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Infineon Technologies CYT2B64BADQ0AZSGST

Part No.:
CYT2B64BADQ0AZSGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixCYT2B64BADQ0AZSGST.pdf
Description:
IC MCU 32BIT 576KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,473

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Product details

Overview

CYT2B64BADQ0AZSGST from Infineon Technologies (formerly Cypress) is a dual-core automotive microcontroller featuring an 80-MHz Arm® Cortex®-M4F CPU with FPU and an 80-MHz Arm® Cortex-M0+ CPU for peripheral/security processing. It integrates 576 KB code-flash, 64 KB SRAM, CAN FD (up to 8 Mbps), LIN, crypto engine (AES-128/192/256, SHA-256/512, TRNG), and ASIL-B functional safety support. It targets body control units in 125 °C extended-temperature automotive systems.

For engineers reviewing the CYT2B64BADQ0AZSGST datasheet, CYT2B64BADQ0AZSGST pinout, CYT2B64BADQ0AZSGST application, or CYT2B64BADQ0AZSGST equivalent, key selection criteria include dual-CPU real-time partitioning, CAN FD timing compliance (ISO 11898-1:2015), eSHE/HSM security enablement, RWW flash update capability, and 100-LQFP package compatibility with automotive-grade thermal and voltage specs (2.7–5.5 V, –40°C to +125°C).

Technical Context

The CYT2B64BADQ0AZSGST implements hardware-enforced inter-processor communication between its M4F and M0+ cores, enabling deterministic separation of safety-critical tasks (e.g., CAN FD message filtering in M0+) from application logic (e.g., motor control PWM generation in M4F). Its three DMA controllers-P-DMA0 (54 channels), P-DMA1 (26), and M-DMA0 (2)-support concurrent peripheral-to-memory and memory-to-memory transfers without CPU intervention.

Functional safety is implemented via SMPU, PPU, SECDED ECC on SRAM/flash, dual BOD thresholds (2.7 V/3.0 V on VDDD/VDDA), and MCWDT with independent clock domains. The crypto engine delivers hardware-accelerated AES-GCM, RSA/ECC vector unit, and SHA-512-enabled only in HSM-configured variants per ordering options.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 80-MHz Arm Cortex-M4F (FPU, MPU) + 80-MHz Arm Cortex-M0+ (MPU, secure peripheral offload)
Flash Memory576 KB code-flash + 64 KB work-flash; supports Read-While-Write and dual-bank firmware updates for FOTA
CAN FD ChannelsThree instances (CAN0/CAN1/CAN2); each compliant with ISO 11898-1:2015 and supports up to 8 Mbps data rate
Analog PeripheralsThree 12-bit SAR ADCs (1 Msps max); 35 total external channels; synchronized sampling across all three for motor current sensing
Security FeaturesHSM-enabled crypto engine: AES-128/192/256, SHA-256/512, TRNG, ECC/RSA vector unit, secure boot with digital signature verification
Functional SafetyASIL-B certified: SMPU, PPU, SECDED ECC on safety-critical memories, multi-counter watchdog (MCWDT), clock supervisor (CSV)
Package & Temp100-pin LQFP (14 × 14 × 1.7 mm, 0.5 mm pitch); rated for –40°C to +125°C (E-grade)

Pinout & Package

Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch, 1.7 mm max height), RoHS-compliant, automotive-qualified.

Pin/TerminalCircuit RoleDesign Meaning
VDDD, VDDA, VCCDPower supply inputsVDDD/VDDA: 2.7–5.5 V analog/digital core supply; VCCD: 1.1 V internal core regulator output
P0[0]–P0[7], P1[0]–P1[7], etc.Programmable GPIO78 total I/Os; GPIO_STD (45–74 pins depending on package) and GPIO_ENH (4 pins) support wakeup, event routing, and Smart I/O Boolean logic
CAN0_TX, CAN0_RXCAN FD interface signalsDifferential bus interface for CAN FD channel 0; requires external transceiver; supports ISO 11898-1 physical layer compliance
LIN0_TX, LIN0_RXLIN bus interface signalsSingle-wire UART-based interface compliant with ISO 17987; supports auto-baud detection and slave node response timing
JTAG_TCK, JTAG_TMS, SWDIO, SWCLKDebug interface terminalsSupports IEEE-1149.1 JTAG and Arm SWD protocols; enables full-cycle debug, trace (ETM), and flash programming

Key Features

FeatureDesign Value
Dual-CPU Hardware IPCZero-latency inter-processor mailbox and semaphore registers enable deterministic task handoff between M4F and M0+ without software polling
RWW Flash ArchitectureAllows simultaneous execution from one flash bank while programming another-enabling seamless FOTA updates without system reset
Synchronized Triple ADC SamplingHardware-triggered simultaneous start across SAR0/SAR1/SAR2 enables precise three-phase motor current reconstruction with <10 ns skew
HSM Crypto AccelerationDedicated hardware engines reduce AES-256 encryption latency to <100 cycles per block and support Galois/Counter Mode (GCM) for authenticated encryption
ASIL-B Safety MechanismsIntegrated SMPU enforces memory access isolation between M4F and M0+ domains; SECDED ECC corrects single-bit errors and detects double-bit errors in SRAM/flash

Applications

Body Control Module (BCM)Door Module Controller

Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing real-time CAN FD messaging (body network), LIN slave coordination (door nodes), and PWM-driven motor control for window regulators.

Use Value: Dual-core architecture isolates LIN protocol stack (M0+) from BCM application logic (M4F), ensuring deterministic response to door unlock requests within 5 ms.

Use Scenario: Local control unit inside vehicle door housing sensors, switches, motors, and mirror actuators.

IC Role / Device Role / Timing Role: LIN master managing up to five local slaves (window motor, lock actuator, mirror driver), with CAN FD gateway to central BCM.

Use Value: Integrated LIN PHY interface and hardware LIN timer reduce BOM count by eliminating external transceivers; 125 °C rating ensures reliability in sealed door environments.

Roof Module ControllerSeat Control Unit

Use Scenario: Control of sunroof, panoramic roof, and ambient lighting with position feedback and obstacle detection.

IC Role / Device Role / Timing Role: Real-time TCPWM generation for brushless sunroof motor, SAR ADC sampling for Hall-effect position sensing, and CAN FD status reporting.

Use Value: Synchronized triple ADC sampling captures motor phase currents simultaneously, enabling field-oriented control (FOC) without external synchronization circuitry.

Use Scenario: Motorized seat adjustment with memory presets, heating, and occupancy sensing.

IC Role / Device Role / Timing Role: Secure storage of user profiles in encrypted work-flash; PWM-controlled heater drivers; CAN FD communication of seat position and fault status.

Use Value: HSM crypto engine enables AES-256 encryption of stored seat positions and biometric data, meeting UNECE R156 cybersecurity management system (CSMS) requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single-core Arm Cortex-M7 (320 MHz); includes ASIL-D safety support and Ethernet MAC; lacks integrated LIN PHYTargets higher-tier ADAS domain controllers requiring Ethernet backbone; not pin-compatible or software-compatibleSelect when Ethernet connectivity and ASIL-D certification are required; avoid if LIN integration and cost-sensitive BCM design are priorities
Renesas RH850/U2ADual-core (RH850 core + safety monitor core); 40-nm process; supports CAN FD but no integrated crypto acceleration or RWW flashFocused on powertrain and chassis control; limited analog integration (no triple synchronized ADC)Prefer for high-reliability powertrain applications where functional safety dominates over security and motor control features

Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B64BADQ0AZSGST uniquely balances ASIL-B safety, HSM-grade security, LIN PHY integration, and synchronized triple ADC-making it optimal for cost-constrained, feature-rich body electronics rather than domain controllers or powertrain systems.

Availability

CYT2B64BADQ0AZSGST is available at Aetrix Electronics and suitable for body control modules, door module controllers, roof module controllers, and seat control units requiring stable component supply across automotive production lifecycles.

Supply support for CYT2B64BADQ0AZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.

CYT2B64BADQ0AZSGST belongs to the Traveo™ II family-designed specifically for automotive body electronics requiring real-time dual-core processing, integrated LIN/CAN FD, functional safety, and hardware security in extended temperature environments.

FAQ

What is the maximum operating temperature range for CYT2B64BADQ0AZSGST?

The CYT2B64BADQ0AZSGST is rated for –40°C to +125°C (E-grade), validated per AEC-Q100 Grade 0 qualification. This extended temperature range supports under-hood and door module deployments where ambient heat exceeds 105°C, and thermal derating is managed via internal temperature monitoring diodes and configurable low-power modes.

Does CYT2B64BADQ0AZSGST support Over-The-Air (FOTA) firmware updates?

Yes-CYT2B64BADQ0AZSGST supports secure FOTA through its dual-bank flash architecture (576 KB code-flash) and Read-While-Write capability. Firmware updates execute from one bank while writing to the other, with CRC32 validation and digital signature verification enforced by the HSM crypto engine before activation.

How many CAN FD channels does CYT2B64BADQ0AZSGST support, and what is their data rate?

CYT2B64BADQ0AZSGST supports three CAN FD channels (CAN0, CAN1, CAN2), each compliant with ISO 11898-1:2015 and capable of up to 8 Mbps data rate in the FD phase. Physical layer performance depends on external transceiver selection and bus topology, but the controller meets ISO 16845:2015 conformance testing requirements.

Is the crypto engine enabled by default, or does it require firmware configuration?

The crypto engine-including AES, SHA, TRNG, and ECC/RSA acceleration-is hardware-present but requires explicit firmware initialization and key provisioning. Enhanced Secure Hardware Extension (eSHE) must be enabled via third-party firmware; HSM functionality is only active in parts ordered with HSM option codes (e.g., "HSM" suffix in MPN), not in eSHE-only variants.

CYT2B64BADQ0AZSGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-LQFP
Series:
TRAVEO™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
80MHz
Connectivity:
CANbus, FIFO, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
59
Program Memory Size:
576KB (576K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 28x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B64BADQ0AZSGST FAQ

1.How can I place an order for CYT2B64BADQ0AZSGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B64BADQ0AZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CYT2B64BADQ0AZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B64BADQ0AZSGST is usually 5 days.

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CYT2B64BADQ0AZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B64BADQ0AZSGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B64BADQ0AZSGST?

For technical support, including CYT2B64BADQ0AZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B64BADQ0AZSGST requirements.

6.How does Aetrix verify that CYT2B64BADQ0AZSGST is sourced from the original manufacturer or authorized distributors?

All CYT2B64BADQ0AZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B64BADQ0AZSGST meets industry standards.

7.What is the process for return or replacement of CYT2B64BADQ0AZSGST?

All CYT2B64BADQ0AZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B64BADQ0AZSGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B64BADQ0AZSGST part is unused and in its original packaging.

Return procedure for CYT2B64BADQ0AZSGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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