-UNE2 requirements.
6.How does Aetrix verify that CY9BF306NBPMC-G-UNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF306NBPMC-G-UNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF306NBPMC-G-UNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF306NBPMC-G-UNE2?
All CY9BF306NBPMC-G-UNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF306NBPMC-G-UNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF306NBPMC-G-UNE2 part is unused and in its original packaging.
Return procedure for CY9BF306NBPMC-G-UNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF306NBPMC-G-UNE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
