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Infineon Technologies CYT2B93CACQ0AZSGST

Name: CYT2B93CACQ0AZSGST
Brand: Infineon Technologies
SKU: CYT2B93CACQ0AZSGST
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYT2B93CACQ0AZSGST

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 64-LQFP

Datasheet:: CYT2B93CACQ0AZSGST.pdf

Description:: IC MCU 32BT 2.0625MB FLSH 64LQFP

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Product details

Overview

CYT2B93CACQ0AZSGST from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112 KB code-flash with RWW support, 256 KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels). It targets body control modules requiring ASIL-B functional safety, secure boot, and hardware crypto acceleration including AES-128/192/256, SHA-256/512, and ECC.

For engineers reviewing the CYT2B93CACQ0AZSGST datasheet, CYT2B93CACQ0AZSGST pinout, CYT2B93CACQ0AZSGST application, or CYT2B93CACQ0AZSGST equivalent, key selection criteria include dual-CPU inter-processor communication, FOTA-capable flash architecture (dual-bank), eSHE/HSM security compliance, and automotive-grade low-power modes (Hibernate, DeepSleep) with multi-pin wakeup capability.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the M4F handles primary application execution and signal processing while the M0+ manages peripheral offload, security services, and real-time I/O control. Hardware inter-processor communication (IPC) enables deterministic message passing without software arbitration.

Its safety architecture includes SECDED ECC on all SRAM and flash, SMPU for shared memory protection, PPU for peripheral access control, and ASIL-B-certified clock supervision (CSV), watchdogs (WDT/MCWDT), and voltage monitors (BOD/LVD/OVD).

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Cores	Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+
Flash Memory	2112 KB code-flash + 128 KB work-flash; supports Read-While-Write and dual-bank FOTA updates
SRAM	256 KB with configurable retention granularity per memory region
CAN FD Channels	Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 (non-ISO)
Security Engine	HSM-compliant crypto engine with AES-128/192/256, SHA-256/512, ECC, TRNG, and secure boot via digital signature verification
Functional Safety	ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC, CSV, MCWDT, and BOD/LVD/OVD monitoring
Power Supply	2.7 V to 5.5 V operation; internal 1.1-V core regulator with DeepSleep and Core internal regulator types

Pinout & Package

Package: 176-LQFP, 24 × 24 × 1.7 mm, 0.5-mm lead pitch. Pinout validated per Infineon datasheet Rev. *I (October 2021), pages 23–49, including power, I/O, debug, clock, and peripheral alternate function assignments.

Pin/Terminal	Circuit Role	Design Meaning
VDDD / VDDA	Analog & Digital Power Supply	Separate 2.7–5.5 V supplies for analog (VDDA) and digital (VDDD) domains; enables noise isolation in mixed-signal operation
P0[0]–P0[7]	GPIO_STD Bank 0	Programmable standard GPIOs supporting LIN/CXPI/CAN FD alternate functions; configurable pull-up/down and drive strength
TCK / TMS / TDI / TDO	JTAG Debug Interface	IEEE-1149.1-compliant boundary scan and debug access; supports ETM instruction/data trace via JTAG
SWDIO / SWCLK	Serial Wire Debug	2-pin Arm® SWD interface for programming and real-time debugging; lower pin count than JTAG
ECO_IN / ECO_OUT	External Crystal Oscillator	Connects to external crystal (1–25 MHz); provides high-accuracy system clock source for CAN FD timing and RTC calibration

Key Features

Feature	Design Value
Dual-CPU IPC Hardware	Zero-software-overhead inter-processor messaging via dedicated mailbox registers and interrupt signaling between M4F and M0+
FOTA Flash Architecture	Dual-bank flash mode enables atomic firmware updates without runtime interruption-critical for automotive over-the-air deployment
Smart I/O Blocks	Five independent programmable logic blocks performing Boolean operations on up to 36 GPIO_STD pins; replaces external glue logic in body control sequencing
Synchronized ADC Sampling	Simultaneous start of conversion across all three SAR ADCs (ADC0–ADC2) for precise motor current/voltage sensing in BLDC/PMSM control
Event Generator Timers	11 EVTGEN timers provide cyclic wakeup from DeepSleep at sub-millisecond intervals-enables ultra-low-power periodic sensor polling

Applications

Body Control Module (BCM)

Door Module Controller

Use Scenario: Centralized management of lighting, window lifts, locks, mirrors, and interior ambient controls in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing vehicle-specific logic, coordinating LIN slaves (door modules), and managing CAN FD gateway functions between domain ECUs.

Use Value: Dual-core separation allows real-time LIN scheduling on M0+ while M4F runs diagnostics and CAN FD routing-reducing latency and improving ASIL-B compliance.

Use Scenario: Local control of power windows, side mirrors, door locks, and anti-pinch detection in front/rear doors.

IC Role / Device Role / Timing Role: Dedicated LIN node with integrated motor drivers and analog sensing; uses Smart I/O for hardware-based window position logic and PWM_DT for motor dead-time control.

Use Value: On-chip Smart I/O eliminates external logic ICs; synchronized ADC sampling captures motor current and voltage simultaneously for accurate stall detection.

Roof Module Controller

Seat Control Unit

Use Scenario: Management of sunroof, panoramic roof, interior lighting, and rain sensors in premium vehicle roof assemblies.

IC Role / Device Role / Timing Role: LIN master controlling multiple sensors and actuators; uses RTC and event timers for timed lighting fade effects and wake-on-rain detection.

Use Value: Hibernate mode with dual-pin wakeup reduces quiescent current to <10 µA while maintaining responsiveness to rain sensor interrupts.

Use Scenario: Position control, heating, ventilation, and massage functions in electrically adjustable front seats.

IC Role / Device Role / Timing Role: Motor control MCU with 12-bit ADCs for seat position potentiometers and thermistors, plus TCPWM blocks for multi-channel heater PWM.

Use Value: 75× 16-bit TCPWM blocks enable independent PWM generation for up to 12 heater zones and 4 motor drivers-no external PWM controllers required.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S32K344WAT0VLQY	NXP S32K3 series; single 240-MHz Arm® Cortex®-M7 core, no companion M0+; includes HSE security module but lacks native CXPI support	Targets gateway and chassis applications; stronger compute density but less optimized for LIN/CXPI-rich body networks	Select when higher single-thread performance and AUTOSAR Adaptive readiness are prioritized over LIN/CXPI channel count and dual-CPU task partitioning
TC377TP-64F200N	Infineon AURIX™ TC3xx; triple TriCore CPUs, ASIL-D capable, 200-MHz clock; no native CAN FD or CXPI-requires external transceivers and protocol stacks	Used in powertrain and braking systems; higher safety integrity but larger footprint and higher BOM cost	Select only when ASIL-D certification, lockstep cores, or deterministic real-time response outweighs need for integrated LIN/CXPI and FOTA flash architecture

Compared with S32K344WAT0VLQY and TC377TP-64F200N, CYT2B93CACQ0AZSGST uniquely balances ASIL-B safety, LIN/CXPI integration, dual-CPU workload partitioning, and FOTA-ready flash-making it optimal for cost-sensitive, feature-rich body electronics where protocol diversity and update agility are critical.

Availability

CYT2B93CACQ0AZSGST is available at Aetrix Electronics and suitable for body control modules, door module controllers, roof assemblies, and seat control units requiring stable component supply, automotive qualification (AEC-Q100 Grade 2), and long-term lifecycle support.

Supply support for CYT2B93CACQ0AZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and automotive qualification expertise.

CYT2B9 belongs to the TRAVEO™ T2G family-designed specifically for automotive body electronics requiring integrated communication (CAN FD/LIN/CXPI), functional safety (ASIL-B), and secure firmware update capabilities in compact LQFP packages.

FAQ

What is the maximum operating frequency of each CPU core in CYT2B93CACQ0AZSGST?

The Arm® Cortex®-M4F core operates at up to 160 MHz, while the companion Arm® Cortex®-M0+ core runs at up to 100 MHz. Both frequencies are specified under full automotive temperature range (−40°C to +125°C) and 2.7–5.5 V supply conditions, with timing closure verified per Infineon's silicon characterization data.

Does CYT2B93CACQ0AZSGST support Over-The-Air (OTA) firmware updates?

Yes-it supports secure OTA updates via its dual-bank flash architecture, enabling atomic firmware swaps without runtime interruption. The bootloader validates digital signatures using the integrated HSM crypto engine (RSA/ECC), and RWW capability allows background flash programming while executing from the active bank.

How many CAN FD channels does CYT2B93CACQ0AZSGST implement, and what is their data rate capability?

CYT2B93CACQ0AZSGST implements up to eight CAN FD channels, each compliant with ISO 11898-1:2015 and supporting data rates up to 8 Mbps. Actual throughput depends on physical layer topology and external transceiver selection, but the controller fully supports CAN FD's flexible data-length and bit-rate switching features.

Is CYT2B93CACQ0AZSGST qualified for automotive use, and which AEC-Q100 grade applies?

Yes-CYT2B93CACQ0AZSGST is qualified per AEC-Q100 Grade 2 (−40°C to +105°C ambient), with additional validation for ASIL-B functional safety per ISO 26262. This qualification covers the full 176-LQFP package variant and includes stress testing for thermal cycling, humidity, and mechanical shock per automotive reliability standards.

CYT2B93CACQ0AZSGST Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 64-LQFP

Series:: Traveo™ T2G

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Core Processor:: ARM® Cortex®-M0+, ARM® Cortex®-M4F

Core Size:: 32-Bit Dual-Core

Speed:: 100MHz, 160MHz

Connectivity:: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART

Peripherals:: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT

Number of I/O:: 49

Program Memory Size:: 2.0625MB (2.0625M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 128K x 8

RAM Size:: 256K x 8

Voltage - Supply (Vcc/Vdd):: 2.7V ~ 5.5V

Data Converters:: A/D 45x12b SAR

Oscillator Type:: External, Internal

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

CYT2B93CACQ0AZSGST FAQ

1.How can I place an order for CYT2B93CACQ0AZSGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B93CACQ0AZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B93CACQ0AZSGST reliable?

The price and inventory of CYT2B93CACQ0AZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B93CACQ0AZSGST is usually 5 days.

3.What payment methods are accepted for CYT2B93CACQ0AZSGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B93CACQ0AZSGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT2B93CACQ0AZSGST?

CYT2B93CACQ0AZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B93CACQ0AZSGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B93CACQ0AZSGST?

For technical support, including CYT2B93CACQ0AZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B93CACQ0AZSGST requirements.

6.How does Aetrix verify that CYT2B93CACQ0AZSGST is sourced from the original manufacturer or authorized distributors?

All CYT2B93CACQ0AZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B93CACQ0AZSGST meets industry standards.

7.What is the process for return or replacement of CYT2B93CACQ0AZSGST?

All CYT2B93CACQ0AZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B93CACQ0AZSGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B93CACQ0AZSGST part is unused and in its original packaging.

Return procedure for CYT2B93CACQ0AZSGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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