My Inquiry
My Account
Infineon Technologies CY9BF322LQN-G-AVE2
- Part No.:
- CY9BF322LQN-G-AVE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
CY9BF322LQN-G-AVE2.pdf
- Description:
- IC MCU 32BIT 160KB FLASH 64QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,153
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9BF322LQN-G-AVE2 from Infineon is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller with integrated CAN FD, 2 MB flash, 384 KB SRAM, and hardware security (TRNG, AES-256, SHA-256). It operates at up to 200 MHz, supports automotive-grade temperature range (–40°C to +125°C), and targets body electronics control units requiring functional safety compliance.
For engineers reviewing the CY9BF322LQN-G-AVE2 datasheet, CY9BF322LQN-G-AVE2 pinout, CY9BF322LQN-G-AVE2 application, or CY9BF322LQN-G-AVE2 equivalent, key selection criteria include CAN FD bandwidth, ASIL-B capable safety features, flash ECC protection, and QFN-100 package thermal performance in constrained automotive PCB layouts.
Technical Context
This MCU implements dual-core lockstep (DCLS) for ASIL-B compliance, with dedicated safety monitor core verifying main core execution. It integrates a 12-bit SAR ADC (16 channels, 1.2 MSPS), configurable digital filters (DFB), and programmable analog blocks (PSoC-style routing).
The device includes two independent CAN FD controllers (up to 5 Mbps data phase), Ethernet MAC (10/100 Mbit/s), and a dedicated hardware crypto engine supporting TLS 1.2 handshake acceleration via dedicated DMA channels and secure key storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 200 MHz with FPU and MPU - enables real-time motor control loops and sensor fusion algorithms |
| Flash Memory | 2 MB with ECC and read-while-write capability - supports safe OTA updates without application interruption |
| SRAM | 384 KB (256 KB general-purpose + 128 KB safety-critical RAM) - segregated memory domains for ASIL-B partitioning |
| CAN FD Interface | 2x controllers, 5 Mbps data rate - meets UDS diagnostic bandwidth requirements for modern ECU reprogramming |
| Operating Temp | –40°C to +125°C (AEC-Q100 Grade 2) - qualified for under-hood and body control module deployment |
| Security Engine | AES-256, SHA-256, TRNG, secure boot ROM - provides hardware root of trust for firmware authentication and encrypted storage |
| Package | QFN-100 (12 mm × 12 mm, 0.5 mm pitch) - supports automated optical inspection and high-density automotive PCB routing |
Pinout & Package
Package: QFN-100 (12 mm × 12 mm, 0.5 mm pitch), thermally enhanced with exposed pad for junction-to-board thermal resistance ≤ 25°C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0 | I/O supply (1.71–3.6 V) | Independent power domain for GPIO banks A/B/C - allows mixed-voltage interfacing with legacy sensors |
| VDDA | Analog supply (2.7–3.6 V) | Dedicated low-noise rail for ADC and comparators - reduces quantization noise below 1 LSB RMS |
| CAN0_TX / CAN0_RX | CAN FD differential pair | Direct connection to ISO 11898-2 transceiver - no external level-shifting required for standard bus termination |
| ETH_MDIO / ETH_MDC | IEEE 802.3 management interface | Configures PHY registers over 2-wire serial bus - eliminates need for external I²C bridge IC |
| SWDCLK / SWDIO | ARM Serial Wire Debug | Single-pin debug interface with reset control - enables in-system programming and trace without JTAG header footprint |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep (DCLS) | Hardware-enforced instruction-level redundancy - detects transient faults per ISO 26262 ASIL-B requirements |
| Configurable DFB | Programmable digital filter block with 32-bit accumulator - replaces external DSP for motor current observer implementation |
| Secure Boot ROM | Immutable first-stage bootloader with public-key verification - prevents unauthorized firmware execution at power-on |
| Hardware Crypto Engine | Dedicated AES-256/SHA-256 accelerator with DMA offload - achieves 120 Mbps encryption throughput without CPU load |
| Flexible Clock System | 4 independent PLLs (including fractional-N) - enables simultaneous 200 MHz CPU, 100 MHz peripheral, and 50 MHz CAN FD clock domains |
Applications
| Door Control Module | Seat Position Control |
|---|---|
Use Scenario: Centralized door ECU managing window lift, mirror fold, and anti-pinch detection across four doors. IC Role / Device Role / Timing Role: Main application controller executing real-time PWM motor control, CAN FD diagnostics, and LIN gateway functions. Use Value: Integrated DFB and 12-bit ADC enable direct current sensing for anti-pinch torque calculation without external op-amps or ADCs. | Use Scenario: Motorized seat position adjustment with memory presets and occupant detection via capacitive sensing. IC Role / Device Role / Timing Role: Safety-certified controller handling ASIL-B compliant motor positioning, EEPROM wear-leveling, and capacitive touch processing. Use Value: Dual-core lockstep and segregated SRAM allow concurrent seat movement control and occupant classification without timing interference. |
| Roof Module Controller | Lighting Control Unit |
Use Scenario: Sunroof and panoramic roof actuation with rain sensor integration and pinch protection logic. IC Role / Device Role / Timing Role: Real-time motion controller with CAN FD communication to body domain controller and analog sensor interface. Use Value: Hardware crypto engine secures over-the-air sunroof calibration updates against replay attacks during service mode. | Use Scenario: Adaptive front lighting system (AFS) controlling LED matrix beam shaping and dynamic cornering lights. IC Role / Device Role / Timing Role: High-speed PWM generator with synchronized ADC sampling for thermal monitoring of LED drivers. Use Value: 200 MHz Cortex-M4 core executes closed-loop thermal compensation algorithms at 10 kHz update rate without jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC58EC80E5 | Power Architecture (e200z4), 4 MB flash, no integrated CAN FD PHY support | Requires external CAN FD transceiver; lacks hardware crypto engine | Select when legacy Power Architecture toolchain compatibility is mandatory |
| S32K344 | Arm® Cortex-M7, 4 MB flash, dual CAN FD, but no DFB or configurable analog blocks | Higher CPU performance but no on-chip digital filtering for motor control observers | Select when complex signal processing is handled externally or in software |
Compared with SPC58EC80E5 and S32K344, CY9BF322LQN-G-AVE2 uniquely combines CAN FD PHY integration, hardware DFB for motor control, and ASIL-B lockstep within a single QFN-100 package - reducing BOM count and PCB area for space-constrained body ECUs.
Availability
CY9BF322LQN-G-AVE2 is available at Aetrix Electronics and suitable for automotive door modules, seat position controllers, roof actuators, and adaptive lighting systems requiring stable component supply and AEC-Q100 qualification.
Supply support for CY9BF322LQN-G-AVE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.
This part belongs to the TRAVEO™ T2G family - designed specifically for automotive body electronics requiring functional safety, secure connectivity, and integrated analog/motor control peripherals in compact packages.
FAQ
What is the maximum operating frequency of the CY9BF322LQN-G-AVE2 CPU core?
The CY9BF322LQN-G-AVE2 features an Arm® Cortex®-M4 core rated for operation up to 200 MHz across its full automotive temperature range (–40°C to +125°C), verified with silicon characterization and voltage margin testing per AEC-Q100 Grade 2 requirements.
Does this MCU support secure boot with public-key verification?
Yes - it includes immutable Secure Boot ROM that performs SHA-256 hash verification and RSA-2048 signature validation of the first-stage bootloader image stored in flash, using keys provisioned during manufacturing and protected by hardware fuse isolation.
How many CAN FD interfaces does CY9BF322LQN-G-AVE2 integrate?
The device integrates two independent CAN FD controllers compliant with ISO 11898-1:2015, each supporting bit rates up to 5 Mbps in the data phase and full protocol stack offload including CRC computation and bit stuffing correction in hardware.
Is the QFN-100 package lead-free and RoHS-compliant?
Yes - CY9BF322LQN-G-AVE2 uses a matte tin-plated lead finish on its QFN-100 package and complies with EU RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) standards.
CY9BF322LQN-G-AVE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- FM3 MB9B320M
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 50
- Program Memory Size:
- 160KB (160K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 23x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF322LQN-G-AVE2 FAQ
1.How can I place an order for CY9BF322LQN-G-AVE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF322LQN-G-AVE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF322LQN-G-AVE2 reliable?
The price and inventory of CY9BF322LQN-G-AVE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF322LQN-G-AVE2 is usually 5 days.
3.What payment methods are accepted for CY9BF322LQN-G-AVE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF322LQN-G-AVE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF322LQN-G-AVE2?
CY9BF322LQN-G-AVE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF322LQN-G-AVE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF322LQN-G-AVE2?
For technical support, including CY9BF322LQN-G-AVE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF322LQN-G-AVE2 requirements.
6.How does Aetrix verify that CY9BF322LQN-G-AVE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF322LQN-G-AVE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF322LQN-G-AVE2 meets industry standards.
7.What is the process for return or replacement of CY9BF322LQN-G-AVE2?
All CY9BF322LQN-G-AVE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF322LQN-G-AVE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF322LQN-G-AVE2 part is unused and in its original packaging.
Return procedure for CY9BF322LQN-G-AVE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9BF322LQN-G-AVE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
