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Infineon Technologies CYT2B64CADQ0AZEGST

Part No.:
CYT2B64CADQ0AZEGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixCYT2B64CADQ0AZEGST.pdf
Description:
IC MCU 32BIT 576KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,709

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Product details

Overview

CYT2B64CADQ0AZEGST from Infineon Technologies (formerly Cypress) is a dual-core automotive-grade microcontroller featuring an 80-MHz Arm® Cortex®-M4F CPU with FPU and an 80-MHz Arm® Cortex®-M0+ CPU for peripheral/security offload. It integrates CAN FD (up to 8 Mbps), LIN, 3× 12-bit SAR ADCs (1 Msps), 576 KB code-flash, and hardware crypto acceleration (AES-128/192/256, SHA-256/512, ECC, TRNG). Designed for body control units, it supports ASIL-B functional safety and operates from 2.7 V to 5.5 V.

For engineers reviewing the CYT2B64CADQ0AZEGST datasheet, CYT2B64CADQ0AZEGST pinout, CYT2B64CADQ0AZEGST application, or CYT2B64CADQ0AZEGST equivalent, key selection criteria include dual-CPU real-time partitioning, CAN FD channel count (3 total), flash RWW capability, SRAM retention granularity, and eSHE/HSM security compliance for automotive firmware updates and secure boot.

Technical Context

The CYT2B64CADQ0AZEGST implements a tightly coupled dual-CPU subsystem where the M4F handles primary application tasks and the M0+ manages time-critical peripherals and security services via hardware inter-processor communication. Its memory subsystem includes 576 KB code-flash (dual-bank for FOTA), 64 KB work-flash, and 64 KB SRAM with configurable retention-enabling robust over-the-air update workflows without runtime interruption.

Functional safety is enforced through MPU, SMPU, PPU, SECDED ECC on SRAM/flash, dual watchdogs (WDT/MCWDT), and voltage monitors (LVD/BOD/OVD). The crypto engine delivers certified AES-GCM, SHA-2/3, RSA/ECC, and TRNG-meeting eSHE and HSM requirements for secure boot, authentication, and encrypted communication in ASIL-B systems.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 80-MHz Arm Cortex-M4F + 80-MHz Arm Cortex-M0+, integer-ratio clock synchronization for deterministic inter-core timing
Flash Memory576 KB code-flash (448 KB + 128 KB) with Read-While-Write and dual-bank mode for atomic FOTA updates
ADC PerformanceThree 12-bit SAR ADCs, each up to 1 Msps, supporting synchronized sampling across all three for motor current sensing
CAN FD ChannelsThree instances (CAN0/CAN1/CAN2), each compliant with ISO 11898-1:2015 and supporting up to 8 Mbps data rate
Security FeaturesHSM-compliant crypto engine with AES-128/192/256, SHA-256/512, ECC, TRNG, and fast secure boot using digital signature verification
Functional SafetyASIL-B certified: includes SMPU, PPU, SECDED ECC on safety-critical memories, MCWDT, and voltage supervisors (LVD/BOD/OVD)
Operating Voltage2.7 V to 5.5 V supply range with internal 1.1-V core regulator and two BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA)

Pinout & Package

Package: 100-pin LQFP (14 × 14 × 1.7 mm, 0.5-mm pitch), RoHS-compliant, automotive-grade (AEC-Q100 Grade 2, TA = −40 °C to +105 °C).

Pin/TerminalCircuit RoleDesign Meaning
VDDD, VDDA, VCCDPower supply inputsVDDD/VDDA: 2.7–5.5 V analog/digital I/O supply; VCCD: 1.1-V core supply generated internally
P0[0]–P0[7], P1[0]–P1[7], etc.Programmable GPIO78 total GPIOs: 74 GPIO_STD + 4 GPIO_ENH; support wakeup from Sleep/DeepSleep/Hibernate modes
CAN0_TX, CAN0_RXCAN FD interface signalsDifferential bus interface for first CAN FD channel (ISO 11898-1 compliant, up to 8 Mbps)
LIN0_TX, LIN0_RXLIN physical layer interfaceSingle-wire UART-based interface compliant with ISO 17987 for body electronics diagnostics and control
SWDIO, SWCLKDebug interface pinsArm Serial Wire Debug (SWD) port for programming, debugging, and trace (ETM supported on M4F)
XTAL_IN, XTAL_OUTExternal crystal oscillator connectionSupports ECO (external crystal oscillator) for precise clock source; enables PLL/FLL reference stability

Key Features

FeatureDesign Value
Dual-CPU Real-Time PartitioningM4F executes main application logic while M0+ handles LIN/CAN protocol stacks and crypto operations-reducing latency and eliminating software scheduling overhead
Firmware Update Over-The-Air (FOTA)Dual-bank flash architecture enables seamless background firmware updates with zero downtime and rollback capability
Synchronized Multi-ADC SamplingSimultaneous start of conversion across all three SAR ADCs supports accurate three-phase motor current reconstruction in traction inverters
Hardware Security Module (HSM)On-chip crypto engine performs AES-GCM encryption/decryption, SHA-256 hashing, and ECDSA signature verification without CPU intervention
ASIL-B Functional Safety SupportIntegrated SMPU, PPU, SECDED ECC, and dual watchdogs enable ISO 26262-compliant system design without external safety monitors

Applications

Body Control Module (BCM)Door Control Unit (DCU)

Use Scenario: Centralized management of lighting, window lifts, mirrors, locks, and seat controls in modern vehicles.

IC Role / Device Role / Timing Role: Dual-core MCU orchestrates real-time LIN communication with door modules and CAN FD messaging with gateway ECUs.

Use Value: 3× LIN channels and 3× CAN FD interfaces enable direct connectivity to 15+ vehicle sub-systems without external bridge ICs.

Use Scenario: Local control of power windows, central locking, anti-pinch detection, and mirror folding in each door assembly.

IC Role / Device Role / Timing Role: M0+ core runs LIN slave stack and motor PWM control; M4F handles sensor fusion and fault logging.

Use Value: Integrated TCPWM blocks with dead-time insertion and quadrature decoding eliminate need for external motor gate drivers in compact DC motor control.

Roof Module ControllerSmart Junction Box

Use Scenario: Integration of sunroof, panoramic roof, ambient lighting, and rain sensor logic in premium vehicle roof assemblies.

IC Role / Device Role / Timing Role: Secure boot and crypto engine authenticate OTA updates; ADCs monitor glass position and light intensity.

Use Value: eSHE-compliant secure boot ensures only signed firmware executes-critical for regulatory compliance in EU and US markets.

Use Scenario: Power distribution and load switching for interior lighting, HVAC fans, and infotainment peripherals in centralized junction boxes.

IC Role / Device Role / Timing Role: GPIO_ENH pins drive high-side/low-side MOSFETs; Smart I/O blocks perform hardware-level logic for short-circuit protection.

Use Value: 78 GPIOs with programmable slew rate and drive strength allow direct control of 24+ loads without external driver ICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single 200-MHz Arm Cortex-M7 core; no companion M0+; includes Ethernet AVB and HSE security moduleBetter suited for gateway ECUs requiring Ethernet backbone; lacks integrated LIN PHY and motor-control TCPWM blocksSelect when Ethernet connectivity or higher single-thread performance is required over multi-core peripheral offload
Renesas RH850/U2A40-MHz RH850 core with lockstep dual-core safety architecture; no FPU; proprietary toolchainStronger ASIL-D readiness but limited crypto acceleration and no CAN FD > 5 Mbps in base configurationSelect for legacy automotive platforms requiring long-term toolchain continuity and highest safety certification level

Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B64CADQ0AZEGST uniquely balances dual-core real-time partitioning, integrated LIN/CAN FD, motor-control peripherals, and HSM-grade crypto-all in a single 100-LQFP package optimized for cost-sensitive body electronics.

Availability

CYT2B64CADQ0AZEGST is available at Aetrix Electronics and suitable for body control modules, door control units, roof modules, and smart junction boxes requiring stable component supply across automotive production lifecycles.

Supply support for CYT2B64CADQ0AZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.

CYT2B64CADQ0AZEGST belongs to the Traveo™ II family-designed specifically for automotive body electronics requiring ASIL-B compliance, secure firmware updates, and mixed-signal integration in space-constrained ECUs.

FAQ

What is the maximum CAN FD data rate supported by CYT2B64CADQ0AZEGST?

CYT2B64CADQ0AZEGST supports up to 8 Mbps per CAN FD channel, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. This rate is achievable under optimal physical layer conditions (e.g., short stub lengths, matched termination, low-noise transceivers) and requires proper configuration of bit timing registers and transceiver selection.

Does CYT2B64CADQ0AZEGST support true hardware-based secure boot?

Yes-it implements fast secure boot using digital signature verification (ECDSA or RSA) executed entirely within the hardware crypto engine. Boot ROM validates the signature of the first-stage bootloader before execution, with keys stored in write-protected eFuses or secure flash regions. No software intervention is required during the boot chain.

How many GPIOs support wakeup from DeepSleep mode?

Up to 78 GPIO pins can generate interrupts to wake the device from Sleep modes. For DeepSleep mode, wakeup is enabled via dedicated peripherals: Event Generator (EVTGEN), SCB, RTC alarms, or Watchdog Timer-not individual GPIOs. EVTGEN timers provide cyclic wakeup capability with sub-millisecond jitter.

Is the 64 KB SRAM fully retainable during Hibernate mode?

No-SRAM retention in Hibernate mode is configurable in 8-KB granules. By default, only 8 KB is retained; users may select additional 8-KB blocks (up to full 64 KB) via the PMIC register, but increased retention raises leakage current. Retention granularity is controlled independently per 8-KB segment to balance power and state preservation.

CYT2B64CADQ0AZEGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-LQFP
Series:
TRAVEO™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
80MHz
Connectivity:
CANbus, FIFO, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
59
Program Memory Size:
576KB (576K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 28x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B64CADQ0AZEGST FAQ

1.How can I place an order for CYT2B64CADQ0AZEGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B64CADQ0AZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B64CADQ0AZEGST reliable?

The price and inventory of CYT2B64CADQ0AZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B64CADQ0AZEGST is usually 5 days.

3.What payment methods are accepted for CYT2B64CADQ0AZEGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B64CADQ0AZEGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT2B64CADQ0AZEGST?

CYT2B64CADQ0AZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B64CADQ0AZEGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B64CADQ0AZEGST?

For technical support, including CYT2B64CADQ0AZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B64CADQ0AZEGST requirements.

6.How does Aetrix verify that CYT2B64CADQ0AZEGST is sourced from the original manufacturer or authorized distributors?

All CYT2B64CADQ0AZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B64CADQ0AZEGST meets industry standards.

7.What is the process for return or replacement of CYT2B64CADQ0AZEGST?

All CYT2B64CADQ0AZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B64CADQ0AZEGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B64CADQ0AZEGST part is unused and in its original packaging.

Return procedure for CYT2B64CADQ0AZEGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYT2B64CADQ0AZEGST Tags

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