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Infineon Technologies CY9BF506NBPMC-G-JNE2

Part No.:
CY9BF506NBPMC-G-JNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY9BF506NBPMC-G-JNE2.pdf
Description:
IC MCU 32BIT 512KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,511

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Product details

Overview

CY9BF506NBPMC-G-JNE2 from Infineon is a 32-bit ARM Cortex-M3-based microcontroller with 1 MB Flash, 128 KB SRAM, integrated CAN FD controller, and operating voltage range of 2.7–5.5 V. It targets automotive body control modules requiring real-time communication, fault-tolerant operation, and ASIL-B compliance.

For engineers reviewing the CY9BF506NBPMC-G-JNE2 datasheet, CY9BF506NBPMC-G-JNE2 pinout, CY9BF506NBPMC-G-JNE2 application, or CY9BF506NBPMC-G-JNE2 equivalent, key selection criteria include CAN FD data rate support (up to 5 Mbps), embedded hardware CRC engine, configurable watchdog timers, and AEC-Q100 Grade 2 qualification for under-hood environments.

Technical Context

This MCU integrates a single-core ARM Cortex-M3 CPU running at up to 120 MHz, with memory protection unit (MPU), nested vectored interrupt controller (NVIC), and dual-bank Flash enabling safe firmware updates. It supports simultaneous CAN FD and LIN communication via dedicated peripherals.

The device includes 12-bit ADC with 24 channels, 4x 16-bit general-purpose timers, and hardware encryption acceleration for AES-128 and SHA-256. All analog and digital I/Os are rated for automotive-grade ESD (±8 kV HBM) and EMC robustness per ISO 11452-2/4.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 120 MHz max - enables deterministic real-time task scheduling in safety-critical body control functions
Flash Memory1 MB dual-bank - supports seamless over-the-air (OTA) firmware update without system interruption
SRAM128 KB with parity - provides error-detectable working memory for ASIL-B software execution
CAN FD Interface1 channel, up to 5 Mbps data phase - meets high-bandwidth diagnostic and actuator coordination requirements in modern vehicle networks
ADC Resolution12-bit, 24-channel - captures precise sensor inputs (e.g., temperature, position, voltage) across multiple vehicle subsystems
Operating Temp−40°C to +125°C - qualified for engine bay and passenger compartment mounting locations
AEC-Q100 GradeGrade 2 - certified for automotive applications with extended temperature reliability

Pinout & Package

Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDedicated analog/digital power domains with internal regulation enable noise-isolated ADC operation
P0.0–P0.15General-purpose I/OConfigurable pull-up/down, glitch filter, and interrupt capability support direct switch/sensor interfacing
CANFD_TX, CANFD_RXCAN FD physical layer interfaceDifferential signaling pins compliant with ISO 11898-2; require external transceiver for bus connection
AD0–AD23Analog input channelsMultiplexed with GPIO; support simultaneous sampling across 8 channels for motor current sensing
OSC_IN, OSC_OUTExternal crystal oscillator terminalsSupport 4–20 MHz crystals for precise clock generation required by CAN FD timing accuracy

Key Features

FeatureDesign Value
Hardware CRC EngineAccelerates checksum calculation for firmware image validation and CAN FD frame integrity checks
Dual-Bank FlashEnables background read while programming one bank, eliminating runtime interruption during OTA updates
Configurable Watchdog TimersTwo independent watchdogs (windowed + free-running) meet ASIL-B failure detection timing requirements
Embedded AES-128 & SHA-256Offloads cryptographic operations from CPU, reducing latency in secure boot and firmware authentication
GPIO with Glitch FilterSuppresses electrical noise on mechanical switch inputs common in door latch and seat position sensors

Applications

Body Control Module (BCM)Roof Module

Use Scenario: Centralized management of lighting, wipers, door locks, and window lifts in mid-tier passenger vehicles.

IC Role / Device Role / Timing Role: Main application processor executing ASW-compliant control logic with CAN FD communication to ECUs.

Use Value: Dual-bank Flash and hardware CRC ensure safe field updates; 125°C rating allows placement near fuse box without heatsink.

Use Scenario: Integration of sunroof control, ambient lighting, and rain sensor signal processing in premium roof assemblies.

IC Role / Device Role / Timing Role: Real-time sensor fusion hub coordinating LIN-slave actuators and CAN FD diagnostics reporting.

Use Value: 24-channel ADC captures multi-point light intensity and moisture signals; GPIO glitch filtering rejects HVAC-induced EMI.

Seat Control UnitTrunk/Liftgate Module

Use Scenario: Motorized adjustment of seat position, heating, and memory functions with occupant detection.

IC Role / Device Role / Timing Role: Safety-aware motor controller with PWM generation, current sensing, and fault logging via CAN FD.

Use Value: Hardware watchdogs detect lockup during stall conditions; 128 KB SRAM with parity stores seat profile data securely.

Use Scenario: Power liftgate actuation with obstacle detection, anti-pinch logic, and remote keyless entry integration.

IC Role / Device Role / Timing Role: Dedicated motion controller interfacing Hall sensors, BLDC drivers, and RF receiver via GPIO and SPI.

Use Value: 120 MHz Cortex-M3 executes real-time PID loop for smooth gate movement; CAN FD reports status to BCM at 2 Mbps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TC375LPDCAKXUMA1TriCore™ architecture, 300 MHz, 4 MB Flash, no integrated CAN FD PHYTargeted at higher-performance powertrain and chassis systems requiring dual-core lockstepChoose when ASIL-D functional safety and >200 MHz compute throughput are mandatory
S32K144HAT0MLHTARM Cortex-M4F core, 112 MHz, 1 MB Flash, CAN FD with built-in transceiver supportOptimized for entry-level automotive networking with simplified board layout and lower BOM costPrefer for cost-sensitive gateway or junction box designs where FPU and DSP extensions add value

Compared with TC375LPDCAKXUMA1 and S32K144HAT0MLHT, CY9BF506NBPMC-G-JNE2 delivers balanced performance, ASIL-B compliance, and CAN FD integration at a footprint suitable for space-constrained body modules-without requiring external transceiver biasing or complex safety compiler toolchains.

Availability

CY9BF506NBPMC-G-JNE2 is available at Aetrix Electronics and suitable for body control modules, roof modules, seat control units, and trunk/liftgate modules requiring stable component supply across automotive production lifecycles.

Supply support for CY9BF506NBPMC-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CY9BF506NBPMC-G-JNE2 belongs to the Traveo™ II family-designed specifically for automotive body electronics demanding functional safety, real-time responsiveness, and robust communication interfaces.

FAQ

Is CY9BF506NBPMC-G-JNE2 qualified for automotive use?

Yes. It is AEC-Q100 Grade 2 qualified (−40°C to +125°C) and designed to meet ASIL-B requirements per ISO 26262. The MCU includes hardware safety mechanisms such as memory parity, lockstep-capable peripherals, and configurable watchdog timers validated for automotive body electronics.

Does this MCU include an integrated CAN FD transceiver?

No. CY9BF506NBPMC-G-JNE2 contains a CAN FD controller only. An external CAN FD transceiver (e.g., TJA1044T/3) must be used to drive the physical bus. The controller supports bit rates up to 5 Mbps in the data phase and complies with ISO 11898-1:2015.

What debug interface does CY9BF506NBPMC-G-JNE2 support?

It supports SWD (Serial Wire Debug) via dedicated SWDIO and SWCLK pins. No JTAG interface is provided. Debug access is compatible with standard ARM CoreSight tools including Keil µVision, IAR Embedded Workbench, and Infineon's DAVE™ IDE.

Can the 1 MB Flash be used for EEPROM emulation?

Yes. Infineon provides a certified Flash EEPROM Emulation library supporting wear leveling and atomic write operations across designated Flash sectors. The library is validated for ≥100,000 erase/write cycles and integrates with AUTOSAR MCAL.

CY9BF506NBPMC-G-JNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
FM3 MB9B500B
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9BF506NBPMC-G-JNE2 FAQ

1.How can I place an order for CY9BF506NBPMC-G-JNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9BF506NBPMC-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9BF506NBPMC-G-JNE2 reliable?

The price and inventory of CY9BF506NBPMC-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9BF506NBPMC-G-JNE2 is usually 5 days.

3.What payment methods are accepted for CY9BF506NBPMC-G-JNE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9BF506NBPMC-G-JNE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9BF506NBPMC-G-JNE2?

CY9BF506NBPMC-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9BF506NBPMC-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9BF506NBPMC-G-JNE2?

For technical support, including CY9BF506NBPMC-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9BF506NBPMC-G-JNE2 requirements.

6.How does Aetrix verify that CY9BF506NBPMC-G-JNE2 is sourced from the original manufacturer or authorized distributors?

All CY9BF506NBPMC-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9BF506NBPMC-G-JNE2 meets industry standards.

7.What is the process for return or replacement of CY9BF506NBPMC-G-JNE2?

All CY9BF506NBPMC-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9BF506NBPMC-G-JNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9BF506NBPMC-G-JNE2 part is unused and in its original packaging.

Return procedure for CY9BF506NBPMC-G-JNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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