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Cypress Semiconductor Corp CYD02S36V18-200BBXC
- Part No.:
- CYD02S36V18-200BBXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
CYD02S36V18-200BBXC.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:100
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Product details
Overview
CYD02S36V18-200BBXC from Cypress Semiconductor is a 2-Mbit (64K × 36) synchronous true dual-port SRAM with independent 36-bit ports, 200 MHz SDR interface, deterministic collision control, and 1.5 V/1.8 V core supply-designed for high-speed inter-processor communication in telecom line cards and packet buffer applications.
For engineers reviewing the CYD02S36V18-200BBXC datasheet, CYD02S36V18-200BBXC pinout, CYD02S36V18-200BBXC application, or CYD02S36V18-200BBXC equivalent, key selection criteria include simultaneous port access timing, configurable pipelined/flow-through latency, echo clock support, VIM impedance matching, and mailbox interrupt capability for real-time message passing.
Technical Context
This device implements a synchronous dual-port architecture with two independent 36-bit data buses, each supporting single-data-rate operation at up to 200 MHz. It features deterministic access arbitration that outputs a busy flag and returns the colliding address on the bus within one cycle.
The logic includes dual chip enables per port, burst counters with mask/mirror registers, mailbox registers with interrupt flags, JTAG boundary scan (IEEE 1149.1), and asynchronous Master Reset. I/O voltage supports selectable standards: 1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL (1.4–1.9 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Mbit (64K × 36 bits), enabling compact dual-port buffering for mid-bandwidth packet processing. |
| Max Clock Frequency | 200 MHz SDR - delivers 14.4 Gbps aggregate bandwidth (200 MHz × 36-bit × 2 ports). |
| Core Supply Voltage | 1.5 V or 1.8 V - reduces dynamic power vs. 3.3 V SRAMs while maintaining timing margins. |
| IO Voltage Options | Selectable 1.8 V LVCMOS / 2.5 V LVCMOS / Extended HSTL - allows direct interfacing with FPGA I/O banks without level shifters. |
| Address Bits | 16-bit address bus (A0–A15) - matches 64K depth addressing with no external decoding overhead. |
| Byte Enables | Four BE[3:0] signals per port - enables granular 8-bit write masking for protocol header updates without read-modify-write cycles. |
| Collision Response | Deterministic flag + first-busy-address readback - eliminates arbitration uncertainty in real-time control loops. |
Pinout & Package
Package: 256-ball Fine-Pitch BGA (FBGA), 1.0 mm pitch, body size 17 mm × 17 mm - optimized for high-density PCB layouts with thermal and signal integrity in mind.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[15:0]L / A[15:0]R | Left/Right port address inputs | 16-bit parallel address per port; no multiplexing - simplifies timing closure in synchronous designs. |
| DQ[35:0]L / DQ[35:0]R | Left/Right port bidirectional data | 36-bit wide data path per port; supports full-word transfers without byte-lane stitching. |
| CE0L/CE1L, CE0R/CE1R | Chip enable pairs per port | Dual CE per port enables depth expansion via cascaded chip selects without external logic. |
| R/WL / R/WR | Read/write direction control | Active-high control per port - aligns with standard FPGA memory controller polarity. |
| BE[3:0]L / BE[3:0]R | Byte enable inputs | Four independent 8-bit masks per port - enables efficient partial writes in protocol stack implementations. |
| CNT/MSKL / CNT/MSKR | Burst counter/mask register load | Loads initial address or mask value into internal counter logic for sequential DMA-style access. |
| INTL / INTR | Mailbox interrupt outputs | Open-drain active-low flags signaling message arrival - directly wireable to FPGA interrupt controllers. |
Key Features
| Feature | Design Value |
|---|---|
| Deterministic collision resolution | Guaranteed busy flag assertion and colliding address readback within one clock cycle - eliminates race conditions in lock-free inter-processor messaging. |
| Configurable pipelined/flow-through mode | Runtime-selectable latency: 1-cycle flow-through for low-latency control paths or 2-cycle pipelined for maximum frequency stability. |
| Echo clock outputs (CQ0L/CQ0R, CQ1L/CQ1R) | Source-synchronous clocks aligned to data edges - relaxes PCB trace length matching requirements for >150 MHz interfaces. |
| Variable impedance matching (VIM) | On-die termination calibration via ZQ pins - maintains signal integrity across varying PCB trace impedances without external resistors. |
| Mailbox with interrupt flags | Dedicated register space per port with INTL/INTR assertion - enables zero-overhead inter-core notification without polling or shared memory arbitration. |
Applications
| Telecom Line Card Buffering | Industrial PLC Dual-CPU Communication |
|---|---|
|
Use Scenario: Storing incoming/outgoing packet headers and metadata between line interface ASIC and traffic management processor. IC Role / Device Role / Timing Role: Shared memory buffer with simultaneous read/write access from two independent clock domains. Use Value: Eliminates FIFO handshaking overhead and enables zero-latency header inspection by both processors using deterministic collision handling. |
Use Scenario: Exchanging real-time I/O status and control commands between safety-critical and non-safety CPU cores in modular PLC backplanes. IC Role / Device Role / Timing Role: Deterministic inter-core mailbox with hardware-enforced access arbitration. Use Value: Ensures predictable worst-case response time (<10 ns jitter) for safety loop execution, meeting IEC 61508 SIL-3 timing constraints. |
| Medical Imaging Data Pipeline | Test Equipment Pattern Memory |
|
Use Scenario: Holding pixel stream buffers between ADC front-end and image reconstruction engine in ultrasound systems. IC Role / Device Role / Timing Role: High-bandwidth dual-port memory supporting concurrent acquisition and processing at 200 MHz. Use Value: Sustains 14.4 Gbps throughput without bottlenecking 12-bit × 100 MSPS ADC streams, reducing system-level buffering latency. |
Use Scenario: Storing stimulus/response vectors for automated functional test of SoCs in ATE platforms. IC Role / Device Role / Timing Role: Reconfigurable pattern memory accessed simultaneously by pattern generator and comparator logic. Use Value: Enables real-time pass/fail evaluation with no pipeline stalls - critical for sub-microsecond test cycle times. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102432BLL-10TLI | Asynchronous interface, 10 ns access, 32-bit bus, no built-in collision logic or mailbox. | Lacks deterministic arbitration and echo clocks - requires external logic for multi-CPU coordination. | Choose when cost sensitivity outweighs need for deterministic timing and inter-core messaging features. |
| MT45W8MW16BGX-107 | DDR2 SDRAM, 16-bit bus, 107 MHz, requires refresh and command sequencing. | No true dual-port capability - uses bank interleaving for pseudo-concurrent access. | Prefer only if higher density (>2 Mbit) and lower cost justify added controller complexity and latency variability. |
Compared with IS61WV102432BLL-10TLI and MT45W8MW16BGX-107, CYD02S36V18-200BBXC uniquely delivers deterministic collision resolution, echo clocks for timing margin, and mailbox interrupts - making it optimal for real-time inter-processor communication where predictability trumps raw density or cost.
Availability
CYD02S36V18-200BBXC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and automated test equipment requiring stable component supply and long-term lifecycle support.
Supply support for CYD02S36V18-200BBXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing reliability, low power, and integration.
CYD02S36V18 belongs to the FullFlex™ SDR Dual-Port SRAM product line, engineered specifically for deterministic, low-latency inter-processor communication in real-time systems where simultaneous access and hardware-managed arbitration are critical.
FAQ
What is the minimum supported core voltage for CYD02S36V18-200BBXC?
The device operates at either 1.5 V ± 0.1 V or 1.8 V ± 0.1 V core supply. Both voltages are fully supported across commercial (0°C to +70°C) and industrial (–40°C to +85°C) temperature ranges. No derating or performance penalty applies when selecting 1.5 V mode.
Does CYD02S36V18-200BBXC support JTAG boundary scan?
Yes, it implements IEEE 1149.1 compliant boundary scan with dedicated TDI, TDO, TMS, TCK, and TRST pins. The scan chain covers all I/Os and internal logic blocks, enabling board-level test and debug without requiring external test fixtures.
Can the left and right ports operate at different I/O voltage standards?
Yes - each port independently supports 1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL (1.4–1.9 V). This allows interfacing with heterogeneous logic families, such as connecting the left port to a 1.8 V FPGA bank and the right port to a 2.5 V ASIC interface.
How does the burst counter function in CYD02S36V18-200BBXC?
The burst counter loads an initial address via CNT/MSKL/R, then auto-increments on each clock cycle. It supports wrap-around, hold, retransmit, and interrupt generation (CNTINTL/R) upon reaching max count. Address and mask values are readable back on the data bus during specific cycles.
CYD02S36V18-200BBXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.3 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FBGA (17x17)
CYD02S36V18-200BBXC FAQ
1.How can I place an order for CYD02S36V18-200BBXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYD02S36V18-200BBXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYD02S36V18-200BBXC reliable?
The price and inventory of CYD02S36V18-200BBXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD02S36V18-200BBXC is usually 5 days.
3.What payment methods are accepted for CYD02S36V18-200BBXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD02S36V18-200BBXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYD02S36V18-200BBXC?
CYD02S36V18-200BBXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYD02S36V18-200BBXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYD02S36V18-200BBXC?
For technical support, including CYD02S36V18-200BBXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD02S36V18-200BBXC requirements.
6.How does Aetrix verify that CYD02S36V18-200BBXC is sourced from the original manufacturer or authorized distributors?
All CYD02S36V18-200BBXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD02S36V18-200BBXC meets industry standards.
7.What is the process for return or replacement of CYD02S36V18-200BBXC?
All CYD02S36V18-200BBXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD02S36V18-200BBXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYD02S36V18-200BBXC part is unused and in its original packaging.
Return procedure for CYD02S36V18-200BBXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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