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Infineon Technologies CY9BF366NBGL-GE1
- Part No.:
- CY9BF366NBGL-GE1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 96-LFBGA
- Datasheet:
-
CY9BF366NBGL-GE1.pdf
- Description:
- IC MCU 32BIT 544KB FLASH 96FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,786
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Product details
Overview
CY9BF366NBGL-GE1 from Cypress Semiconductor (now Infineon) is a 32-bit ARM® Cortex®-M4F microcontroller with FPU, operating up to 160 MHz, 1024 KB Flash, 128 KB SRAM (64+32+32), and integrated peripherals including USB 2.0 Full-Speed device/host, 24-channel 12-bit ADC, dual 12-bit DAC, motor control timers, LIN/UART/I²C/CSIO interfaces, and RTC - used in industrial motor drives and embedded motion control systems.
For engineers reviewing the CY9BF366NBGL-GE1 datasheet, CY9BF366NBGL-GE1 pinout, CY9BF366NBGL-GE1 application, or CY9BF366NBGL-GE1 equivalent, key selection criteria include Flash/SRAM partitioning (MainFlash + WorkFlash), dual watchdog architecture (hardware + software), 5V-tolerant GPIO count (up to 100 pins in 120-pin LQFP), VBAT-powered RTC with 32-byte backup registers, and DSTC-accelerated data movement for real-time deterministic I/O handling.
Technical Context
The CY9BF366NBGL-GE1 implements the ARM Cortex-M4F r0p1 core with hardware FPU and DSP extensions, enabling floating-point math and signal processing in motor control loops. Its memory subsystem includes two independent Flash banks (1024 KB MainFlash with accelerator, 32 KB WorkFlash with configurable wait states) and three SRAM blocks (64 KB I/D-bus SRAM0, 32 KB System-bus SRAM1/SRAM2) for deterministic code/data placement.
Peripheral integration centers on real-time motion control: dual multi-function timers support PWM, PPG, dead-time insertion, and A/D trigger synchronization; QPRC units decode quadrature encoder signals; and the DSTC (128-channel descriptor-based DMA) offloads CPU from high-bandwidth sensor/actuator data transfers without bus arbitration overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F r0p1 with FPU and DSP instruction set - enables real-time floating-point PID control and FFT-based diagnostics. |
| Max Clock Frequency | 160 MHz - supports sub-µs interrupt latency and 6.25 ns timer resolution for precise PWM edge placement. |
| Flash Memory | 1024 KB MainFlash + 32 KB WorkFlash - dual-bank architecture allows background reprogramming and secure code updates without runtime interruption. |
| SRAM | 64 KB (SRAM0) + 32 KB (SRAM1) + 32 KB (SRAM2) - segregated buses enable concurrent instruction fetch, DMA access, and peripheral buffering. |
| ADC | 24-channel 12-bit SAR ADC with 0.5 µs conversion @ 5 V - supports simultaneous sampling across multiple motor phases with priority/scanning modes. |
| DAC | 2-channel 12-bit R-2R DAC - provides analog reference outputs for current/voltage feedback calibration or waveform generation. |
| USB Interface | Full-Speed Device & Host (12 Mbps) with 6 endpoints (EP0–EP5), double-buffered - enables firmware updates via USB device mode and host-side sensor hub connectivity. |
Pinout & Package
This device is housed in a 120-pin LQFP package (14 mm × 14 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions are defined per the MB9B360R Series pin assignment (Document 002-04872 Rev. *E, pages 9–14), supporting 100 high-speed GPIOs, 5V-tolerant I/O on designated pins, and dedicated JTAG/SWJ-DP debug interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Three independent power domains: VCC (2.7–5.5 V), USBVCC (3.0–3.6 V for USB I/O), VBAT (2.7–5.5 V for RTC retention). |
| XTAL / EXTAL | Main oscillator input/output | Supports 4–48 MHz external crystal - primary clock source for PLL; paired with sub-clock (32.768 kHz) for RTC accuracy. |
| SWDIO / SWCLK | Serial Wire Debug I/O and clock | 2-pin debug interface replacing JTAG - enables non-intrusive real-time trace via ETM and flash programming during development. |
| AIN0–AIN23 | Analog input channels | 24 dedicated ADC inputs mapped to GPIO pins - configurable for single-ended or differential acquisition with hardware-triggered scanning. |
| DA0 / DA1 | Analog output channels | Two buffered 12-bit DAC outputs - drive external op-amps for precision biasing or analog waveform synthesis. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Watchdog Architecture | Independent hardware (low-speed CR clock) and software watchdogs - ensures fail-safe reset even during deep sleep or clock failure. |
| Descriptor-based DSTC | 128-channel data transfer controller with chain activation - moves sensor data directly between ADC FIFO and SRAM without CPU intervention. |
| Motor Control Timer Unit | Two multi-function timers with dead-time insertion, DTIF emergency stop, and A/D activation compare - meets IEC 61800-5-2 functional safety timing requirements. |
| VBAT-Powered RTC + Backup Registers | Real-time calendar with leap-year correction and 32-byte battery-backed registers - maintains time and critical state across main power loss. |
| Scramble Function for External Bus | Configurable address scrambling (4 MB granularity) for CS0–CS7 - protects firmware integrity when executing from external NOR/NAND Flash. |
Applications
| Industrial Motor Drive | Automotive Body Control Module |
|---|---|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in HVAC compressors and pump systems. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm (PWM generation, Clarke/Park transforms, PID loops) using M4F FPU and motor timers with <1 µs jitter. Use Value: 160 MHz core + 24-channel ADC + dual DAC enables simultaneous phase current sensing, voltage regulation, and torque ripple suppression at 20 kHz switching frequency. | Use Scenario: Centralized control of door locks, window lifts, mirrors, and lighting with LIN communication to slave nodes. IC Role / Device Role / Timing Role: LIN master node managing up to 16 slave ECUs via dedicated LIN channel with automatic break detection and protocol compliance to LIN 2.1. Use Value: Integrated LIN transceiver support, 5V-tolerant GPIOs for direct connection to automotive 12 V loads, and low-power STOP mode (<10 µA) extend battery life in always-on modules. |
| Programmable Logic Controller (PLC) I/O Module | Smart Energy Meter with Communication Hub |
Use Scenario: Digital input/output expansion module with isolated field-side interfacing and Modbus RTU over UART. IC Role / Device Role / Timing Role: High-reliability I/O controller with MPU-enforced memory protection, CRC accelerator for packet integrity, and dual watchdog supervision. Use Value: Memory Protection Unit prevents rogue tasks from corrupting control logic; 8-channel DMA + DSTC ensures deterministic scan-cycle timing under heavy communication load. | Use Scenario: Two-way AMI meter with RF mesh backhaul (via external transceiver) and PLC front-end, requiring secure firmware updates and tamper detection. IC Role / Device Role / Timing Role: Secure host processor managing AES encryption, secure boot, and USB/UART firmware updates while monitoring energy parameters via 24-channel ADC. Use Value: Dual Flash banks allow A/B firmware swapping; CCITT CRC16/IEEE CRC32 accelerators verify firmware images and communication packets in hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F429ZIT6 | ARM Cortex-M4F @ 180 MHz, 2048 KB Flash, 256 KB RAM, no WorkFlash bank, no built-in LIN PHY, USB OTG HS support | Lacks native LIN 2.1 support and VBAT-RTC with backup registers; requires external transceiver and RTC chip for equivalent functionality | Select when higher CPU throughput and USB OTG host capability are prioritized over LIN integration and ultra-low-power RTC retention |
| RX65N-1MB | Renesas RXv2 core @ 120 MHz, 1024 KB Flash, 192 KB RAM, no FPU, integrated CAN FD, no USB host | No floating-point unit limits real-time motor control math; CAN FD replaces USB for vehicle network integration but lacks USB device/host versatility | Select for CAN FD-based automotive body networks where floating-point computation is not required and USB connectivity is unnecessary |
Compared with STM32F429ZIT6 and RX65N-1MB, the CY9BF366NBGL-GE1 uniquely combines LIN 2.1 hardware support, dual Flash banking for safe firmware updates, and VBAT-powered RTC with 32-byte backup registers - making it optimal for cost-sensitive, functionally safe motor control and automotive body electronics where mixed-signal integration and low-power calendar persistence are mandatory.
Availability
CY9BF366NBGL-GE1 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body control modules, programmable logic controller I/O expansion, and smart energy meters requiring stable component supply and long-term lifecycle support.
Supply support for CY9BF366NBGL-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor was acquired by Infineon Technologies in 2020 and is now part of Infineon's Microcontrollers & Digital ICs division, headquartered in Munich, Germany, delivering scalable embedded solutions for industrial, automotive, and IoT applications.
The MB9B360R Series - including CY9BF366NBGL-GE1 - was designed specifically for cost-optimized, high-reliability motor control and embedded automation, emphasizing integrated analog/motor peripherals, functional safety features (MPU, dual watchdog), and low-power operation across six sleep modes.
FAQ
What is the maximum operating frequency and supported voltage range for CY9BF366NBGL-GE1?
The CY9BF366NBGL-GE1 operates at up to 160 MHz with a core supply range of 2.7 V to 5.5 V. USB I/O requires 3.0–3.6 V on USBVCC, while VBAT supports the same 2.7–5.5 V range for RTC backup. All specifications are validated per Document 002-04872 Rev. *E Section 12.2, with DC characteristics tested across temperature (–40°C to +85°C) and voltage corners.
Does CY9BF366NBGL-GE1 support hardware-based LIN communication without external transceivers?
Yes - the device integrates full LIN 2.1 protocol support in hardware, including break field/delimiter generation, master/slave mode, and error detection. However, an external LIN transceiver (e.g., TLE7259-3GE) is still required for physical layer signaling on the bus; the MCU handles all protocol-layer functions internally.
How does the dual Flash architecture (MainFlash + WorkFlash) improve firmware update reliability?
MainFlash stores application code and is optimized for speed (zero-wait-state up to 72 MHz); WorkFlash (32 KB) is used for parameter storage, bootloader code, or firmware staging. This separation allows background writes to WorkFlash while MainFlash executes, enabling atomic firmware swaps and rollback capability - critical for field-upgradable industrial controllers.
Is the CY9BF366NBGL-GE1 qualified for automotive applications per AEC-Q100?
No - the CY9BF366NBGL-GE1 is specified for industrial temperature range (–40°C to +85°C) and is not AEC-Q100 qualified. While it includes automotive-relevant features (LIN 2.1, functional safety peripherals), it lacks the extended temperature testing, failure rate validation, and qualification documentation required for automotive-grade deployment.
CY9BF366NBGL-GE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 96-LFBGA
- Series:
- FM4 MB9B360R
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 80
- Program Memory Size:
- 544KB (544K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9BF366NBGL-GE1 FAQ
1.How can I place an order for CY9BF366NBGL-GE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9BF366NBGL-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9BF366NBGL-GE1 reliable?
The price and inventory of CY9BF366NBGL-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF366NBGL-GE1 is usually 5 days.
3.What payment methods are accepted for CY9BF366NBGL-GE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF366NBGL-GE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9BF366NBGL-GE1?
CY9BF366NBGL-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9BF366NBGL-GE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9BF366NBGL-GE1?
For technical support, including CY9BF366NBGL-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF366NBGL-GE1 requirements.
6.How does Aetrix verify that CY9BF366NBGL-GE1 is sourced from the original manufacturer or authorized distributors?
All CY9BF366NBGL-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF366NBGL-GE1 meets industry standards.
7.What is the process for return or replacement of CY9BF366NBGL-GE1?
All CY9BF366NBGL-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF366NBGL-GE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9BF366NBGL-GE1 part is unused and in its original packaging.
Return procedure for CY9BF366NBGL-GE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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