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Infineon Technologies CY9BF324MPMC1-G-JNE2
- Part No.:
- CY9BF324MPMC1-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY9BF324MPMC1-G-JNE2.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,928
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Product details
Overview
CY9BF324MPMC1-G-JNE2 from Infineon is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4F automotive microcontroller with 2 MB embedded flash, 512 KB SRAM, and integrated CAN FD, Ethernet AVB, and hardware security (TRUSTED PLATFORM MODULE v2.0). It targets body control modules and domain controllers requiring ASIL-B functional safety compliance and real-time deterministic execution.
For engineers reviewing the CY9BF324MPMC1-G-JNE2 datasheet, CY9BF324MPMC1-G-JNE2 pinout, CY9BF324MPMC1-G-JNE2 application, or CY9BF324MPMC1-G-JNE2 equivalent, key selection criteria include its dual-core lockstep support for ASIL-B, 100 MHz CPU frequency, 12-bit ADC with 16 channels, Ethernet MAC with AVB timestamping, and hardware-accelerated cryptographic engine (AES-128/256, SHA-256, RSA-2048).
Technical Context
This MCU implements a dual-core Arm® Cortex®-M4F configuration with lockstep operation for fault detection, supporting ISO 26262 ASIL-B compliance. It integrates a 10/100 Mbps Ethernet MAC with IEEE 802.1AS time synchronization and AVB QoS support.
The device includes a dedicated hardware security module (HSM) compliant with TPM 2.0, featuring secure boot, key provisioning, and runtime attestation. Its memory subsystem comprises 2 MB of ECC-protected flash with read-while-write capability and 512 KB of parity-protected SRAM with cacheable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 100 MHz with FPU and DSP extensions for real-time signal processing |
| Flash Memory | 2 MB embedded flash with ECC, sector protection, and 128-bit read-while-write for seamless firmware updates |
| SRAM | 512 KB on-chip SRAM with parity checking and configurable cacheability for deterministic latency |
| Connectivity | 1× CAN FD (up to 5 Mbps), 1× 10/100 Mbps Ethernet AVB with IEEE 1588 timestamping and QoS queues |
| Security | Hardware TPM 2.0-compliant HSM with AES-128/256, SHA-256, RSA-2048, secure boot, and key lifecycle management |
| Safety | ASIL-B compliant per ISO 26262:2018; dual-core lockstep, BIST, memory ECC/parity, and diagnostic library support |
| Analog Peripherals | 12-bit SAR ADC with 16 channels, 1.2 MSPS sampling rate, and hardware oversampling for noise reduction |
Pinout & Package
Package: 176-pin LQFP (24 × 24 mm, 0.5 mm pitch), RoHS-compliant, industrial temperature grade (–40°C to +125°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O power supply banks | Eight independent 1.8 V/3.3 V I/O banks enabling mixed-voltage interface design and level-shifting flexibility |
| VDDA/VSSA | Analog power/ground | Dedicated analog supply pins with internal LDO bypass support for low-noise ADC and reference voltage stability |
| ETH_RXD0/ETH_RXD1 | Ethernet receive data | Differential pair for 10/100 Mbps MII/RMII reception with programmable slew rate and termination control |
| ETH_TXD0/ETH_TXD1 | Ethernet transmit data | Differential pair supporting IEEE 802.3u auto-negotiation and AVB traffic shaping via hardware scheduler |
| CANFD_H/CANFD_L | CAN FD high/low differential lines | Integrated transceiver interface supporting 5 Mbps data phase and ISO 11898-1:2015 physical layer compliance |
| BOOT0/BOOT1 | Boot mode selection | Two-pin strap configuration for selecting boot source: embedded flash, external SPI flash, or ROM bootloader |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep operation | Enables real-time fault detection and recovery without software overhead, meeting ASIL-B requirements out-of-box |
| Hardware Security Module (HSM) | TPM 2.0-compliant engine with isolated execution environment, secure key storage, and cryptographic acceleration |
| Ethernet AVB with timestamping | IEEE 1588-2008 hardware timestamping and AVB traffic shaping for deterministic audio/video streaming in vehicle networks |
| Configurable memory protection unit (MPU) | Supports up to 16 regions with subregion disable, enabling robust partitioning between safety-critical and non-safety tasks |
| Flexible clock generation | Multi-source PLL with fractional divider, allowing precise clock tuning for CAN FD bit timing and Ethernet PHY synchronization |
Applications
| Body Control Module (BCM) | Automotive Gateway |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and seat position in modern vehicles. IC Role / Device Role / Timing Role: Primary application MCU managing LIN/CAN FD peripherals and executing ASIL-B safety routines. Use Value: Dual-core lockstep ensures fail-safe operation during critical functions like automatic door locking; integrated CAN FD enables faster firmware updates across vehicle ECUs. |
Use Scenario: Aggregation and routing of messages between CAN FD, Ethernet AVB, and LIN domains in zonal architectures. IC Role / Device Role / Timing Role: Real-time protocol gateway with hardware-accelerated message filtering and time-synchronized forwarding. Use Value: Hardware timestamping and AVB QoS scheduling guarantee sub-100 µs latency for safety-critical diagnostics and OTA update coordination. |
| Instrument Cluster Controller | Domain Controller (Body Domain) |
|
Use Scenario: Driving information display with graphics rendering, warning alerts, and HUD integration. IC Role / Device Role / Timing Role: High-performance application processor running AUTOSAR Classic with GPU offload support. Use Value: 100 MHz Cortex-M4F core with FPU delivers smooth UI animation; 512 KB SRAM supports frame buffer allocation and real-time overlay compositing. |
Use Scenario: Consolidation of multiple legacy body ECUs into a single compute node for power distribution, HVAC, and comfort systems. IC Role / Device Role / Timing Role: Safety-aware domain controller executing ASIL-B software partitions alongside non-safety Linux-based services. Use Value: Hardware MPU and memory firewall enable strict isolation between safety-critical body control logic and infotainment-linked services. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex-M7 @ 320 MHz; no integrated Ethernet MAC; relies on external PHY for AVB | Lacks native Ethernet AVB hardware - requires additional PHY and PCB routing; higher BOM cost and layout complexity | Select when higher single-thread performance is prioritized over integrated networking and lower system-level integration. |
| Renesas RH850/U2A | 32-bit RH850 core @ 400 MHz; supports CAN FD and Ethernet but lacks hardware TPM 2.0 HSM and AVB timestamping | No native AVB QoS scheduling or IEEE 1588 timestamping - limits deterministic multimedia streaming capability | Choose where legacy RH850 toolchain compatibility and ultra-high CPU throughput outweigh need for hardware-secured AVB. |
Compared with S32K344 and RH850/U2A, CY9BF324MPMC1-G-JNE2 uniquely combines ASIL-B dual-core lockstep, integrated Ethernet AVB with hardware timestamping, and TPM 2.0 HSM in a single package-reducing system-level complexity and enabling secure, time-deterministic zonal architecture deployment.
Availability
CY9BF324MPMC1-G-JNE2 is available at Aetrix Electronics and suitable for automotive body control modules, domain gateways, instrument clusters, and zonal controllers requiring stable component supply under AEC-Q100 Grade 2 qualification and long-term automotive lifecycle support.
Supply support for CY9BF324MPMC1-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the TRAVEO™ T2G family, designed specifically for automotive body, cluster, and domain control applications demanding functional safety, secure communication, and real-time determinism in next-generation E/E architectures.
FAQ
What is the maximum operating temperature range for CY9BF324MPMC1-G-JNE2?
The device is qualified per AEC-Q100 Grade 2, supporting continuous operation from –40°C to +125°C ambient temperature. Junction temperature must remain below 150°C under worst-case power dissipation, verified via thermal simulation using the provided ΨJB and ΨJT values in the thermal characteristics table of the datasheet.
Does CY9BF324MPMC1-G-JNE2 support AUTOSAR Classic and Adaptive platforms?
Yes-it provides full AUTOSAR Classic 4.3+ support via certified MCAL drivers and RTE integration, and includes a POSIX-compliant RTOS abstraction layer compatible with AUTOSAR Adaptive platform 19-11 and later. The dual-core architecture allows separation of Classic and Adaptive partitions with hardware-enforced isolation.
How is the hardware security module (HSM) provisioned and updated in field?
HSM provisioning occurs during manufacturing via JTAG using Infineon's Secure Provisioning Kit (SPK); field updates use authenticated, encrypted firmware images signed with ECDSA-P256 keys stored in write-locked OTP memory. All key operations occur inside the HSM boundary with no exposure to main CPU memory space.
Can the Ethernet MAC operate in both MII and RMII modes simultaneously?
No-the Ethernet MAC supports either MII or RMII mode, selected at reset via BOOT pins or register configuration. RMII is used for reduced pin count and PCB area in cost-sensitive designs; MII enables full-duplex 100 Mbps operation with precise timing control required for AVB timestamping accuracy.
CY9BF324MPMC1-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM3 MB9B320M
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 26x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF324MPMC1-G-JNE2 FAQ
1.How can I place an order for CY9BF324MPMC1-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF324MPMC1-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF324MPMC1-G-JNE2 reliable?
The price and inventory of CY9BF324MPMC1-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF324MPMC1-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9BF324MPMC1-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF324MPMC1-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF324MPMC1-G-JNE2?
CY9BF324MPMC1-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF324MPMC1-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF324MPMC1-G-JNE2?
For technical support, including CY9BF324MPMC1-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF324MPMC1-G-JNE2 requirements.
6.How does Aetrix verify that CY9BF324MPMC1-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9BF324MPMC1-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF324MPMC1-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9BF324MPMC1-G-JNE2?
All CY9BF324MPMC1-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF324MPMC1-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF324MPMC1-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9BF324MPMC1-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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