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Infineon Technologies CY9EF226BPMC-GSE2
- Part No.:
- CY9EF226BPMC-GSE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
CY9EF226BPMC-GSE2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,365
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Product details
Overview
CY9EF226BPMC-GSE2 from Infineon Technologies (formerly Cypress) is a high-integrity automotive microcontroller based on the Arm® Cortex®-R4 core, featuring 2MB internal Flash, 208KB RAM with ECC, and integrated 2D graphics engine (IRIS-SDL) with 1MB embedded VRAM. It delivers 205 DMIPS at up to 128 MHz via internal PLL, supports dual CAN, 50-channel 10-bit ADC, and operates from −40 °C to +105 °C in LQFP-176 for instrument cluster applications.
For engineers reviewing the CY9EF226BPMC-GSE2 datasheet, CY9EF226BPMC-GSE2 pinout, CY9EF226BPMC-GSE2 application, or CY9EF226BPMC-GSE2 equivalent, key selection criteria include functional safety features (TPU, MPU, PPU, CRC), graphics subsystem timing (40 MHz pixel clock, alpha blending), and automotive interface support (LIN-USART, SMC, RSDS/TTL display outputs).
Technical Context
The CY9EF226BPMC-GSE2 implements a dual-issue, superscalar 8-stage pipeline Cortex-R4 core with 8KB I-Cache and 8KB D-Cache, SECDED ECC on TCM and AXI RAM, and tightly coupled memory architecture enabling deterministic real-time execution. Its power domain segmentation (PD1–PD4) enables selective shutdown of peripherals including graphics, CAN, and ADC subsystems.
The IRIS-SDL graphics engine integrates command sequencer, bit blitter, signature unit, and TCON with support for four display layers plus dedicated alpha layer, RGB888 output, and dithering-enabling direct drive of TFT panels up to 1024×1024 @ 40 MHz pixel clock without external frame buffer.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-R4, 32-bit Armv7, dual-issue superscalar pipeline, 205 DMIPS @ 128 MHz |
| Memory | 2 MB TCFlash, 48 KB EEFlash (data flash), 208 KB RAM with ECC (64 KB AXI + 128 KB TCM + 16 KB RetRAM) |
| Graphics | IRIS-SDL 2D engine, 1 MB embedded VRAM, 40 MHz max pixel clock, 1024×1024 resolution, 4 foreground + 1 alpha layer |
| Peripherals | 2× CAN, 2× LIN-USART, 3× SPI, 1× I²C, 2× I²S, 6× SMC outputs, 50-channel 10-bit ADC, 8× FRT, 10× RLT |
| Safety | MPU (12 regions), PPU, TPU (8× 24-bit timers), CRC on Flash/Cache/RAM, watchdog with window mode & triple redundancy |
| Security | Secure Hardware Extension (SHE): AES engine, TRNG, secure key repository, debug/test/flash protection |
| Package | LQFP-176, 24×24 mm, 0.5 mm pitch, Pb-free, RoHS-compliant, rated for −40 °C to +105 °C |
Pinout & Package
LQFP-176 package with 24×24 mm body, 0.5 mm lead pitch, and exposed thermal pad (EP). Pinout validated per Infineon document 002-05678 Rev. *C, pages 15–64.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| X0A / X1A | Crystal oscillator input/output | Connects to external 4–8 MHz crystal for main system clock; supports low-jitter timing reference for PLL |
| RTC_WOT | Real-time clock wake-up output | Active-low signal indicating RTC alarm or periodic wake event during deep-sleep modes |
| GFX0_DISP[0..25] | Parallel RGB888 display data bus | 26-bit wide bus supporting 24-bit RGB + 2 control bits for TTL or RSDS panel interface |
| CAN0_TX / CAN0_RX | CAN controller differential pair | Direct connection to external CAN transceiver; compliant with ISO 11898-1, supports bit rates up to 1 Mbps |
| ADC0_AN0..31 | Analog input channel group | 32 of 50 ADC inputs routed to dedicated pins; 10-bit SAR with programmable sampling time and hardware averaging |
| PPGn_PPGA / PPGB | Programmable pulse generator outputs | High-resolution PWM outputs for stepper motor phase control (up to 6 channels shared across SMC/PPG) |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN + LIN-USART | Enables concurrent communication with vehicle network (CAN) and sensor/actuator subnets (LIN), reducing gateway complexity in clusters |
| IRIS-SDL Graphics Engine | Hardware-accelerated 2D rendering with alpha blending, rotation, gamma correction, and dithering-eliminates need for external GPU or frame buffer DRAM |
| Functional Safety Architecture | Integrated TPU, MPU, PPU, and CRC units meet ASIL-B requirements per ISO 26262 Part 5 without external safety monitor |
| Secure Hardware Extension (SHE) | On-chip AES-128/192/256, TRNG, and protected key storage enable secure boot, firmware authentication, and OTA update integrity |
| Flexible Power Domains | Independent PD2 (peripherals), PD4 (RetRAM + I²C/USART), and GFX power domains allow fine-grained sleep mode control for <5 µA retention current |
Applications
| Hybrid Instrument Cluster | Classical Analog Cluster |
|---|---|
Use Scenario: Digital speedometer, tachometer, and battery voltage gauge overlaid on analog pointer dials with animated transitions. IC Role / Device Role / Timing Role: Primary MCU executing real-time gauge logic, driving stepper motors for pointer movement, and rendering overlay graphics via IRIS-SDL. Use Value: Single-chip solution eliminates separate graphics processor and motor driver ICs; 40 MHz pixel clock ensures smooth 60 Hz refresh on 800×480 TFT. | Use Scenario: Fully analog dashboard with electromechanical gauges, warning lamps, and segmented LCD fuel/oil indicators. IC Role / Device Role / Timing Role: System controller managing lamp sequencing, fault detection, CAN message parsing, and stepper motor actuation for needle positioning. Use Value: Integrated 6-channel SMC and 50-channel ADC enable direct interface to all sensors and actuators-no external signal conditioning required. |
| TFT Display Head-Up Unit (HUD) | Automotive Diagnostic Interface |
Use Scenario: Compact HUD projecting navigation prompts and ADAS alerts onto windshield using DLP or LCoS optics. IC Role / Device Role / Timing Role: Graphics subsystem generates anti-aliased vector glyphs and overlays them onto camera feed; TCON synchronizes pixel clock to optical modulator timing. Use Value: Embedded 1 MB VRAM stores glyph cache and frame buffers; dithering compensates for limited color depth in monochrome microdisplays. | Use Scenario: In-vehicle diagnostic tool connecting to OBD-II port, interpreting UDS protocols, and logging CAN bus traffic. IC Role / Device Role / Timing Role: Dual CAN controller handles simultaneous communication with ECU and diagnostic host; HS-SPI interfaces to external flash for protocol stack storage. Use Value: SHE-enabled secure boot prevents unauthorized firmware modification; CRC-protected Flash ensures diagnostic code integrity across lifecycle updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC375L-128F300F AB | TriCore™ AURIX™, 300 MHz, 4 MB Flash, no integrated graphics engine, higher ASIL-D capability | Targeted at safety-critical powertrain/EPS; lacks native display subsystem and VRAM | Select when functional safety level exceeds ASIL-B or graphics acceleration is unnecessary |
| RA8T10522FBC0 | Arm Cortex-R52, 480 MHz, 2 MB Flash, 1 MB SRAM, no built-in VRAM or display controller | Requires external DDR for graphics; optimized for motor control + AI inference, not display-centric use cases | Select when higher CPU throughput is needed and display subsystem can be implemented externally |
Compared with TC375L and RA8T105, the CY9EF226BPMC-GSE2 uniquely integrates IRIS-SDL graphics, 1 MB VRAM, and RSDS/TTL display outputs-making it optimal for cost-sensitive, display-intensive automotive clusters where single-chip integration reduces BOM count and PCB area.
Availability
CY9EF226BPMC-GSE2 is available at Aetrix Electronics and suitable for hybrid instrument clusters, classical analog clusters, head-up displays, and automotive diagnostic interfaces requiring stable component supply, long-term lifecycle support, and automotive-grade qualification.
Supply support for CY9EF226BPMC-GSE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The CY9EF226 series belongs to Infineon's Titan family of automotive microcontrollers, designed specifically for digital instrument clusters requiring integrated graphics, functional safety, and real-time deterministic performance in harsh environments.
FAQ
What is the maximum operating frequency and how is it achieved?
The CY9EF226BPMC-GSE2 achieves 128 MHz CPU operation using its on-chip PLL, which multiplies an external 4–8 MHz crystal input. The PLL supports spread-spectrum clock generation to reduce EMI, and stabilization timers ensure reliable lock under temperature and voltage variation. No external clock synthesizer is required.
Does this MCU support ASIL-B compliance out of the box?
Yes-the device includes integrated safety mechanisms such as TPU, MPU, PPU, CRC on Flash/Cache/RAM, and triple-redundant watchdog configuration, enabling ASIL-B compliance per ISO 26262 Part 5 without external safety monitors. Safety manuals and FMEDA reports are provided by Infineon for system-level certification.
Can the IRIS-SDL graphics engine drive a 1024×600 RSDS panel directly?
Yes-RSDS output is supported via dedicated GFX0_TSIG[0..11] and GFX0_DISP[0..25] pins. The 40 MHz pixel clock meets timing requirements for 1024×600 @ 60 Hz (39.8 MHz), and the alpha-blending engine enables overlay of digital content on analog background layers without external compositing hardware.
Is Secure Hardware Extension (SHE) enabled by default after reset?
No-SHE is disabled at power-on reset and must be explicitly enabled via the SHE_CTRL register. Once enabled, cryptographic operations (AES, TRNG) and key storage become accessible only in privileged mode, and debug access to SHE registers is blocked unless unlocked via secure boot sequence with valid certificate chain.
CY9EF226BPMC-GSE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP
- Series:
- FCR4 MB9EF226
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 128MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 117
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 48K x 8
- RAM Size:
- 208K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 50x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9EF226BPMC-GSE2 FAQ
1.How can I place an order for CY9EF226BPMC-GSE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9EF226BPMC-GSE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9EF226BPMC-GSE2 reliable?
The price and inventory of CY9EF226BPMC-GSE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9EF226BPMC-GSE2 is usually 5 days.
3.What payment methods are accepted for CY9EF226BPMC-GSE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9EF226BPMC-GSE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9EF226BPMC-GSE2?
CY9EF226BPMC-GSE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9EF226BPMC-GSE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9EF226BPMC-GSE2?
For technical support, including CY9EF226BPMC-GSE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9EF226BPMC-GSE2 requirements.
6.How does Aetrix verify that CY9EF226BPMC-GSE2 is sourced from the original manufacturer or authorized distributors?
All CY9EF226BPMC-GSE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9EF226BPMC-GSE2 meets industry standards.
7.What is the process for return or replacement of CY9EF226BPMC-GSE2?
All CY9EF226BPMC-GSE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9EF226BPMC-GSE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9EF226BPMC-GSE2 part is unused and in its original packaging.
Return procedure for CY9EF226BPMC-GSE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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