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Infineon Technologies CYT2B93CACQ0AZEGS
- Part No.:
- CYT2B93CACQ0AZEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CYT2B93CACQ0AZEGS.pdf
- Description:
- IC MCU 32BT 2.0625MB FLSH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,337
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Product details
Overview
CYT2B93CACQ0AZEGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, integrated 2112-KB code-flash with RWW support, 256-KB SRAM, and hardware crypto engine supporting AES-128/192/256, SHA-256/512, and ECC for secure boot. It targets body control modules requiring ASIL-B functional safety compliance, CAN FD (up to 8 Mbps), LIN, and CXPI interfaces.
For engineers reviewing the CYT2B93CACQ0AZEGS datasheet, CYT2B93CACQ0AZEGS pinout, CYT2B93CACQ0AZEGS application, or CYT2B93CACQ0AZEGS equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use cases in automotive ECUs, and validated alternative parts with documented functional differences.
Technical Context
The CYT2B93CACQ0AZEGS implements a tightly coupled dual-CPU architecture: the M4F handles primary application execution with single-cycle multiply and FPU, while the M0+ manages peripheral offload and security services including eSHE/HSM. Inter-processor communication is handled via dedicated hardware mailbox and shared memory with SMPU enforcement.
It integrates three DMA controllers (P-DMA0: 92 channels, P-DMA1: 44 channels, M-DMA0: 4 channels), supports up to eight CAN FD channels compliant with ISO 11898-1:2015 and ISO 16845:2015, and provides synchronized 12-bit SAR ADC sampling across three converters (ADC0–ADC2) for motor-sense applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, enabling real-time application + security/peripheral partitioning |
| Flash Memory | 2112-KB code-flash + 128-KB work-flash, supporting Read-While-Write and dual-bank firmware updates for OTA reliability |
| SRAM | 256-KB with configurable retention granularity, allowing selective power gating during low-power sleep modes |
| Crypto Engine | HSM-compliant engine with AES-128/192/256, SHA-256/512, ECC, TRNG, and GCM mode for secure boot and authenticated communication |
| CAN FD Channels | Up to 8 channels, supporting 8 Mbps data rate and full ISO 11898-1:2015 compliance for high-bandwidth automotive networking |
| ADC System | Three 12-bit SAR ADCs (67 total external channels, 1 Msps max sample rate), with synchronized sampling for motor current/voltage sensing |
| Functional Safety | ASIL-B compliant with SECDED ECC on flash/SRAM, MPU/SMPU, PPU, MCWDT, and BOD/LVD/OVD monitoring |
Pinout & Package
CYT2B93CACQ0AZEGS is packaged in a 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch) with automotive-grade thermal and mechanical specifications. Pin functions include dedicated CAN FD transceiver I/Os, LIN bus drivers, CXPI differential pairs, and GPIO_ENH pins supporting high-drive and slew-rate control.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD / VDDA / VCCD | Power supply inputs | Separate domains for digital core (1.1 V), analog (2.7–5.5 V), and clock distribution; enable independent power sequencing and noise isolation |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Programmable GPIO (STD/ENH) | 152 total I/Os; GPIO_ENH supports configurable drive strength, slew rate, and glitch filtering for robust automotive signal integrity |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential interface | Dedicated high-speed transceiver pins with internal termination and fault detection, supporting 8 Mbps operation per ISO 11898-1 |
| LIN0_TX / LIN0_RX | LIN channel 0 bus interface | Integrated LIN physical layer driver/receiver compliant with ISO 17987, supporting auto-baud and slave node response timing |
| CXPI0_P / CXPI0_N | CXPI channel 0 differential interface | Low-speed (20 kbps) differential bus interface for cost-sensitive body electronics with built-in voltage regulation and ESD protection |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU subsystem | Hardware-isolated M4F + M0+ cores with inter-processor mailbox and shared memory protection (SMPU) for deterministic real-time + security separation |
| Firmware update capability | Read-While-Write flash with dual-bank mode enables atomic over-the-air (FOTA) updates without runtime interruption or external memory dependency |
| Secure boot architecture | Hardware-accelerated digital signature verification using ECC/SHA-256, fast secure boot time (< 100 ms), and immutable root-of-trust in ROM |
| Low-power operation | Five power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable wakeup sources including 152 GPIOs and RTC alarms |
| Motor control support | Synchronized 12-bit ADC sampling across three SAR converters, 75+ TCPWM blocks with dead-time insertion, and quadrature decoding for BLDC/PMSM control |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
|
Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in modern vehicle platforms. IC Role / Device Role / Timing Role: Primary MCU executing CAN FD-based command arbitration, LIN-peripheral coordination, and real-time PWM generation for motor drivers. Use Value: Dual-core partitioning isolates safety-critical door lock logic (M0+) from UI-driven lighting effects (M4F), meeting ASIL-B requirements while enabling feature-rich UX. |
Use Scenario: Integrated control of power windows, side mirrors, and interior lighting within individual door assemblies. IC Role / Device Role / Timing Role: Local ECU managing LIN-connected sensors/actuators and CAN FD gateway functions to central BCM, with CXPI for low-cost interior switches. Use Value: 152 GPIOs and 12 LIN channels allow direct connection to all door peripherals; low-power DeepSleep mode extends battery life during vehicle standby. |
| Roof Module Controller | Smart Junction Box |
|
Use Scenario: Control of sunroof, panoramic roof, and ambient lighting systems with multi-zone dimming and gesture sensing integration. IC Role / Device Role / Timing Role: Real-time sensor fusion hub processing ADC inputs from potentiometers, Hall sensors, and capacitive touch, with synchronized PWM output for LED drivers. Use Value: Three SAR ADCs with synchronized sampling ensure precise position feedback; Smart I/O blocks perform hardware-level Boolean logic for touch debounce without CPU overhead. |
Use Scenario: Power distribution and load switching for chassis electronics including HVAC fans, seat heaters, and wiper motors. IC Role / Device Role / Timing Role: High-reliability power management MCU with integrated watchdog supervision (MCWDT), BOD/LVD monitoring, and fault-tolerant GPIO_ENH outputs driving external high-side switches. Use Value: SECDED ECC on flash/SRAM and PPU-enforced peripheral access prevent corruption-induced latch-up; ASIL-B compliance satisfies OEM junction box safety mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single 240-MHz Arm® Cortex®-M7 core with lockstep M7 for ASIL-D; no M0+ companion core; includes Ethernet MAC and HSE security module | Better suited for gateway/routing roles requiring Ethernet and higher ASIL-D coverage; lacks native CXPI and LIN channel density | Select when Ethernet backbone integration or ASIL-D functional safety is required; not drop-in for LIN/CXPI-heavy body domain designs |
| Renesas RH850/U2A | 32-bit RXv3 core at 400 MHz; proprietary architecture; 2 MB flash, 1.5 MB SRAM; supports CAN FD and LIN but no CXPI or hardware crypto acceleration | Strong in powertrain and chassis control; limited hardware security features compared to CYT2B9's HSM-compliant crypto engine | Prefer for legacy RH850 ecosystem migration or where maximum deterministic interrupt latency is critical; avoid if secure boot or OTA update is mandatory |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B93CACQ0AZEGS uniquely balances dual-core flexibility, CXPI support, and certified HSM-level security in a single die-making it optimal for cost-sensitive, safety-aware body electronics where LIN/CAN FD coexistence and field-upgradable firmware are essential.
Availability
CYT2B93CACQ0AZEGS is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof module controllers, and smart junction boxes requiring stable component supply under AEC-Q100 Grade 2 qualification.
Supply support for CYT2B93CACQ0AZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure serving Tier-1 automotive suppliers.
CYT2B9 belongs to the TRAVEO™ T2G family, designed specifically for automotive body electronics requiring functional safety (ASIL-B), secure firmware execution, and mixed-signal integration in compact LQFP packages.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CYT2B93CACQ0AZEGS?
The Arm® Cortex®-M4F core operates at a maximum frequency of 160 MHz, as confirmed in the device datasheet Section 4.1 and electrical specifications Table 27.2. This speed is achievable under full voltage and temperature conditions (AEC-Q100 Grade 2: –40°C to +105°C ambient) with proper clock configuration using the on-chip PLL.
Does CYT2B93CACQ0AZEGS support Over-The-Air (OTA) firmware updates?
Yes, it supports secure OTA updates via dual-bank flash architecture and Read-While-Write capability. The 2112-KB code-flash allows one bank to execute while the other is being reprogrammed, and the hardware crypto engine verifies signed firmware images using ECC and SHA-256 before installation.
Is CXPI interface support available on all CYT2B9 packages?
Yes, CXPI is supported across all CYT2B9 variants including CYT2B93CACQ0AZEGS (176-LQFP). The datasheet specifies up to four CXPI channels with 20 kbps data rate, implemented using dedicated differential I/O pairs (CXPIx_P/CXPIx_N) with internal biasing and ESD protection.
What debug interfaces are available for CYT2B93CACQ0AZEGS?
It supports both JTAG (IEEE-1149.1-2001 compliant) and Arm® Serial Wire Debug (SWD), with full ETM trace capability. Instruction and data trace is available via JTAG; data-only trace is supported over SWD. These interfaces are compatible with IAR EWARM and Green Hills MULTI development tools.
CYT2B93CACQ0AZEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 160MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- 49
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 45x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2B93CACQ0AZEGS FAQ
1.How can I place an order for CYT2B93CACQ0AZEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2B93CACQ0AZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2B93CACQ0AZEGS reliable?
The price and inventory of CYT2B93CACQ0AZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B93CACQ0AZEGS is usually 5 days.
3.What payment methods are accepted for CYT2B93CACQ0AZEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B93CACQ0AZEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT2B93CACQ0AZEGS?
CYT2B93CACQ0AZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2B93CACQ0AZEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2B93CACQ0AZEGS?
For technical support, including CYT2B93CACQ0AZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B93CACQ0AZEGS requirements.
6.How does Aetrix verify that CYT2B93CACQ0AZEGS is sourced from the original manufacturer or authorized distributors?
All CYT2B93CACQ0AZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B93CACQ0AZEGS meets industry standards.
7.What is the process for return or replacement of CYT2B93CACQ0AZEGS?
All CYT2B93CACQ0AZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B93CACQ0AZEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2B93CACQ0AZEGS part is unused and in its original packaging.
Return procedure for CYT2B93CACQ0AZEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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