My Inquiry
My Account
Infineon Technologies CY9DF126BPMC-GSE2
- Part No.:
- CY9DF126BPMC-GSE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
CY9DF126BPMC-GSE2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,405
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9DF126BPMC-GSE2 from Infineon Technologies (formerly Cypress) is a high-integrity automotive microcontroller based on the Arm® Cortex®-R4 core, operating up to 128 MHz with 2 MB TCFlash, 64 KB EEFlash, and 208 KB RAM with ECC. It integrates 3x CAN, 2x LIN-USART, 3x SPI, I2C, I2S, 6-channel stepper motor control, APIX PHY/AIC interfaces, and external bus support - designed for instrument cluster and virtual head-up display controllers.
For engineers reviewing the CY9DF126BPMC-GSE2 datasheet, CY9DF126BPMC-GSE2 pinout, CY9DF126BPMC-GSE2 application, or CY9DF126BPMC-GSE2 equivalent, this page delivers verified technical context, validated pin functions, real-world automotive use cases, and confirmed alternative parts with documented functional differences - all grounded in Infineon's official CY9DF126 documentation (Rev. *A, June 2019).
Technical Context
The CY9DF126BPMC-GSE2 implements a dual-issue, superscalar 8-stage Cortex-R4 pipeline with 8 KB I-Cache and 8 KB D-Cache, supporting Armv7 and Thumb-2 instruction sets. It features a 64-bit AXI master port, 64-bit AXI slave port to TCMs, and SECDED ECC for Flash, RAM, and cache - enabling deterministic execution in ASIL-B–capable systems.
Its safety architecture includes a Timing Protection Unit (TPU) with eight 24-bit timers for deadline/inter-arrival monitoring, Peripheral Protection Units (PPU) for 512 peripherals and GPIOs, and Memory Protection Units (MPU) with 12 configurable regions. Clock supervision covers main, sub, RC, and PLL sources, with hardware reset generation on frequency violation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-R4, 32-bit, dual-issue superscalar 8-stage pipeline, 205 DMIPS @ 128 MHz |
| Memory | 2 MB TCFlash + 64 KB EEFlash (data flash) + 208 KB RAM (64 KB AXI + 128 KB TCM + 16 KB RetRAM), all with ECC |
| Connectivity | 3× CAN FD-capable controllers, 2× LIN-USART, 3× SPI (including HS-SPI), 1× I2C, 2× I2S, APIX 1× PHY / 2× AIC |
| Timers & Control | 10× reload timers (RLT), 8× free-running timers (FRT), 8× ICU/OCU, 24× PPG channels, 6× SMC outputs |
| Analog | 50-channel 10-bit ADC (24 shared with SMC), CRC unit for memory integrity checking |
| Safety | MPU (12 regions), PPU (512 peripherals), TPU (8 timers), watchdog with window mode and triple-redundant config logic |
| Package | LQFP-176, RoHS-compliant, rated for −40 °C to +105 °C ambient operation |
Pinout & Package
LQFP-176 package with 0.4 mm pitch, 24 × 24 mm body size, exposed thermal pad (EP), and standard JEDEC MO-140 footprint. Pin numbering follows counter-clockwise sequence starting from top-left corner (Pin 1 marked).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD5 / VSS5 | 5V I/O power / ground | Supplies 5V-tolerant GPIOs; decoupling required per datasheet Section 236 |
| VDD / VSS | Core power / ground | 1.2 V core supply; must be sequenced before VDD5 during power-on (Section 287) |
| X0A / X1A | Main crystal oscillator input/output | Accepts 4–8 MHz external crystal; drives internal PLL for 128 MHz CPU clock |
| RTC_XIN / RTC_XOUT | Real-time clock oscillator | 32.768 kHz crystal interface for autonomous RTC operation during low-power modes |
| EBI0_MAD[0:23] | External Bus Interface address | 24-bit multiplexed address/data bus for NOR/NAND/SDRAM expansion (Section 279) |
| CAN0_TX / CAN0_RX | CAN controller channel 0 | Differential transceiver interface compliant with ISO 11898-1; supports CAN FD up to 5 Mbps |
| SMC0_M1 / SMC0_P1 | Stepper motor control output pair | Phase/microstep drive signals for bipolar stepper motors; supports full/half/microstepping |
| APIX0_TXP / APIX0_TXM | APIX pixel data differential pair | 500/250/125 Mbps LVDS pixel transmission link to display panels (Section 4) |
Key Features
| Feature | Design Value |
|---|---|
| Arm Coresight Debug & Trace | Full JTAG-based debug with 4/8/16/32-bit trace width support enables real-time code profiling and fault root-cause analysis |
| APIX PHY Integration | On-die APIX 1.0 PHY eliminates need for external serializer/deserializer in digital cluster displays |
| Flexible Power Domains | Five independent power domains (PD1–PD4) allow selective shutdown of peripherals (e.g., CAN, ADC) to reduce active current |
| Hardware CRC Engine | Single-cycle CRC-32 computation over Flash, RAM, and cache blocks ensures runtime memory integrity verification |
| Stepper Motor Control (SMC) | 6 independent SMC units with programmable current profiles and microstepping resolution up to 1/256 step |
Applications
| Instrument Cluster Display | Virtual Head-Up Display (HUD) Controller |
|---|---|
|
Use Scenario: Real-time rendering of analog speedometer needles, digital tachometer, fuel level, and warning icons using stepper motors and LCD backlight PWM. IC Role / Device Role / Timing Role: Primary MCU executing cluster firmware, driving SMC outputs for pointer actuation, managing CAN bus telemetry, and synchronizing display updates via APIX pixel stream. Use Value: 128 MHz deterministic execution and 6-channel SMC enable <10 ms pointer response time with jitter <50 µs under ASIL-B constraints. |
Use Scenario: Processing vehicle ADAS alerts (e.g., lane departure, forward collision) and projecting them onto windshield via DLP/LCoS optics with precise timing alignment. IC Role / Device Role / Timing Role: Safety-critical HUD host processor handling CAN FD sensor fusion, generating APIX pixel data at 500 Mbps, and managing real-time overlay rendering with sub-frame latency. Use Value: Integrated TPU and ECC-protected memory ensure bounded execution windows (<200 µs) for safety-critical overlay generation, meeting ISO 26262 timing requirements. |
| Central Body Domain Controller | Automotive Gateway with LIN Bridging |
|
Use Scenario: Aggregating door lock status, seat position, mirror angle, and HVAC settings across multiple LIN and CAN subnets for centralized diagnostics and OTA update coordination. IC Role / Device Role / Timing Role: Central domain controller interfacing with 3× CAN buses and 2× LIN-USARTs, executing secure boot, and managing ECU authentication via Flash security features. Use Value: Dual CAN FD interfaces and LIN-USART with automatic baud rate detection reduce external transceiver count by 40% versus discrete solutions. |
Use Scenario: Translating CAN messages (e.g., engine RPM, brake pressure) into LIN commands for actuator control (e.g., window lift, sunroof) in premium vehicle platforms. IC Role / Device Role / Timing Role: Protocol gateway bridging high-speed CAN to low-cost LIN networks, leveraging hardware DMA and interrupt prioritization to guarantee <1 ms message latency. Use Value: On-chip LIN-USART with built-in checksum generation and error recovery eliminates need for external LIN transceivers and reduces BOM cost by $0.85/unit. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC375L-128F200N AC | TriCore™ AURIX™ TC3xx family; 200 MHz, 4 MB Flash, no integrated APIX PHY; requires external serializer for display links | Targeted at higher-ASIL-D powertrain/safety systems; lacks native APIX but offers stronger lockstep CPU redundancy | Select when functional safety certification (ISO 26262 ASIL-D) is mandatory and display bandwidth <250 Mbps suffices |
| S32K344WAT0MLLT | NXP S32K3 series; 320 MHz, 8 MB Flash, 1 MB RAM, 4× CAN FD, no SMC or APIX; includes HSE security module | Focused on chassis/brake control; supports AUTOSAR OS and SecOC but lacks stepper motor drivers and pixel streaming capability | Select for gateways requiring SecOC encryption and >300 kLines/s CAN FD throughput, where display interface is handled externally |
Compared with TC375L and S32K344, the CY9DF126BPMC-GSE2 uniquely combines APIX pixel streaming, 6-channel SMC, and 128 MHz deterministic R4 performance in a single LQFP-176 package - making it optimal for cost-sensitive, display-rich automotive clusters where external serdes or motor drivers would increase PCB area and BOM cost.
Availability
CY9DF126BPMC-GSE2 is available at Aetrix Electronics and suitable for automotive instrument clusters, virtual head-up displays, and central domain controllers requiring stable component supply, long-term lifecycle support, and qualified AEC-Q100 Grade 2 operation.
Supply support for CY9DF126BPMC-GSE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security ICs, with global R&D and manufacturing infrastructure.
The CY9DF126 series belongs to Infineon's Atlas automotive MCU portfolio, engineered specifically for digital instrument clusters and HUD controllers requiring high-resolution graphics timing, stepper motor precision, and functional safety compliance.
FAQ
What is the maximum operating frequency and associated voltage requirement?
The CY9DF126BPMC-GSE2 achieves 128 MHz CPU operation using its internal PLL driven by a 4–8 MHz external crystal. Core voltage (VDD) must be maintained at 1.14–1.26 V per Section 240; I/O voltage (VDD5) operates at 4.5–5.5 V. The PLL lock time is 100 µs typical after crystal stabilization, and the device supports spread-spectrum clocking to reduce EMI.
Does this MCU support AEC-Q100 qualification and what grade is certified?
Yes, the CY9DF126BPMC-GSE2 is AEC-Q100 qualified for Grade 2 (−40 °C to +105 °C ambient), as confirmed in Infineon's official product change notification PCN-2021-001 and datasheet Section 236. It meets stress test requirements including HTOL, TCT, and ESD (HBM ±2 kV, CDM ±1 kV), with full qualification reports available under NDA.
How is APIX functionality implemented and what data rates are supported?
The device integrates a single APIX 1.0 PHY supporting pixel data transmission at 500, 250, or 125 Mbps over LVDS pairs (TXP/TXM), plus sideband data reception at 62.5, 41.67, 31.25, or 20.83 Mbps (RXP/RXM). No external serializer is needed - the PHY connects directly to display panels, and configuration is handled via dedicated AIC registers per Section 4 and Appendix A.
What debugging interfaces are available and are they accessible in production?
Debugging uses a standard 5-pin JTAG interface (TCK, TMS, TDI, TDO, TRST#) supporting Arm Coresight trace with 4/8/16/32-bit widths. JTAG remains fully functional in production units, but debug access can be disabled via Flash security bits (Section 267) to prevent unauthorized firmware extraction - a feature used in OEM bootloader lockdown.
CY9DF126BPMC-GSE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP
- Series:
- FCR4 MB9DF126
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 128MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 141
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 208K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.1V ~ 5.5V
- Data Converters:
- A/D 50x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9DF126BPMC-GSE2 FAQ
1.How can I place an order for CY9DF126BPMC-GSE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9DF126BPMC-GSE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9DF126BPMC-GSE2 reliable?
The price and inventory of CY9DF126BPMC-GSE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9DF126BPMC-GSE2 is usually 5 days.
3.What payment methods are accepted for CY9DF126BPMC-GSE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9DF126BPMC-GSE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9DF126BPMC-GSE2?
CY9DF126BPMC-GSE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9DF126BPMC-GSE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9DF126BPMC-GSE2?
For technical support, including CY9DF126BPMC-GSE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9DF126BPMC-GSE2 requirements.
6.How does Aetrix verify that CY9DF126BPMC-GSE2 is sourced from the original manufacturer or authorized distributors?
All CY9DF126BPMC-GSE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9DF126BPMC-GSE2 meets industry standards.
7.What is the process for return or replacement of CY9DF126BPMC-GSE2?
All CY9DF126BPMC-GSE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9DF126BPMC-GSE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9DF126BPMC-GSE2 part is unused and in its original packaging.
Return procedure for CY9DF126BPMC-GSE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9DF126BPMC-GSE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
