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Infineon Technologies CYT2B93CACQ0AZEGST

Part No.:
CYT2B93CACQ0AZEGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCYT2B93CACQ0AZEGST.pdf
Description:
IC MCU 32BT 2.0625MB FLSH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,726

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Product details

Overview

CYT2B93CACQ0AZEGST from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, hardware crypto engine (AES-128/192/256, SHA-256/512, ECC, TRNG), and ASIL-B functional safety certification - deployed in body control modules requiring secure, real-time CAN FD, LIN, and CXPI communication.

For engineers reviewing the CYT2B93CACQ0AZEGST datasheet, CYT2B93CACQ0AZEGST pinout, CYT2B93CACQ0AZEGST application, or CYT2B93CACQ0AZEGST equivalent, this part supports FOTA-capable dual-bank flash, synchronized 12-bit SAR ADCs (up to 67 channels, 1 Msps), 152 GPIOs with wakeup capability, and hardware inter-processor communication - critical for automotive ECU design, secure boot validation, and low-power sleep mode sequencing.

Technical Context

The CYT2B93CACQ0AZEGST implements a tightly coupled dual-CPU architecture: the M4F handles primary application logic and signal processing with single-cycle multiply and FPU, while the M0+ manages peripheral offload, security services (eSHE/HSM), and real-time response via hardware IPC. Memory subsystem includes SECDED ECC on SRAM and flash, MPU/SMPU enforcement, and PPU-protected peripherals.

Its timing system integrates IMO, ILO, ECO, WCO, PLL, and FLL sources; communication stack delivers eight CAN FD channels (ISO 11898-1:2015 compliant, up to 8 Mbps), twelve LIN (ISO 17987), and four CXPI interfaces - all runtime-reconfigurable via SCB blocks. Power management supports Hibernate, DeepSleep, and five configurable low-power modes with multi-threshold BOD.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, with hardware IPC and independent MPUs
Flash Memory 2112-KB code-flash + 128-KB work-flash; supports Read-While-Write and dual-bank firmware update for FOTA
SRAM 256-KB with selectable retention granularity per memory region
Crypto Engine AES-128/192/256, SHA-256/512, ECC/RSA, TRNG/PRNG, GCM, and eSHE/HSM compliance
Automotive Safety ASIL-B certified; SECDED ECC on SRAM/flash, SMPU, PPU, MCWDT, CSV, and BOD/OVD/LVD monitoring
Communication 8× CAN FD (ISO 11898-1:2015), 12× LIN (ISO 17987), 4× CXPI, 8× SCB (I²C/SPI/UART)
Analog Peripherals 3× 12-bit SAR ADCs (67 total external channels, 1 Msps, synchronized sampling), bandgap reference, temp sensor

Pinout & Package

Package: 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch), RoHS-compliant, automotive-grade (AEC-Q100 Grade 2).

Pin/Terminal Circuit Role Design Meaning
VDDD / VDDA Core & Analog Supply 2.7–5.5-V input; internal 1.1-V core regulator enables operation across wide battery range
P0[0]–P0[7] GPIO_STD Bank 0 Programmable digital I/O with interrupt/wakeup capability; supports Smart I/O Boolean logic
CANFD0_TX / CANFD0_RX CAN FD Channel 0 Interface Differential transceiver interface supporting up to 8 Mbps; ISO 11898-1:2015 compliant
SWDIO / SWCLK Serial Wire Debug 2-pin debug interface for programming, real-time trace, and secure authentication during development
RTC_XTAL_IN / RTC_XTAL_OUT Watch Crystal Oscillator Connects 32.768-kHz crystal for precision RTC timekeeping with automatic leap-year correction

Key Features

Feature Design Value
Dual-CPU Hardware IPC Zero-latency mailbox and semaphore registers enable deterministic task partitioning between M4F and M0+
FOTA-Ready Flash Architecture Dual-bank flash with atomic sector swap allows seamless over-the-air firmware updates without runtime interruption
Synchronized Multi-ADC Sampling Three SAR ADCs triggered simultaneously for motor current/voltage sensing with <100-ns skew
Smart I/O Logic Blocks Five programmable logic units perform real-time Boolean operations (AND/OR/XOR) on GPIO signals without CPU involvement
ASIL-B Safety Mechanisms Hardware-enforced memory protection (SMPU), clock supervision (CSV), and error-correcting code (SECDED) on all safety-critical memories

Applications

Body Control Module (BCM) Door Module Controller

Use Scenario: Centralized vehicle body functions including lighting control, window lift, mirror adjustment, and door lock actuation.

IC Role / Device Role / Timing Role: Primary MCU managing CAN FD backbone communication, LIN sub-networks for sensors/actuators, and real-time PWM for LED dimming.

Use Value: Dual-core separation isolates safety-critical door lock logic (M0+) from UI rendering (M4F); 152 GPIOs support direct drive of relays and drivers without external expanders.

Use Scenario: Integrated control of power windows, side mirrors, interior lighting, and anti-pinch detection in automotive door assemblies.

IC Role / Device Role / Timing Role: Real-time motor control unit executing quadrature decoding, PWM_DT for H-bridge drives, and synchronized ADC sampling for current sensing.

Use Value: 75× TCPWM blocks and synchronized 3× ADCs enable precise motor position/speed feedback; Smart I/O handles edge-triggered window obstruction detection autonomously.

Roof Module Controller Seat Control Unit

Use Scenario: Sunroof, panoramic roof, and ambient lighting control with tilt/slide motion profiles and RGBW LED management.

IC Role / Device Role / Timing Role: Motion controller coordinating CAN FD commands from BCM, CXPI for low-speed status reporting, and RTC-scheduled wake events.

Use Value: Hibernate mode with dual-pin wakeup reduces quiescent current to <1 µA; integrated crypto engine secures OTA sunroof calibration updates.

Use Scenario: Power seat positioning with memory presets, heating/ventilation control, and occupant detection via capacitive sensing.

IC Role / Device Role / Timing Role: Secure application processor handling encrypted seat profile storage, LIN communication to seat motors, and analog front-end for thermistor/pressure sensor inputs.

Use Value: eSHE/HSM enables secure key storage and authenticated firmware loading; 12-bit ADCs with internal temp diode support accurate thermal management.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 Single-core Arm® Cortex®-M7 (320 MHz); no M0+ co-processor; supports CAN FD, Ethernet AVB, but lacks CXPI and Smart I/O Targeted at gateway/centralized domain controllers; higher compute density but less peripheral offload flexibility Prefer when Ethernet integration or higher M7 performance is required; avoid if CXPI or autonomous Smart I/O logic is needed.
Renesas RH850/U2A 32-bit RXv3 core (240 MHz); proprietary ISA; 2 MB flash, 512 KB RAM; ASIL-D capable; no hardware crypto acceleration Used in high-integrity chassis/brake ECUs; requires external crypto IC for secure boot and key management Choose for ASIL-D systems where deterministic timing and lockstep cores outweigh crypto integration needs.

Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B93CACQ0AZEGST uniquely combines dual-arm cores with hardware-accelerated crypto, CXPI support, and Smart I/O - enabling lower BOM cost and reduced software overhead in body electronics with mixed-signal and security requirements.

Availability

CYT2B93CACQ0AZEGST is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof modules, and seat control units requiring stable component supply, long lifecycle support, and AEC-Q100 Grade 2 qualification.

Supply support for CYT2B93CACQ0AZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

CYT2B9 belongs to the TRAVEO™ T2G family - engineered specifically for automotive body electronics requiring functional safety (ASIL-B), secure boot, and mixed-signal integration in resource-constrained ECUs.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CYT2B93CACQ0AZEGST?

The Arm® Cortex®-M4F core operates at up to 160 MHz, confirmed in the device's electrical specifications (Section 27.2) and clock diagram (Section 8). This frequency is achievable under full voltage (5.5 V) and temperature (125°C) conditions with PLL configuration, and is sustained across all supported operating modes except Hibernate.

Does CYT2B93CACQ0AZEGST support true hardware-based secure boot?

Yes - it implements fast secure boot using digital signature verification (ECDSA with P-256 curve) and AES-GCM decryption of signed firmware images. The hardware crypto engine performs signature validation and image decryption before execution, with root-of-trust anchored in immutable ROM bootloader and eSHE-managed keys.

How many CAN FD channels are physically implemented in this specific package?

The CYT2B93CACQ0AZEGST (176-LQFP package) supports all eight CAN FD channels as specified in Table 1-1 of the datasheet. Pin assignments for CANFD0–CANFD7 are fully allocated in the 176-pin LQFP layout (Sections 10 and 12), with dedicated TX/RX pairs routed to separate I/O banks for noise isolation.

Is the 12-bit SAR ADC capable of simultaneous sampling across all three converters?

Yes - the device supports hardware-synchronized sampling across ADC0, ADC1, and ADC2 using a common trigger source (e.g., TCPWM or EVTGEN). This is explicitly documented in Section 4.4.3 and verified in the ADC register map (ADCPWR_CTL.SYNC_EN), enabling phase-aligned current/voltage capture for motor control.

CYT2B93CACQ0AZEGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
2.0625MB (2.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B93CACQ0AZEGST FAQ

1.How can I place an order for CYT2B93CACQ0AZEGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B93CACQ0AZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CYT2B93CACQ0AZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B93CACQ0AZEGST is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B93CACQ0AZEGST transactions.

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CYT2B93CACQ0AZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B93CACQ0AZEGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B93CACQ0AZEGST?

For technical support, including CYT2B93CACQ0AZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B93CACQ0AZEGST requirements.

6.How does Aetrix verify that CYT2B93CACQ0AZEGST is sourced from the original manufacturer or authorized distributors?

All CYT2B93CACQ0AZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B93CACQ0AZEGST meets industry standards.

7.What is the process for return or replacement of CYT2B93CACQ0AZEGST?

All CYT2B93CACQ0AZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B93CACQ0AZEGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B93CACQ0AZEGST part is unused and in its original packaging.

Return procedure for CYT2B93CACQ0AZEGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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