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Infineon Technologies CYT2B64BADQ0AZEGS
- Part No.:
- CYT2B64BADQ0AZEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CYT2B64BADQ0AZEGS.pdf
- Description:
- IC MCU 32BIT 576KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,105
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Product details
Overview
CYT2B64BADQ0AZEGS from Infineon Technologies (formerly Cypress) is a dual-core automotive-grade 32-bit Arm® Cortex®-M4F/M0+ microcontroller in the Traveo™ II family, targeting body control modules. It integrates 576 KB code-flash, 64 KB SRAM, hardware crypto engine (AES-128/192/256, SHA-256/512, ECC, TRNG), ASIL-B functional safety features, and up to four CAN FD channels (8 Mbps) for vehicle networking.
For engineers reviewing the CYT2B64BADQ0AZEGS datasheet, CYT2B64BADQ0AZEGS pinout, CYT2B64BADQ0AZEGS application, or CYT2B64BADQ0AZEGS equivalent, key selection criteria include dual-CPU real-time partitioning, CAN FD timing compliance (ISO 11898-1:2015), eSHE/HSM security architecture, and 100-LQFP package with 78 GPIOs supporting LIN/CAN coexistence in automotive ECU designs.
Technical Context
The device implements a tightly coupled dual-CPU subsystem: an 80-MHz Cortex-M4F handles primary application tasks with FPU and MPU, while an 80-MHz Cortex-M0+ manages peripheral offload and security services including secure boot and cryptographic acceleration. Inter-processor communication is hardware-accelerated via dedicated mailbox and semaphore units.
Functional safety is enforced through SMPU, PPU, SECDED ECC on flash/SRAM, dual watchdogs (WDT/MCWDT), and voltage supervision (LVD/BOD/OVD) - all certified for ASIL-B per ISO 26262. Clocking includes PLL/FLL, IMO/ILO/ECO/WCO sources with CSV monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 80-MHz Arm Cortex-M4F + 80-MHz Arm Cortex-M0+, integer-ratio clock synchronization |
| Flash Memory | 576 KB code-flash (448 KB + 128 KB) with RWW, dual-bank FOTA support |
| SRAM | 64 KB with configurable retention granularity per memory region |
| Crypto Engine | HSM-compliant: AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, GCM mode |
| CAN FD Channels | Up to 4 instances, compliant with ISO 11898-1:2015, data rate up to 8 Mbps |
| ADC | Three 12-bit SAR ADCs (SAR0/11ch, SAR1/13ch, SAR2/8ch), 1 Msps max sampling, synchronized motor-sense capability |
| Package | 100-LQFP, 14 × 14 × 1.7 mm, 0.5-mm pitch, 78 GPIO_STD + 4 GPIO_ENH pins |
Pinout & Package
100-LQFP package (14 × 14 × 1.7 mm, 0.5-mm lead pitch) with 78 GPIO_STD and 4 GPIO_ENH pins, plus dedicated power, ground, clock, reset, debug, and analog reference terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD/VDDA | Core/analog supply | 2.7–5.5 V input; internal 1.1-V regulator powers CPU cores and analog blocks |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Programmable I/O | 78 GPIO_STD pins support digital I/O, interrupt, wakeup, and alternate functions (CAN/LIN/SCB) |
| CAN0_TX/CAN0_RX | CAN FD interface | Dedicated differential pair for first CAN FD channel; supports ISO 11898-1 physical layer signaling |
| LIN0_TX/LIN0_RX | LIN bus interface | Five independent LIN channels compliant with ISO 17987; each uses separate TX/RX pins |
| TCK/TMS/TDO/TDI | JTAG debug | IEEE-1149.1-compliant boundary scan and firmware programming interface |
| SWDIO/SWCLK | Serial Wire Debug | Arm SWD port for low-pin-count debug, trace, and flash programming |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Security Partitioning | M0+ isolates crypto operations and secure boot verification from M4F application code, enabling HSM-like trust boundary |
| ASIL-B Safety Architecture | Hardware-enforced protection via SMPU, PPU, SECDED ECC, dual watchdogs, and voltage supervisors - no software-only safety mechanisms |
| CAN FD Timing Compliance | Hardware timestamping, bit-rate switching, and ISO 16845:2015-certified protocol stack support for deterministic automotive networking |
| Synchronized Triple ADC Sampling | Simultaneous start of conversion across all three SAR ADCs enables precise motor phase current measurement without external triggers |
| FOTA-Ready Flash Layout | Dual-bank flash with RWW allows background firmware update while executing from active bank - critical for zero-downtime ECU updates |
Applications
| Body Control Module (BCM) | Door Control Unit (DCU) |
|---|---|
Use Scenario: Centralized management of lighting, windows, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Dual-core MCU orchestrates real-time LIN slave coordination and CAN FD gateway functions between domain ECUs. Use Value: 78 GPIOs enable direct drive of relays and sensors; ASIL-B safety features meet OEM BCM functional safety requirements. | Use Scenario: Intelligent door module integrating window lift, mirror fold, and anti-pinch detection. IC Role / Device Role / Timing Role: Cortex-M4F executes motor control PWM_DT waveforms; Cortex-M0+ handles LIN communication and secure authentication. Use Value: Synchronized triple ADC sampling captures simultaneous phase currents for accurate torque estimation in BLDC window motors. |
| Roof Control Module (RCM) | Seat Control Unit (SCU) |
Use Scenario: Sunroof, panoramic roof, and ambient lighting control with gesture sensing integration. IC Role / Device Role / Timing Role: Smart I/O™ blocks preprocess capacitive touch signals; crypto engine validates firmware updates over CAN FD. Use Value: Three Smart I/O blocks perform Boolean logic on sensor inputs without CPU intervention - reducing latency and power in sleep modes. | Use Scenario: Power seat adjustment with memory presets, heating, and position feedback. IC Role / Device Role / Timing Role: TCPWM blocks generate dead-time-inserted PWM for bidirectional DC motor control; RTC maintains seat position timestamps. Use Value: 50+ TCPWM channels support independent control of multiple motors and heaters while maintaining ASIL-B fault coverage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC375LPDZSKXUMA1 | Tri-core AURIX™ TC3xx (TriCore + 2x Cortex-M7); higher performance (300 MHz), larger flash (4 MB), but no integrated LIN PHY | Targeted at high-end ADAS domains requiring lockstep cores; lacks native LIN transceivers - requires external ICs | Select when needing >200 MHz compute for sensor fusion; avoid if LIN integration and cost-sensitive BOM are priorities |
| S32K344WAT0VLQY | NXP S32K3 series: dual Cortex-M7 + Cortex-M4, 4 MB flash, CAN FD + Ethernet TSN, but no integrated crypto accelerator (relies on software AES) | Designed for zonal gateways with time-sensitive networking; crypto performance limited by software-only implementation | Prefer for Ethernet-enabled architectures; not suitable where hardware TRNG/ECC acceleration is mandatory for PKI-based OTA |
Compared with TC375LPDZSKXUMA1 and S32K344WAT0VLQY, CYT2B64BADQ0AZEGS delivers optimal balance of integrated LIN/CAN FD, hardware crypto, ASIL-B safety, and cost-effective 100-LQFP packaging - making it ideal for mid-tier automotive body electronics where mixed-signal integration and secure FOTA are essential.
Availability
CYT2B64BADQ0AZEGS is available at Aetrix Electronics and suitable for body control modules, door control units, roof control modules, and seat control units requiring stable component supply across automotive production lifecycles.
Supply support for CYT2B64BADQ0AZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The Traveo™ II family was designed specifically for automotive body electronics, integrating dual-core processing, functional safety, and mixed-signal peripherals into a single die optimized for ASIL-B ECU implementations.
FAQ
What is the maximum operating temperature grade for CYT2B64BADQ0AZEGS?
This part is rated for 125 °C ambient temperature (E-grade), qualified per AEC-Q100 Grade 0, and supports continuous operation in under-hood and cabin environments where thermal management is constrained. The device includes on-die temperature monitoring via calibrated diode input to ADC1.
Does CYT2B64BADQ0AZEGS support hardware-based secure boot with public-key verification?
Yes - the integrated crypto engine performs RSA/ECC signature verification during boot using keys stored in protected flash. Secure boot leverages fast secure boot flow with hash comparison against immutable ROM bootloader, and supports both signed image validation and encrypted image decryption.
How many CAN FD message buffers are available per channel?
Each CAN FD instance includes 24 KB of dedicated RAM (48 KB total for two-channel configurations), allocated as configurable message RAM with up to 128 transmit/receive buffers per channel. Buffer size and count are programmable via CAN FD Message RAM Configuration registers.
Can the Cortex-M0+ core access the full 576 KB code-flash independently of the M4F core?
No - flash is shared and arbitrated via the system interconnect. The M0+ accesses flash only through the system bus with priority arbitration; it cannot execute directly from flash but may read configuration or crypto keys. Code execution occurs exclusively from SRAM or tightly coupled memory regions assigned at boot.
CYT2B64BADQ0AZEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- TRAVEO™
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, LVD, PWM, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 576KB (576K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 28x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2B64BADQ0AZEGS FAQ
1.How can I place an order for CYT2B64BADQ0AZEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2B64BADQ0AZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2B64BADQ0AZEGS reliable?
The price and inventory of CYT2B64BADQ0AZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B64BADQ0AZEGS is usually 5 days.
3.What payment methods are accepted for CYT2B64BADQ0AZEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B64BADQ0AZEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT2B64BADQ0AZEGS?
CYT2B64BADQ0AZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2B64BADQ0AZEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2B64BADQ0AZEGS?
For technical support, including CYT2B64BADQ0AZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B64BADQ0AZEGS requirements.
6.How does Aetrix verify that CYT2B64BADQ0AZEGS is sourced from the original manufacturer or authorized distributors?
All CYT2B64BADQ0AZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B64BADQ0AZEGS meets industry standards.
7.What is the process for return or replacement of CYT2B64BADQ0AZEGS?
All CYT2B64BADQ0AZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B64BADQ0AZEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2B64BADQ0AZEGS part is unused and in its original packaging.
Return procedure for CYT2B64BADQ0AZEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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