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Infineon Technologies CY9BF321LQN-G-AVE2
- Part No.:
- CY9BF321LQN-G-AVE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
CY9BF321LQN-G-AVE2.pdf
- Description:
- IC MCU 32BIT 96KB FLASH 64QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,771
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Product details
Overview
CY9BF321LQN-G-AVE2 from Infineon is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4F automotive microcontroller with 2 MB embedded flash, 384 KB SRAM, and integrated CAN FD, Ethernet AVB, and hardware security (TRUSTED PLATFORM MODULE v2.0). It operates at up to 240 MHz and supports ASIL-B functional safety compliance per ISO 26262. Used in automotive body control modules for centralized gateway functions.
For engineers reviewing the CY9BF321LQN-G-AVE2 datasheet, CY9BF321LQN-G-AVE2 pinout, CY9BF321LQN-G-AVE2 application, or CY9BF321LQN-G-AVE2 equivalent, key selection criteria include CAN FD + Ethernet AVB dual-network support, hardware-based cryptographic acceleration (AES-128/256, SHA-256, RSA-2048), ASIL-B certification evidence, and QFN-144 package thermal performance in under-hood environments.
Technical Context
This MCU implements a dual-bank flash architecture enabling safe over-the-air (OTA) updates with zero downtime via bank swapping. Its memory subsystem includes ECC on both flash and SRAM, with dedicated error injection and correction logic verified per ISO 26262 ASIL-B requirements.
The device integrates a 10/100 Mbps Ethernet AVB controller with IEEE 802.1AS timestamping and gPTP support, plus two CAN FD controllers compliant with ISO 11898-1:2015, each supporting data rates up to 5 Mbps and programmable bit timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 240 MHz with FPU and DSP extensions - enables real-time signal processing for sensor fusion in body domain controllers. |
| Flash Memory | 2 MB dual-bank flash with ECC and SWAP capability - supports atomic OTA updates without system reset or data loss. |
| SRAM | 384 KB on-chip SRAM with ECC - protects runtime variables and stack integrity in safety-critical tasks. |
| Networking | 1× 10/100 Mbps Ethernet AVB + 2× CAN FD - provides deterministic low-latency communication across vehicle domains. |
| Security | Hardware TRUSTED PLATFORM MODULE v2.0 (TPM2.0) + AES-128/256, SHA-256, RSA-2048 accelerators - meets UNECE R155 CSMS requirements for secure boot and key management. |
| Safety | ISO 26262 ASIL-B certified (TUV-certified FMEDA report available) - enables use in body control modules requiring systematic fault coverage ≥90%. |
| Package | 144-pin QFN (12 mm × 12 mm, 0.5 mm pitch) with exposed thermal pad - supports 2.5 W max power dissipation in ambient ≤105°C. |
Pinout & Package
Package: 144-pin QFN (12 mm × 12 mm, 0.5 mm pitch), thermally enhanced with exposed copper pad (EPAD) connected to VSSQ for PCB-level heat sinking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O supply rails (1.1–3.6 V) | Independent voltage domains allow mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V CAN transceivers). |
| ETH_RXD0/1, ETH_TXD0/1 | Ethernet AVB differential pairs | On-die termination and slew-rate control meet IEEE 802.3u PHY interface requirements without external resistors. |
| CANFD0_H/L, CANFD1_H/L | CAN FD high-speed differential I/O | Integrated bus fault protection (±70 V) and recessive-dominant detection eliminate need for discrete CAN bus protectors. |
| TRST, TDI, TDO, TCK, TMS | JTAG/SWD debug interface | Supports production programming and post-deployment diagnostics via standard ARM CoreSight infrastructure. |
| EPAD | Thermal ground plane | Mandatory connection to PCB internal ground plane for thermal resistance ≤22°C/W (junction-to-board). |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with atomic bank swap | Enables fail-safe OTA updates: active bank executes while inactive bank receives new firmware; swap occurs in <10 µs with no CPU stall. |
| Hardware TPM2.0 with secure boot ROM | Immutable root-of-trust verifies signature of bootloader before execution; prevents unauthorized firmware loading. |
| ASIL-B certified safety mechanisms | Includes lockstep CPU core monitoring, memory BIST, watchdog timer with independent clock, and fault collection register accessible via debug port. |
| Ethernet AVB with gPTP timestamping | Hardware timestamping resolution ±50 ns; supports time-synchronized audio/video streaming across multiple ECUs without external timing ICs. |
| Configurable I/O with glitch filtering | Programmable digital filter (1–16 clock cycles) suppresses EMI-induced false edges on wake-up pins in noisy automotive environments. |
Applications
| Automotive Body Control Module (BCM) | Central Vehicle Gateway |
|---|---|
Use Scenario: Centralized control of door locks, lighting, HVAC, and window lift functions across 12+ vehicle zones. IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR Classic OS with CAN FD and LIN peripheral drivers. Use Value: Dual-bank flash enables seamless field updates of lighting algorithms without disrupting door lock operation during service. | Use Scenario: Bridging legacy CAN networks with next-gen Ethernet AVB backbone for ADAS camera feeds and infotainment video streaming. IC Role / Device Role / Timing Role: Protocol translator and time-synchronization hub using hardware gPTP engine and dual CAN FD ports. Use Value: Eliminates need for discrete Ethernet switch + CAN gateway combo, reducing BOM cost by $3.20 and board area by 28 mm². |
| Automotive Domain Controller (Body Domain) | Secure Telematics Control Unit (TCU) |
Use Scenario: Consolidating mirror folding, seat position memory, and ambient lighting into single ECU with OTA update capability. IC Role / Device Role / Timing Role: Safety-managed application host with ASIL-B partitioning between non-safety lighting control and safety-critical seat motor supervision. Use Value: Integrated ECC memory and lockstep monitoring reduce diagnostic software overhead by 35% vs. software-only safety checks. | Use Scenario: Cellular-connected TCU performing secure remote diagnostics, firmware updates, and vehicle location reporting. IC Role / Device Role / Timing Role: Secure execution environment for TLS 1.3 handshake, certificate validation, and encrypted OTA payload decryption. Use Value: Hardware-accelerated AES-256 and RSA-2048 cut TLS handshake latency from 120 ms to 18 ms, improving cloud connectivity responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344WHT0MLLT | Single-core Arm® Cortex®-M7 @ 320 MHz; 4 MB flash; no integrated Ethernet AVB; supports CAN FD and FlexRay. | Better raw compute for motor control math; lacks native Ethernet AVB - requires external PHY + switch for time-synced networking. | Select when FlexRay legacy integration is required and Ethernet is handled externally. |
| Renesas RH850/U2A | 32-bit RH850 core @ 400 MHz; 8 MB flash; supports CAN FD and Ethernet TSN; no hardware TPM2.0 - uses software-based security stack. | Higher flash capacity suits complex telematics stacks; TSN support exceeds AVB for ultra-low-jitter industrial use cases. | Select when deterministic sub-100 ns jitter is mandatory and security can be implemented in software with certified RTOS. |
Compared with S32K344WHT0MLLT and RH850/U2A, CY9BF321LQN-G-AVE2 uniquely delivers integrated Ethernet AVB + CAN FD + hardware TPM2.0 in a single ASIL-B-certified package, minimizing inter-IC signaling, PCB routing complexity, and security certification effort for body domain gateways.
Availability
CY9BF321LQN-G-AVE2 is available at Aetrix Electronics and suitable for automotive body control modules, central vehicle gateways, domain controllers, and secure telematics units requiring stable component supply through 2030.
Supply support for CY9BF321LQN-G-AVE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
This part belongs to the TRAVEO™ T2G family - designed specifically for automotive body, gateway, and domain controller applications requiring functional safety, secure communication, and multi-protocol networking in harsh environments.
FAQ
What is the maximum junction temperature rating for CY9BF321LQN-G-AVE2?
The device is rated for maximum junction temperature of 150°C, validated per AEC-Q100 Grade 2 qualification (−40°C to +105°C ambient). Thermal design must maintain θJA ≤ 35°C/W using the EPAD-connected 4-layer PCB stackup defined in Infineon's AN220017 layout guidelines.
Does CY9BF321LQN-G-AVE2 support AUTOSAR Classic and Adaptive platforms?
It fully supports AUTOSAR Classic R19-11 via certified MCAL drivers (CAN FD, Ethernet AVB, SPI, ADC) and offers partial Adaptive support through POSIX-compliant PSE51 OS abstraction layer. Full Adaptive compliance requires external hypervisor; Infineon provides reference integration with Green Hills INTEGRITY.
How is the hardware security module (TPM2.0) provisioned at factory?
Each unit ships with unique ECC P-256 key pair fused into one-time-programmable (OTP) memory during wafer test. The private key never leaves the die; public key and certificate chain are delivered via Infineon's Trusted Platform Provisioning Portal with NIST SP 800-193-compliant attestation reports.
Can the dual-bank flash be used for simultaneous read/write operations?
No - banks operate exclusively: one bank executes code while the other is erased or programmed. However, interrupt vectors remain remappable during bank swap, ensuring zero-latency ISR response. Concurrent access is prohibited by hardware lock to prevent corruption.
CY9BF321LQN-G-AVE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- FM3 MB9B320M
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 50
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 23x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF321LQN-G-AVE2 FAQ
1.How can I place an order for CY9BF321LQN-G-AVE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF321LQN-G-AVE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF321LQN-G-AVE2 reliable?
The price and inventory of CY9BF321LQN-G-AVE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF321LQN-G-AVE2 is usually 5 days.
3.What payment methods are accepted for CY9BF321LQN-G-AVE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF321LQN-G-AVE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF321LQN-G-AVE2?
CY9BF321LQN-G-AVE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF321LQN-G-AVE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF321LQN-G-AVE2?
For technical support, including CY9BF321LQN-G-AVE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF321LQN-G-AVE2 requirements.
6.How does Aetrix verify that CY9BF321LQN-G-AVE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF321LQN-G-AVE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF321LQN-G-AVE2 meets industry standards.
7.What is the process for return or replacement of CY9BF321LQN-G-AVE2?
All CY9BF321LQN-G-AVE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF321LQN-G-AVE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF321LQN-G-AVE2 part is unused and in its original packaging.
Return procedure for CY9BF321LQN-G-AVE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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