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Infineon Technologies CYT2B93BACQ0AZSGS

Part No.:
CYT2B93BACQ0AZSGS
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCYT2B93BACQ0AZSGS.pdf
Description:
IC MCU 32BT 2.0625MB FLSH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,521

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Product details

Overview

CYT2B93BACQ0AZSGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, integrated 2112-KB code-flash with RWW support, 256-KB SRAM with retention control, and hardware crypto engine supporting AES-128/192/256, SHA-256/512, ECC, and TRNG - deployed in body control units requiring ASIL-B functional safety compliance.

For engineers reviewing the CYT2B93BACQ0AZSGS datasheet, CYT2B93BACQ0AZSGS pinout, CYT2B93BACQ0AZSGS application, or CYT2B93BACQ0AZSGS equivalent, key selection criteria include dual-CPU inter-processor communication, CAN FD (up to 8 channels, 8 Mbps), CXPI (4 channels), LIN (12 channels), and SECDED ECC on flash/SRAM for automotive ECU robustness.

Technical Context

The CYT2B93BACQ0AZSGS implements a heterogeneous dual-CPU architecture: the M4F handles real-time application processing with FPU and MPU, while the M0+ manages peripheral offload, security services (eSHE/HSM), and secure boot via digital signature verification. Hardware inter-processor communication uses dedicated mailbox and semaphore resources.

It integrates three DMA controllers (P-DMA0: 92 channels, P-DMA1: 44 channels, M-DMA0: 4 channels), supports firmware updates over-the-air via dual-bank flash, and delivers ASIL-B compliance through SMPU, PPU, watchdog supervision (MCWDT), and SECDED ECC on all safety-critical memories.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+
Flash Memory 2112-KB code-flash + 128-KB work-flash; supports Read-While-Write and dual-bank FOTA
SRAM 256-KB with configurable retention granularity per memory region
Crypto Engine AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, GCM, and eSHE/HSM support
Automotive Interfaces 8× CAN FD (ISO 11898-1:2015 compliant), 12× LIN (ISO 17987), 4× CXPI (20 kbps)
Safety Certification ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC on flash/SRAM, and MCWDT
Analog Peripherals 3× SAR ADCs (12-bit, 1 Msps each); 67 total external channels; synchronized sampling

Pinout & Package

Package: 176-LQFP, 24 × 24 × 1.7 mm, 0.5-mm lead pitch - qualified for automotive AEC-Q100 Grade 2 (−40°C to +105°C).

Pin/Terminal Circuit Role Design Meaning
VDDD / VDDA Core & Analog Power Supply 2.7–5.5-V input; internal 1.1-V regulator supplies core; dual BOD thresholds (2.7 V / 3.0 V) ensure robust brown-out detection
P0[0]–P0[7] GPIO_STD Bank 0 Programmable I/Os supporting Smart I/O Boolean logic; up to 152 total GPIOs across banks
CANFD0_TX / CANFD0_RX CAN FD Channel 0 Interface Dedicated differential pair for 8-Mbps CAN FD communication; ISO 11898-1:2015 compliant
CXPI0_TX / CXPI0_RX CXPI Channel 0 Interface Single-wire bus interface for low-speed vehicle networking (20 kbps); supports diagnostics and sensor polling
TCK / TMS / TDI / TDO JTAG Debug Interface IEEE-1149.1-compliant boundary scan and debug; supports ETM instruction/data trace
SWDIO / SWCLK Serial Wire Debug Interface 2-pin Arm® SWD port for programming and real-time debugging; compatible with GHS/MULTI and IAR EWARM

Key Features

Feature Design Value
Dual-CPU Inter-Processor Communication Hardware mailbox + semaphore enables deterministic, low-latency task handoff between M4F and M0+ subsystems
Firmware Update Over The Air (FOTA) Dual-bank flash architecture allows atomic firmware swap without runtime interruption or external bootloader
Secure Boot & Authentication Digital signature verification (ECDSA) ensures only cryptographically signed firmware executes at boot
Motor Control Timing 75× 16-bit TCPWM blocks + 12× motor-specific counters support multi-axis field-oriented control with dead-time insertion
Low-Power Wake-Up Flexibility Up to 152 GPIOs can wake from Sleep; 2 pins support Hibernate wakeup; EVTGEN timers enable cyclic DeepSleep wakeup

Applications

Body Control Module (BCM) Door Module Control

Use Scenario: Centralized management of lighting, window lifts, locks, and mirrors in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing real-time control loops, CAN FD gatewaying, and LIN slave coordination.

Use Value: Dual-core separation isolates safety-critical door lock actuation (M0+) from infotainment-linked lighting control (M4F), meeting ASIL-B partitioning requirements.

Use Scenario: Distributed control of power windows, anti-pinch sensors, and mirror positioning per door.

IC Role / Device Role / Timing Role: Local LIN master managing up to 12 slave nodes; synchronized ADC sampling for analog sensor fusion.

Use Value: 12-bit SAR ADCs with 1 Msps sampling and sequencer autonomy enable precise analog window position feedback without CPU overhead.

Roof Module with Sunroof Control Seat Control Unit

Use Scenario: Integrated sunroof, shade, and ambient lighting control with gesture sensing and CAN FD reporting.

IC Role / Device Role / Timing Role: Real-time PWM generation for motorized sunroof actuation and RGB LED dimming via TCPWM blocks.

Use Value: 75× 16-bit TCPWM units support simultaneous high-resolution PWM for motors and LEDs, with dead-time insertion preventing shoot-through.

Use Scenario: Position memory, heating, ventilation, and lumbar adjustment in premium automotive seats.

IC Role / Device Role / Timing Role: Secure HSM-enabled node authenticating seat position profiles and enforcing encrypted parameter storage.

Use Value: Hardware crypto engine performs ECDSA signature verification and AES-256 encryption of seat configuration data in SRAM flash sectors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 Single-core Arm® Cortex®-M7 (320 MHz); no M0+ co-processor; includes ASIL-D capable lockstep cores Better suited for high-integrity powertrain or ADAS where lockstep redundancy is mandatory Select when ASIL-D certification or higher compute throughput outweighs need for peripheral offload isolation
Renesas RH850/U2A 32-bit RXv3 core (240 MHz); proprietary ISA; no Arm® architecture; integrated CAN FD and LIN but no CXPI Strong legacy support in Japanese OEMs; limited toolchain flexibility vs. Arm® ecosystem Prefer when migrating existing RH850-based platforms or requiring long-term supply continuity under Renesas' automotive roadmap

Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B93BACQ0AZSGS uniquely balances ASIL-B safety, Arm® ecosystem compatibility, CXPI integration, and hardware-isolated peripheral/security processing - making it optimal for cost-sensitive, feature-rich body electronics where dual-core task segregation adds value without ASIL-D overhead.

Availability

CYT2B93BACQ0AZSGS is available at Aetrix Electronics and suitable for body control modules, door modules, roof modules, and seat control units requiring stable component supply, automotive-grade lifecycle assurance, and AEC-Q100 Grade 2 qualification.

Supply support for CYT2B93BACQ0AZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification expertise.

CYT2B9 belongs to the TRAVEO™ T2G family - designed specifically for automotive body electronics requiring functional safety, secure boot, and mixed-signal integration in resource-constrained ECUs.

FAQ

What is the maximum operating temperature range for CYT2B93BACQ0AZSGS?

The CYT2B93BACQ0AZSGS is qualified to AEC-Q100 Grade 2, with an operating junction temperature range of −40°C to +105°C. This rating is validated across all electrical specifications including flash endurance, SRAM retention, and analog performance, and applies to the 176-LQFP package variant.

Does CYT2B93BACQ0AZSGS support CAN FD with ISO 16845 conformance testing?

Yes - Infineon provides ISO 16845:2015 conformance certification for the CYT2B9's CAN FD controller. The device passes physical layer interoperability tests including bit timing, error frame handling, and arbitration phase behavior under stressed conditions per the standard.

How many independent clock domains does CYT2B93BACQ0AZSGS support?

CYT2B93BACQ0AZSGS supports five independent clock domains: IMO (8–100 MHz), ILO (32.768 kHz), ECO (4–25 MHz), WCO (32.768 kHz), and two PLLs (one for M4F, one for M0+/peripherals). Each domain drives configurable dividers and enables fine-grained power gating per peripheral group.

Is the crypto engine in CYT2B93BACQ0AZSGS certified to any security standards?

The crypto engine implements features aligned with Common Criteria EAL4+ for secure boot and cryptographic operations. While not individually certified, its eSHE/HSM implementation meets ISO/SAE 21434 cybersecurity process requirements and supports UNECE R155 compliance when integrated into certified vehicle architectures.

CYT2B93BACQ0AZSGS Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
Traveo™ T2G
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
2.0625MB (2.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B93BACQ0AZSGS FAQ

1.How can I place an order for CYT2B93BACQ0AZSGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B93BACQ0AZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B93BACQ0AZSGS reliable?

The price and inventory of CYT2B93BACQ0AZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B93BACQ0AZSGS is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B93BACQ0AZSGS transactions.

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CYT2B93BACQ0AZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B93BACQ0AZSGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B93BACQ0AZSGS?

For technical support, including CYT2B93BACQ0AZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B93BACQ0AZSGS requirements.

6.How does Aetrix verify that CYT2B93BACQ0AZSGS is sourced from the original manufacturer or authorized distributors?

All CYT2B93BACQ0AZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B93BACQ0AZSGS meets industry standards.

7.What is the process for return or replacement of CYT2B93BACQ0AZSGS?

All CYT2B93BACQ0AZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B93BACQ0AZSGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B93BACQ0AZSGS part is unused and in its original packaging.

Return procedure for CYT2B93BACQ0AZSGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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