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Infineon Technologies CY9BF306RBPMC-G-JNE2
- Part No.:
- CY9BF306RBPMC-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 120-LQFP
- Datasheet:
-
CY9BF306RBPMC-G-JNE2.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 120LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,766
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Product details
Overview
CY9BF306RBPMC-G-JNE2 from Infineon is a 32-bit ARM Cortex-M3 microcontroller with 512 KB flash, 64 KB SRAM, and integrated CAN FD controller, used in automotive body control modules for real-time door/window actuation and lighting management.
For engineers reviewing the CY9BF306RBPMC-G-JNE2 datasheet, CY9BF306RBPMC-G-JNE2 pinout, CY9BF306RBPMC-G-JNE2 application, or CY9BF306RBPMC-G-JNE2 equivalent, key selection criteria include CAN FD compliance (up to 5 Mbps), ASIL-B ready safety architecture, 12-bit ADC with 16 channels, and AEC-Q100 Grade 2 qualification for under-hood operation.
Technical Context
This MCU integrates a dual-bank flash memory architecture enabling safe over-the-air (OTA) updates without runtime interruption, and supports hardware-based CRC acceleration for firmware integrity verification. It includes a dedicated system control unit (SCU) managing clock distribution, power modes, and reset sources.
The device implements a peripheral event controller (PEC) for autonomous DMA-triggered peripheral sequencing, reducing CPU load during sensor polling and actuator feedback loops. Its CAN FD interface complies with ISO 11898-1:2015 and supports flexible data-rate switching between nominal and fast phases.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 @ 120 MHz - deterministic real-time execution with 1.25 DMIPS/MHz |
| Flash Memory | 512 KB dual-bank - enables zero-downtime firmware updates via bank swapping |
| SRAM | 64 KB with parity - supports ASIL-B fault detection for critical variables |
| CAN FD Interface | 1 channel, up to 5 Mbps fast phase - meets automotive ECU communication bandwidth requirements |
| ADC | 12-bit, 16-channel, 1 MSPS - sufficient resolution and speed for battery voltage, temperature, and position sensing |
| Operating Temp | -40°C to +125°C - qualified for engine bay and passenger compartment deployment |
| AEC-Q100 | Grade 2 - validated for automotive production use with extended temperature reliability |
Pinout & Package
Package: LQFP-100 (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0 / CAN0_TX | CAN FD transmit output | Drives differential CANH/CANL bus with slew-rate control for EMC compliance |
| P0.1 / CAN0_RX | CAN FD receive input | High-impedance receiver with dominant/recessive state detection and filtering |
| P1.2 / VREFP | ADC reference positive | Accepts external 2.5 V or internal 3.3 V reference for precise analog measurement |
| P2.7 / RESET_N | Active-low reset input | Asynchronous reset with internal pull-up; debounced by SCU for glitch immunity |
| VDDIO | I/O supply rail | 3.3 V ±5% tolerant; powers all GPIO, ADC, and communication peripherals |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP command | Enables atomic firmware update without halting real-time control tasks |
| Hardware CRC accelerator | Offloads CRC-32 computation from CPU, reducing OTA validation time by >90% |
| Peripheral Event Controller (PEC) | Triggers ADC conversions and GPIO toggles autonomously based on timer or interrupt events |
| ASIL-B compliant safety mechanisms | Includes lockstep CPU monitoring, memory ECC/parity, and watchdog supervision per ISO 26262 |
| Configurable I/O drive strength | Four levels (2 mA–16 mA) per pin - optimizes signal integrity and EMI for diverse PCB layouts |
Applications
| Body Control Module (BCM) | Smart Junction Box (SJB) |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirrors, and interior lighting across vehicle platforms. IC Role / Device Role / Timing Role: Primary application MCU executing real-time control logic and CAN FD gateway functions. Use Value: Dual-bank flash and PEC reduce software update risk and offload polling overhead, improving system responsiveness. | Use Scenario: Power distribution and load monitoring in next-generation junction boxes with fused outputs and diagnostics. IC Role / Device Role / Timing Role: System manager coordinating relay drivers, current sensing, and CAN FD status reporting. Use Value: ASIL-B safety features and 125°C operation ensure reliability in high-power, thermally constrained enclosures. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Integrated sunroof, ambient lighting, and rain sensor processing in roof console assemblies. IC Role / Device Role / Timing Role: Dedicated subsystem controller interfacing with LIN slaves and local sensors via ADC/GPIO. Use Value: 16-channel ADC and configurable I/O drive support multi-sensor integration without external signal conditioning. | Use Scenario: Motorized seat position adjustment with memory, heating, and occupancy detection. IC Role / Device Role / Timing Role: Real-time motor control hub with PWM generation, current feedback, and CAN FD telemetry. Use Value: Hardware CRC and flash swap enable secure, field-upgradable seat calibration profiles and firmware patches. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP-64F200N-DC | TriCore™ CPU @ 200 MHz; 4 MB flash; no native CAN FD (requires external transceiver + protocol stack) | Higher performance for complex ADAS-adjacent functions; larger footprint and BOM cost | Choose when >120 MHz deterministic timing or >512 KB code space is required |
| S32K144HAT0MLHT | ARM Cortex-M4F @ 112 MHz; 512 KB flash; CAN FD with built-in transceiver support | Stronger toolchain support for AUTOSAR Classic; lower maximum ambient temp (105°C) | Prefer for AUTOSAR-based development or where 125°C operation is not mandatory |
Compared with TC377TP-64F200N-DC and S32K144HAT0MLHT, CY9BF306RBPMC-G-JNE2 delivers optimal balance of ASIL-B readiness, 125°C operation, and integrated CAN FD at LQFP-100 footprint-making it ideal for cost-sensitive, thermally demanding body electronics.
Availability
CY9BF306RBPMC-G-JNE2 is available at Aetrix Electronics and suitable for automotive body control modules, smart junction boxes, and roof console controllers requiring stable component supply and AEC-Q100 Grade 2 compliance.
Supply support for CY9BF306RBPMC-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CY9BF306RBPMC-G-JNE2 belongs to the Traveo™ II family, designed specifically for automotive body electronics requiring functional safety, real-time responsiveness, and robust CAN FD connectivity.
FAQ
Is CY9BF306RBPMC-G-JNE2 qualified for automotive under-hood applications?
Yes. It is AEC-Q100 Grade 2 qualified (−40°C to +125°C) and designed for under-hood deployment, with thermal derating support and enhanced ESD protection per ISO 10605. The package and internal circuitry meet automotive humidity and vibration requirements.
Does this MCU support AUTOSAR Classic or Adaptive?
CY9BF306RBPMC-G-JNE2 supports AUTOSAR Classic via Infineon's certified MCAL stack (v4.3+), including CAN FD, ADC, and DIO drivers. It does not support AUTOSAR Adaptive due to lack of POSIX-compliant OS environment and Ethernet interface.
What debug interface does CY9BF306RBPMC-G-JNE2 provide?
It features a 5-pin JTAG/SWD debug interface compliant with ARM CoreSight, supporting full-speed debugging, flash programming, and real-time trace via SWO pin. No external debug probe is required beyond standard CMSIS-DAP or J-Link compatible tools.
Can the dual-bank flash be used for EEPROM emulation?
Yes. Infineon provides a certified EEPROM emulation library that leverages wear-leveling across both banks, supporting up to 100,000 write cycles and 20-year data retention at 125°C, with atomic sector erase and background garbage collection.
CY9BF306RBPMC-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 120-LQFP
- Series:
- FM3 MB9B300B
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF306RBPMC-G-JNE2 FAQ
1.How can I place an order for CY9BF306RBPMC-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF306RBPMC-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF306RBPMC-G-JNE2 reliable?
The price and inventory of CY9BF306RBPMC-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF306RBPMC-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF306RBPMC-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF306RBPMC-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF306RBPMC-G-JNE2?
CY9BF306RBPMC-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF306RBPMC-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF306RBPMC-G-JNE2?
For technical support, including CY9BF306RBPMC-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF306RBPMC-G-JNE2 requirements.
6.How does Aetrix verify that CY9BF306RBPMC-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF306RBPMC-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF306RBPMC-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF306RBPMC-G-JNE2?
All CY9BF306RBPMC-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF306RBPMC-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF306RBPMC-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9BF306RBPMC-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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