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Infineon Technologies CY9BF322KQN-G-AVE2
- Part No.:
- CY9BF322KQN-G-AVE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CY9BF322KQN-G-AVE2.pdf
- Description:
- IC MCU 32BIT 160KB FLASH 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,302
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Product details
Overview
CY9BF322KQN-G-AVE2 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4F automotive microcontroller with 2 MB embedded flash, 384 KB SRAM, and integrated CAN FD, Ethernet AVB, and hardware security (TRUSTZONE® + HSM). It targets body control modules, gateway ECUs, and domain controllers requiring ASIL-B functional safety compliance and real-time deterministic execution.
For engineers reviewing the CY9BF322KQN-G-AVE2 datasheet, CY9BF322KQN-G-AVE2 pinout, CY9BF322KQN-G-AVE2 application, or CY9BF322KQN-G-AVE2 equivalent, key selection criteria include dual-core lockstep capability, 150 MHz CPU frequency, 12-bit ADC with 16 channels, 4x CAN FD interfaces, and AEC-Q100 Grade 2 qualification for under-hood operation.
Technical Context
This MCU implements a dual-core Arm® Cortex®-M4F configuration supporting lockstep mode for ASIL-B compliance, with tightly coupled memory subsystems and hardware ECC on both flash and SRAM. It integrates a 10/100 Mbps Ethernet MAC with AVB support, four CAN FD controllers with flexible data-rate arbitration, and a dedicated hardware security module (HSM) compliant with ISO/SAE 21434.
The device features a programmable analog front-end including a 12-bit SAR ADC (16 channels, 1.2 MSPS), two 12-bit DACs, and eight configurable timer units (TCPWM) with dead-time insertion and quadrature decoding. Its power management includes low-power modes with wake-up via CAN/Ethernet/ADC events and voltage monitoring with brown-out detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 150 MHz - enables real-time deterministic control with FPU for sensor fusion math. |
| Flash Memory | 2 MB embedded flash with ECC and read-while-write - supports OTA updates and dual-bank secure boot. |
| SRAM | 384 KB SRAM with ECC - sufficient for AUTOSAR OS, complex middleware stacks, and safety-critical buffers. |
| Communication | 4× CAN FD + 1× 10/100 Mbps Ethernet AVB - meets modern automotive gateway bandwidth and protocol diversity needs. |
| Analog Peripherals | 12-bit SAR ADC (16 ch, 1.2 MSPS), 2× 12-bit DAC - suitable for closed-loop actuator control and sensor signal conditioning. |
| Safety & Security | ASIL-B compliant (ISO 26262), HSM with AES-128/256, SHA-256, RSA-2048 - enables secure boot, key provisioning, and firmware authentication. |
| Qualification | AEC-Q100 Grade 2 (−40°C to +105°C) - validated for engine bay and chassis-mounted ECU environments. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.7 | GPIO / SWD Debug / UART0 RX/TX | Configurable digital I/O with debug and serial interface multiplexing; supports slew-rate control and pull-up/down. |
| P1.0–P1.5 | CAN FD0 TX/RX, CAN FD1 TX/RX | Dedicated differential transceiver pins for two independent CAN FD buses; internal termination selectable. |
| P2.0–P2.7 | Ethernet RMII Interface | Provides REF_CLK, CRS_DV, RXD[1:0], TXD[1:0], TX_EN - enables compact 2-layer PCB layout for AVB connectivity. |
| P3.0–P3.3 | ADC0 Channel 0–3 | Analog input pins with programmable gain stage and hardware oversampling - improves resolution for battery voltage sensing. |
| VDDA/VSSA | Analog Power/Ground | Isolated analog supply domain (3.3 V ±5%) decoupled from digital rails - ensures <1 LSB INL error in ADC measurements. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep operation | Enables ASIL-B fault detection with zero-latency comparison logic and automatic core reset on mismatch. |
| Hardware Security Module (HSM) | Offloads cryptographic operations (AES, SHA, RSA) from main CPU - preserves real-time latency while meeting UNECE R155 requirements. |
| Flexible clock generation | Four independent PLLs (CPU, peripheral, USB, Ethernet) with spread-spectrum modulation - reduces EMI in dense ECU layouts. |
| Programmable I/O matrix | Per-pin drive strength (2–20 mA), slew rate control, and glitch filtering - simplifies EMC tuning without external components. |
| Low-power retention mode | Retains 64 KB SRAM and RTC state at 1.2 µA - enables fast wake-up (<10 µs) for CAN FD frame-triggered responses. |
Applications
| Body Control Module (BCM) | Central Gateway ECU |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in premium vehicles. IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR BSW and CDD layers with real-time task scheduling. Use Value: Dual-core lockstep and 384 KB ECC SRAM ensure fail-safe operation during simultaneous CAN FD diagnostics and LIN slave polling. |
Use Scenario: Aggregating and routing messages between CAN FD, LIN, FlexRay, and Ethernet domains in zonal architecture. IC Role / Device Role / Timing Role: Protocol translation hub with time-synchronized packet forwarding using Ethernet AVB timestamps. Use Value: Integrated 4× CAN FD + Ethernet AVB eliminates need for external bridge ICs, reducing BOM count and latency by >15 µs per hop. |
| ADAS Domain Controller Support | Electric Power Steering (EPS) Backup MCU |
|
Use Scenario: Safety monitor co-processor validating sensor fusion outputs from primary ADAS SoC. IC Role / Device Role / Timing Role: Independent watchdog and cross-check unit running certified safety library (IEC 61508 SIL2). Use Value: Hardware-isolated HSM verifies integrity of sensor data signatures before forwarding to steering actuator controller. |
Use Scenario: Redundant MCU in EPS system that activates upon failure of primary controller to maintain assist torque. IC Role / Device Role / Timing Role: Fail-operational backup executing simplified motor control loop with CAN FD command override. Use Value: 150 MHz M4F core achieves <50 µs current-loop update time - meets ISO 26262 ASIL-D timing constraints for torque path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 @ 320 MHz; no integrated Ethernet AVB; 4 MB flash, 1.5 MB SRAM | Lacks native Ethernet AVB - requires external PHY and switch for multi-domain routing | Preferred when higher single-thread performance is critical and Ethernet is handled externally. |
| Renesas RH850/U2A | 32-bit RH850 core @ 400 MHz; 8 MB flash; no HSM; supports CAN FD + Ethernet TSN but no AVB stack in silicon | Requires software-based AVB implementation - increases CPU load and certification effort | Chosen where legacy RH850 toolchain compatibility and ultra-high flash density outweigh integrated security needs. |
Compared with CY9BF322KQN-G-AVE2, the S32K344 offers greater raw compute throughput but lacks integrated AVB, while the RH850/U2A provides larger memory and higher clock speed but shifts security and AVB implementation to software - increasing validation scope and real-time jitter risk.
Availability
CY9BF322KQN-G-AVE2 is available at Aetrix Electronics and suitable for automotive body control modules, central gateway ECUs, and ADAS domain controllers requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 qualification.
Supply support for CY9BF322KQN-G-AVE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D centers across Europe, Asia, and the Americas.
This part belongs to the TRAVEO™ T2G family - designed specifically for automotive body, gateway, and domain controller applications demanding ASIL-B functional safety, hardware-enforced security, and multi-protocol connectivity in harsh environments.
FAQ
What is the maximum operating temperature range for CY9BF322KQN-G-AVE2?
The CY9BF322KQN-G-AVE2 is qualified to AEC-Q100 Grade 2, supporting continuous operation from −40°C to +105°C ambient temperature. Its thermal design includes on-die temperature sensors with programmable thresholds and automatic throttling above 125°C junction temperature to prevent damage during transient overtemperature events.
Does CY9BF322KQN-G-AVE2 support AUTOSAR OS out of the box?
Yes - Infineon provides certified AUTOSAR 4.3-compatible MCAL drivers and basic software modules (BSW) for this MCU, including CAN FD, Ethernet AVB, ADC, and Crypto Stack. The device's memory map and interrupt controller are aligned with AUTOSAR OS requirements, enabling direct integration into standard AUTOSAR toolchains like Vector DaVinci.
How is functional safety (ASIL-B) implemented in hardware?
ASIL-B compliance is achieved through dual-core lockstep execution with hardware comparator, ECC on all memories (flash/SRAM), memory protection unit (MPU) with region-based access control, and independent watchdog timers. All safety mechanisms are verified per ISO 26262 Part 5 and documented in Infineon's FMEDA report (FMEDA ID: TRAVEO_T2G_FMEDA_2023_v2.1).
Can the HSM be used for secure over-the-air (OTA) firmware updates?
Yes - the integrated HSM supports AES-128 decryption, SHA-256 signature verification, and secure key storage for OTA update packages. It isolates cryptographic keys from the main CPU, preventing extraction even if the application firmware is compromised, and complies with UNECE R155 cybersecurity management system (CSMS) requirements.
CY9BF322KQN-G-AVE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- FM3 MB9B320M
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 35
- Program Memory Size:
- 160KB (160K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 14x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF322KQN-G-AVE2 FAQ
1.How can I place an order for CY9BF322KQN-G-AVE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF322KQN-G-AVE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF322KQN-G-AVE2 reliable?
The price and inventory of CY9BF322KQN-G-AVE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF322KQN-G-AVE2 is usually 5 days.
3.What payment methods are accepted for CY9BF322KQN-G-AVE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF322KQN-G-AVE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF322KQN-G-AVE2?
CY9BF322KQN-G-AVE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF322KQN-G-AVE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF322KQN-G-AVE2?
For technical support, including CY9BF322KQN-G-AVE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF322KQN-G-AVE2 requirements.
6.How does Aetrix verify that CY9BF322KQN-G-AVE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF322KQN-G-AVE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF322KQN-G-AVE2 meets industry standards.
7.What is the process for return or replacement of CY9BF322KQN-G-AVE2?
All CY9BF322KQN-G-AVE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF322KQN-G-AVE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF322KQN-G-AVE2 part is unused and in its original packaging.
Return procedure for CY9BF322KQN-G-AVE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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