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Infineon Technologies CYT2B63CADQ0AZEGS

Part No.:
CYT2B63CADQ0AZEGS
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCYT2B63CADQ0AZEGS.pdf
Description:
IC MCU 32BIT 576KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,492

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Product details

Overview

CYT2B63CADQ0AZEGS from Infineon Technologies (formerly Cypress) is a dual-core automotive-grade microcontroller featuring an 80-MHz Arm Cortex-M4F CPU with FPU and an 80-MHz Arm Cortex-M0+ CPU for peripheral/security processing. It integrates 576 KB code-flash, 64 KB SRAM, CAN FD (up to 8 Mbps), LIN, crypto engine (AES-128/192/256, SHA-256/512, ECC, TRNG), and ASIL-B functional safety support. It targets body control modules requiring secure, low-power, real-time communication and motor-sensing capability.

For engineers reviewing the CYT2B63CADQ0AZEGS datasheet, CYT2B63CADQ0AZEGS pinout, CYT2B63CADQ0AZEGS application, or CYT2B63CADQ0AZEGS equivalent, key selection criteria include dual-CPU partitioning for real-time + security tasks, CAN FD timing compliance (ISO 11898-1:2015), synchronized triple 12-bit SAR ADCs (1 Msps), eSHE/HSM crypto acceleration, and ASIL-B safety mechanisms including SECDED ECC on flash/SRAM.

Technical Context

The CYT2B63CADQ0AZEGS implements hardware-enforced inter-processor communication between its Cortex-M4F and Cortex-M0+ cores, enabling deterministic task separation-M4F handles primary application logic while M0+ manages peripheral offload and secure boot verification. Its clock system includes IMO (8 MHz), ILO (32.768 kHz), ECO, WCO, PLL (up to 80 MHz), and FLL, supporting dynamic frequency scaling across power modes.

Functional safety is architected via MPU, SMPU, PPU, dual watchdogs (WDT/MCWDT), LVD/BOD/OVD, CSV, and SECDED ECC on all safety-critical memories. The crypto engine supports full eSHE and HSM profiles-including RSA/ECC vector unit, AES-GCM, and SHA-512-with dedicated hardware acceleration independent of CPU execution.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 80-MHz Arm Cortex-M4F (FPU, MPU) + 80-MHz Arm Cortex-M0+ (MPU)
Flash Memory576 KB code-flash (RWW, dual-bank for FOTA) + 64 KB work-flash
SRAM64 KB with configurable retention granularity
CAN FD Channels3 total (CAN0/CAN1/CAN2), each compliant to ISO 11898-1:2015, up to 8 Mbps data rate
Analog PeripheralsThree 12-bit SAR ADCs (1 Msps), 35 external channels, synchronized sampling for motor control
Crypto AccelerationAES-128/192/256, SHA-256/512, ECC, RSA, TRNG, GCM mode-all hardware-accelerated
Safety CertificationASIL-B compliant with SECDED ECC, SMPU, PPU, MCWDT, and clock supervisor

Pinout & Package

Package: 100-pin LQFP (14 × 14 × 1.7 mm, 0.5-mm pitch), RoHS-compliant, automotive-grade (AEC-Q100 Grade 2, TA = –40°C to +105°C).

Pin/TerminalCircuit RoleDesign Meaning
VDDD / VDDACore/analog supply2.7–5.5 V input; internal 1.1-V regulator powers core; dual BOD thresholds (2.7 V / 3.0 V) ensure robust brown-out detection
P0[0]–P0[7], P1[0]–P1[7], etc.GPIO_STD / GPIO_ENH78 total programmable I/Os; GPIO_ENH supports enhanced drive strength and slew-rate control for noise-sensitive automotive signals
CAN0_TX / CAN0_RXCAN FD interfaceDifferential signaling pair for CAN FD channel 0; supports ISO 11898-1:2015 physical layer timing and error handling
LIN0_TX / LIN0_RXLIN bus interfaceSingle-wire UART-based interface compliant with ISO 17987; supports auto-baud detection and slave node response timing
SWDIO / SWCLKDebug interfaceArm Serial Wire Debug pins enabling non-intrusive firmware debug, trace (ETM), and secure programming via SWD/JTAG

Key Features

FeatureDesign Value
Dual-CPU Hardware IPCZero-latency mailbox and semaphore registers enable deterministic M4F–M0+ coordination without software polling or OS overhead
Firmware Update Over-The-Air (FOTA)Dual-bank flash architecture allows atomic swap between active/inactive banks during runtime, eliminating boot failure risk during update
Synchronized Triple ADC SamplingHardware-triggered simultaneous start across all three SAR ADCs enables precise phase-aligned current/voltage sensing in BLDC/PMSM motor control
eSHE + HSM Crypto EngineOn-chip hardware root-of-trust with secure boot, key injection, and cryptographic acceleration-no external secure element required
ASIL-B Safety MechanismsIntegrated SMPU enforces memory access isolation between M4F and M0+ domains; SECDED ECC corrects single-bit errors and detects double-bit faults in flash/SRAM

Applications

Body Control Module (BCM)Door Module Control

Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in modern vehicles.

IC Role / Device Role / Timing Role: Primary controller executing real-time PWM for motor drivers and LIN protocol stacks for slave nodes; CAN FD handles high-priority diagnostics and gateway messaging.

Use Value: Dual-core separation isolates safety-critical LIN stack (M0+) from application logic (M4F); synchronized ADCs monitor motor current for stall detection and soft-start control.

Use Scenario: Integrated control of power windows, central locking, and anti-pinch sensors in driver/passenger door assemblies.

IC Role / Device Role / Timing Role: Real-time motor control via TCPWM blocks with dead-time insertion; LIN communication to BCM; GPIO_ENH drives high-current relays with controlled slew rate.

Use Value: Hardware CRC and ECC protect LIN message integrity and flash firmware; ASIL-B safety features meet OEM requirements for occupant protection systems.

Roof Module (Sunroof/Blind Control)Seat Control Unit

Use Scenario: Precision position control and obstruction detection for sunroof glass panels and roller blinds using bidirectional DC motors.

IC Role / Device Role / Timing Role: Motor control via 16-bit TCPWM with quadrature decoding and PWM_DT; analog inputs read potentiometer feedback and current sense resistors.

Use Value: Synchronized triple ADC sampling captures voltage/current simultaneously for accurate torque estimation; CAN FD transmits status to body domain controller at 2 Mbps.

Use Scenario: Adjustment of seat position, lumbar support, and heating elements using multiple DC motors and thermistors.

IC Role / Device Role / Timing Role: Multi-channel PWM generation for motor drivers; SAR ADC reads temperature sensors and potentiometers; crypto engine secures OTA updates for seat profile personalization.

Use Value: eSHE-enabled secure boot prevents unauthorized firmware modification; 64 KB SRAM with retention preserves seat position memory during vehicle sleep mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single-core Arm Cortex-M7 (320 MHz), no integrated M0+ co-processor; supports CAN FD but lacks LIN native supportTargeted at higher-performance gateway/routing applications; requires external LIN transceivers and software stacksSelect when raw compute throughput > 80 MHz and LIN is not required; avoid if dual-core partitioning or LIN integration is mandatory
Renesas RH850/U2A32-bit RXv3 core (240 MHz), no FPU; crypto limited to AES-128 only; no hardware TRNG or SHA-512Focused on powertrain and chassis control; minimal support for body electronics peripherals like Smart I/O or synchronized ADCsSelect for legacy RH850 ecosystem migration; avoid when secure boot with ECC/SHA-512 or motor-sensing ADC sync is required

Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B63CADQ0AZEGS uniquely delivers tightly coupled dual-CPU security partitioning, native LIN + CAN FD concurrency, synchronized triple ADCs for motor control, and full HSM crypto acceleration-all in a single 100-LQFP package qualified for body electronics.

Availability

CYT2B63CADQ0AZEGS is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof control units, and seat control units requiring stable component supply, long lifecycle support, and AEC-Q100 Grade 2 qualification.

Supply support for CYT2B63CADQ0AZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CYT2B63CADQ0AZEGS belongs to the Traveo™ II family-designed specifically for automotive body electronics requiring functional safety (ASIL-B), secure boot, real-time communication (CAN FD/LIN), and integrated motor-sensing capability.

FAQ

What is the maximum operating temperature range for CYT2B63CADQ0AZEGS?

CYT2B63CADQ0AZEGS is rated for ambient temperatures from –40°C to +105°C (AEC-Q100 Grade 2), with internal thermal monitoring via calibrated diode input to ADC1. The device includes overtemperature shutdown logic triggered at junction temperatures exceeding 150°C, and operates reliably under continuous thermal cycling per JESD22-A104.

Does CYT2B63CADQ0AZEGS support hardware-based secure boot with public-key verification?

Yes-CYT2B63CADQ0AZEGS implements fast secure boot using digital signature verification (RSA-2048 or ECDSA-P256) executed entirely in hardware by the crypto engine. Public keys are stored in one-time-programmable (OTP) memory; signature validation occurs before any user code executes, with tamper-evident logging via HSM event counters.

How many CAN FD channels are physically implemented and what is their arbitration/data phase speed limit?

CYT2B63CADQ0AZEGS implements three fully independent CAN FD controllers (CAN0, CAN1, CAN2). Each supports arbitration phase up to 1 Mbps and data phase up to 8 Mbps, compliant with ISO 11898-1:2015. Physical layer speed is constrained by external transceiver and bus topology-not by the MCU itself.

Can the three SAR ADCs perform simultaneous sampling without CPU intervention?

Yes-CYT2B63CADQ0AZEGS supports hardware-synchronized sampling across all three SAR ADCs using a common trigger source (e.g., TCPWM overflow or RTC alarm). This autonomous operation requires no CPU cycles, enabling precise time-aligned acquisition for motor current/voltage sensing in BLDC/PMSM control loops.

CYT2B63CADQ0AZEGS Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
TRAVEO™
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
78
Program Memory Size:
576KB (576K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 22x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B63CADQ0AZEGS FAQ

1.How can I place an order for CYT2B63CADQ0AZEGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B63CADQ0AZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B63CADQ0AZEGS reliable?

The price and inventory of CYT2B63CADQ0AZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B63CADQ0AZEGS is usually 5 days.

3.What payment methods are accepted for CYT2B63CADQ0AZEGS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B63CADQ0AZEGS transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT2B63CADQ0AZEGS?

CYT2B63CADQ0AZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B63CADQ0AZEGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B63CADQ0AZEGS?

For technical support, including CYT2B63CADQ0AZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B63CADQ0AZEGS requirements.

6.How does Aetrix verify that CYT2B63CADQ0AZEGS is sourced from the original manufacturer or authorized distributors?

All CYT2B63CADQ0AZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B63CADQ0AZEGS meets industry standards.

7.What is the process for return or replacement of CYT2B63CADQ0AZEGS?

All CYT2B63CADQ0AZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B63CADQ0AZEGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B63CADQ0AZEGS part is unused and in its original packaging.

Return procedure for CYT2B63CADQ0AZEGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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