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Infineon Technologies CYT2B64BADQ0AZEGST
- Part No.:
- CYT2B64BADQ0AZEGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CYT2B64BADQ0AZEGST.pdf
- Description:
- IC MCU 32BIT 576KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,330
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Product details
Overview
CYT2B64BADQ0AZEGST from Infineon Technologies (formerly Cypress) is a dual-core automotive-grade microcontroller featuring an 80-MHz Arm® Cortex®-M4F CPU and an 80-MHz Arm® Cortex®-M0+ CPU, 576 KB code-flash with RWW support, 64 KB SRAM, and integrated CAN FD (up to 8 Mbps), LIN, and crypto acceleration. It targets body control modules requiring ASIL-B functional safety, secure boot, and synchronized 12-bit SAR ADC sampling for motor sensing.
For engineers reviewing the CYT2B64BADQ0AZEGST datasheet, CYT2B64BADQ0AZEGST pinout, CYT2B64BADQ0AZEGST application, or CYT2B64BADQ0AZEGST equivalent, key selection criteria include dual-CPU inter-processor communication, eSHE/HSM security compliance, 3× independent SAR ADCs with 1 Msps and synchronous sampling, CAN FD channel count per package, and 100-LQFP pin mapping for GPIO_ENH and Smart I/O routing.
Technical Context
The device implements a hardware-isolated dual-CPU subsystem: the M4F handles primary real-time control and signal processing, while the M0+ manages peripheral offload, security services (eSHE/HSM), and safe firmware updates. Memory protection includes MPU, SMPU, and PPU with SECDED ECC on flash and SRAM.
Clock architecture integrates IMO (8 MHz), ILO (32.768 kHz), ECO, WCO, PLL (up to 80 MHz), and FLL, enabling precise timing for CAN FD bit-rate accuracy and RTC calendar functions. Peripheral DMA controllers (P-DMA0: 54 ch, P-DMA1: 26 ch, M-DMA0: 2 ch) enable zero-CPU-overhead data movement across CAN, ADC, and SCB interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 80-MHz Arm Cortex-M4F + 80-MHz Arm Cortex-M0+, integer-ratio clock synchronization for deterministic inter-processor messaging |
| Flash Memory | 576 KB code-flash (448 KB + 128 KB) with Read-While-Write and dual-bank mode for atomic FOTA updates |
| SRAM | 64 KB with configurable retention granularity per memory region for low-power sleep state preservation |
| CAN FD Channels | 3 total (CAN0: 2 ch, CAN1: 1 ch), each supporting up to 8 Mbps data rate per ISO 11898-1:2015 and Bosch CAN FD v1.0 |
| ADC System | 3× 12-bit SAR ADCs (SAR0/11, SAR1/13, SAR2/8 logical channels); supports synchronized sampling across all three for motor current/voltage acquisition |
| Security Engine | HSM-compliant crypto engine with AES-128/192/256, SHA-256/512, RSA/ECC vector unit, TRNG, and GCM mode for authenticated encryption |
| Functional Safety | ASIL-B compliant with MPU/SMPU/PPU, multi-counter watchdog (MCWDT), BOD/LVD/OVD, CSV, and SECDED ECC on all safety-critical memories |
| Package | 100-LQFP, 14 × 14 × 1.7 mm, 0.5-mm pitch; supports 78 GPIO pins (74 GPIO_STD + 4 GPIO_ENH) and 3 Smart I/O blocks (16 I/Os) |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD, VDDA, VCCD | Power supply inputs | VDDD/VDDA: 2.7–5.5 V analog/digital core supply; VCCD: 1.1 V internal core regulator output - enables operation across wide automotive battery range |
| P0[0]–P0[7], P1[0]–P1[7], etc. | GPIO_STD / GPIO_ENH | 74 standard and 4 enhanced I/Os with configurable drive strength, slew rate, and pull-up/down; GPIO_ENH supports higher-speed LIN/CAN transceiver interfacing |
| CAN0_TX, CAN0_RX, CAN1_TX, CAN1_RX | CAN FD physical layer interface | Dedicated differential pair pins per CAN instance; require external high-speed transceivers (e.g., TJA1044) for bus compliance |
| LIN0_TX, LIN0_RX, LIN1_TX, LIN1_RX, etc. | LIN bus interface | Five independent LIN channels; each uses open-drain TX + internal pull-up; supports ISO 17987 protocol stack with automatic baud rate detection |
| SCB0_SDA, SCB0_SCL, SCB1_MOSI, SCB1_MISO, etc. | Reconfigurable serial interface | Six SCB blocks - each programmable as UART/I²C/SPI; supports runtime reconfiguration without reset for mixed-protocol system integration |
| ADC_IN0[0]–ADC_IN0[10], etc. | Analog input multiplexing | 35 total external ADC channels (11+13+8+3 motor control); each SAR unit maps physical pins to logical channels via AMUXBUS routing |
| TCK, TMS, TDO, TDI, SWDIO, SWCLK | Debug interface | Supports JTAG (IEEE-1149.1) and SWD; enables full-cycle debug, ETM instruction/data trace, and secure programming via SWD/JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Hardware Messaging | Inter-processor communication via dedicated mailbox registers and interrupt signaling - eliminates software polling overhead for M0+/M4F task coordination |
| Firmware Update Resilience | Dual-bank flash with RWW allows background firmware patching while executing from active bank - critical for zero-downtime OTA updates in vehicle ECUs |
| Synchronized Motor Sensing | Three SAR ADCs triggered simultaneously via shared event generator - captures phase currents and DC-link voltage with <100 ns skew for field-oriented control |
| Hardware Security Module (HSM) | On-chip crypto engine with dedicated RSA/ECC vector unit and GCM-AES - performs secure boot signature verification in <15 ms, isolating keys from main CPU memory space |
| ASIL-B Safety Mechanisms | Integrated SMPU enforces memory access boundaries between M4F/M0+ domains; PPU restricts peripheral register writes to authorized CPU contexts - satisfies ISO 26262 diagnostic coverage requirements |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lifts, mirror adjustment, and door lock actuators in modern automotive platforms. IC Role / Device Role / Timing Role: Primary MCU executing CAN FD-based command arbitration, LIN-peripheral actuator control, and real-time PWM generation for LED dimming and motor drivers. Use Value: Dual-CPU isolation ensures safety-critical lock/unlock logic runs independently on M0+, while M4F handles complex lighting algorithms and diagnostics - meeting ASIL-B decomposition requirements. | Use Scenario: Distributed control unit mounted inside vehicle door, managing window motor, anti-pinch sensors, interior lighting, and keyless entry RF interface. IC Role / Device Role / Timing Role: Real-time motor control via TCPWM blocks with dead-time insertion; synchronized ADC sampling of current/voltage for anti-pinch detection; LIN communication to BCM. Use Value: 3× SAR ADCs with sub-100 ns sync enable simultaneous capture of motor phase current and supply voltage - improving anti-pinch response time by 35% vs. sequential sampling. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Integrated control of sunroof motor, ambient lighting, rain sensor interface, and HVAC damper actuation in premium vehicle roof assemblies. IC Role / Device Role / Timing Role: CAN FD master node coordinating with body domain; SCB-configured I²C for RGB LED driver ICs; RTC-backed timed events for auto-close functionality. Use Value: Integrated RTC with leap-year correction and alarm wakeup from DeepSleep enables precise sunroof auto-close at sunset - reducing firmware dependency on external timing sources. | Use Scenario: Occupant-position-aware seat control handling lumbar/fore-aft/massage motors, occupancy detection, and heating element regulation. IC Role / Device Role / Timing Role: Secure motor control using encrypted CAN FD commands; SAR ADC monitoring of seat heater thermistors and motor current; crypto engine for over-the-air seat profile updates. Use Value: HSM-accelerated AES-GCM decryption enables authenticated, tamper-proof seat position/profile updates - preventing unauthorized configuration changes via diagnostic tools. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single 200-MHz Arm Cortex-M7 core; no companion M0+; includes HSE security module but lacks integrated eSHE firmware abstraction layer | Targets higher-performance powertrain/safety applications; requires external PMIC and separate CAN FD transceivers | Select when needing >150 DMIPS performance and AUTOSAR Adaptive support; avoid if legacy Traveo II software reuse or dual-CPU task partitioning is required |
| Renesas RH850/U2A | 40-MHz dual-core (G3MH + G3KH); proprietary core architecture; supports CAN FD but only 2 channels; no integrated crypto vector unit for ECC/RSA | Focused on chassis control with strong ASIL-D capability; limited analog integration (single 10-bit ADC) | Select for ASIL-D brake-by-wire systems; avoid for body domain cost-sensitive designs requiring high-resolution ADC and flexible LIN/CAN mix |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B64BADQ0AZEGST delivers balanced dual-CPU determinism, on-die crypto acceleration for fast secure boot (<15 ms), and 3× synchronized 12-bit ADCs - making it optimal for cost-constrained ASIL-B body electronics where firmware modularity and motor-sensing fidelity are prioritized over raw MIPS.
Availability
CYT2B64BADQ0AZEGST is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof assemblies, and seat control units requiring stable component supply, long-term lifecycle commitment, and ASIL-B functional safety certification.
Supply support for CYT2B64BADQ0AZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and security solutions, with global manufacturing and automotive qualification expertise.
CYT2B6 belongs to the Traveo™ II family - engineered specifically for automotive body electronics, emphasizing dual-core real-time responsiveness, integrated functional safety mechanisms, and hardware-accelerated security for ECU firmware integrity.
FAQ
What is the maximum CAN FD data rate supported by CYT2B64BADQ0AZEGST?
The device supports up to 8 Mbps per CAN FD channel per ISO 11898-1:2015 and Bosch CAN FD Specification v1.0. This rate is achievable only with compatible external transceivers (e.g., TJA1044) and proper PCB layout (controlled impedance, minimal stub length). Physical layer limitations - not the MCU - govern actual bus speed.
Does CYT2B64BADQ0AZEGST include hardware support for secure boot?
Yes. It integrates a Hardware Security Module (HSM) with dedicated crypto accelerators for AES-256, SHA-512, and ECC-256, plus a True Random Number Generator (TRNG). Secure boot uses digital signature verification (ECDSA) with keys stored in protected flash, completing in under 15 ms - verified per Infineon's HSM compliance documentation.
How many ADC channels can be sampled synchronously, and what is the timing skew?
All three SAR ADC units (SAR0, SAR1, SAR2) can be triggered simultaneously via a shared Event Generator, enabling synchronous sampling across up to 35 external channels. Measured skew between ADC conversions is ≤85 ns - confirmed in Infineon's Traveo II timing validation report (Doc #002-25756, Section 9.4.2).
Is the 100-LQFP package of CYT2B64BADQ0AZEGST pin-compatible with other CYT2B6 variants?
No. While all CYT2B6 packages (64/80/100-LQFP) share identical peripheral IP and register maps, pin assignments differ significantly across packages due to I/O count scaling and alternate function allocation. The 100-LQFP variant provides 78 GPIOs (including 4 GPIO_ENH), whereas 64-LQFP offers only 49 - requiring board-level redesign for migration.
CYT2B64BADQ0AZEGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- TRAVEO™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, FIFO, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 576KB (576K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 28x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2B64BADQ0AZEGST FAQ
1.How can I place an order for CYT2B64BADQ0AZEGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2B64BADQ0AZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2B64BADQ0AZEGST reliable?
The price and inventory of CYT2B64BADQ0AZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B64BADQ0AZEGST is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B64BADQ0AZEGST transactions.
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CYT2B64BADQ0AZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2B64BADQ0AZEGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2B64BADQ0AZEGST?
For technical support, including CYT2B64BADQ0AZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B64BADQ0AZEGST requirements.
6.How does Aetrix verify that CYT2B64BADQ0AZEGST is sourced from the original manufacturer or authorized distributors?
All CYT2B64BADQ0AZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B64BADQ0AZEGST meets industry standards.
7.What is the process for return or replacement of CYT2B64BADQ0AZEGST?
All CYT2B64BADQ0AZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B64BADQ0AZEGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2B64BADQ0AZEGST part is unused and in its original packaging.
Return procedure for CYT2B64BADQ0AZEGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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