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Infineon Technologies CYT2B94BACQ0AZEGST

Part No.:
CYT2B94BACQ0AZEGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixCYT2B94BACQ0AZEGST.pdf
Description:
IC MCU 32BT 2.0625MB FLSH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,131

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Product details

Overview

CYT2B94BACQ0AZEGST from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, 256-KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels) for body control unit applications.

For engineers reviewing the CYT2B94BACQ0AZEGST datasheet, CYT2B94BACQ0AZEGST pinout, CYT2B94BACQ0AZEGST application, or CYT2B94BACQ0AZEGST equivalent, this part delivers ASIL-B functional safety, hardware crypto acceleration (AES-128/192/256, SHA-256/512, ECC, TRNG), and low-power DeepSleep/Hibernate modes with multi-pin wakeup capability.

Technical Context

The CYT2B94BACQ0AZEGST implements a tightly coupled dual-CPU architecture: the M4F handles real-time application processing with FPU and MPU, while the M0+ manages peripheral offload, security boot, and HSM operations via dedicated inter-processor communication hardware. Memory subsystem includes SECDED ECC on all safety-critical SRAM and flash.

Its peripheral set is optimized for automotive body electronics: three DMA controllers (P-DMA0 with 92 channels, P-DMA1 with 44, M-DMA0 with 4), synchronized triple 12-bit SAR ADCs (67 total external channels, 1 Msps), and five Smart I/O blocks enabling autonomous GPIO logic without CPU intervention.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+
Flash Memory 2112-KB code-flash + 128-KB work-flash; supports Read-While-Write and dual-bank FOTA updates
SRAM 256-KB with configurable retention granularity for low-power state preservation
CAN FD Channels Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting up to 8 Mbps data rate
ADC System Three independent 12-bit SAR ADCs (ADC0–ADC2) with 67 total external channels and synchronized sampling for motor-sense
Crypto Engine HSM-compliant engine with AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and Galois/Counter Mode (GCM)
Functional Safety ASIL-B certified with MPU, SMPU, PPU, SECDED ECC on SRAM/flash, and hardware error detection

Pinout & Package

Package: 176-LQFP, 24 × 24 × 1.7 mm, 0.5-mm lead pitch - designed for high I/O count automotive PCB layouts with thermal and mechanical robustness in under-hood environments.

Pin/Terminal Circuit Role Design Meaning
VDDD / VDDA Core & Analog Power Supply 2.7–5.5-V input; internal 1.1-V regulator supplies core; dual BOD thresholds (2.7 V / 3.0 V) ensure reliable reset during voltage sag
P0[0]–P0[7], P1[0]–P1[7], etc. Programmable GPIO (Standard/Enhanced) Up to 152 pins support multiple alternate functions including CAN FD TX/RX, LIN, CXPI, SCB (I²C/SPI/UART), and TCPWM outputs
XTAL_IN / XTAL_OUT External Crystal Oscillator Interface Supports 1–25 MHz ECO for precise clock source; used with PLL/FLL for system clock generation and RTC accuracy
TCK / TMS / TDI / TDO / nTRST JTAG Debug Interface IEEE-1149.1-compliant boundary scan and debug; enables full SWD/JTAG access to both CPUs and memory subsystems
SWDIO / SWCLK Serial Wire Debug Interface Two-pin debug interface supporting ETM instruction/data trace and secure firmware update via SWD port

Key Features

Feature Design Value
Dual-CPU Inter-Processor Communication Hardware mailbox and shared memory with atomic semaphore support enables deterministic task partitioning between M4F and M0+
Firmware Update Over The Air (FOTA) Dual-bank flash architecture with RWW allows seamless background firmware swap without application interruption
Synchronized ADC Sampling Three SAR ADCs trigger simultaneously for phase-aligned current/voltage sensing in BLDC/PMSM motor control
Smart I/O Logic Blocks Five autonomous programmable logic units perform Boolean operations (AND/OR/XOR) on GPIO signals-reducing CPU load for lighting or window control sequencing
Multi-Mode Low-Power Operation Five power states (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable wakeup sources including 152 GPIO pins and EVTGEN timers

Applications

Body Control Module (BCM) Door Module Control

Use Scenario: Centralized management of lighting, locks, windows, mirrors, and interior climate in modern vehicle platforms.

IC Role / Device Role / Timing Role: Primary MCU executing real-time control logic, CAN FD gateway between domains, and LIN master for door/window nodes.

Use Value: Dual-core architecture isolates safety-critical lock actuation (M0+) from infotainment-linked lighting (M4F), meeting ASIL-B requirements.

Use Scenario: Distributed control of power windows, side mirrors, and door locks with anti-pinch detection and position feedback.

IC Role / Device Role / Timing Role: Local LIN slave node with integrated motor control PWM and synchronized ADC for current sensing and position decoding.

Use Value: On-chip TCPWM with dead-time insertion and quadrature decoding eliminates external gate drivers and encoder ICs.

Roof Module (Sunroof/Convertibles) Seat Control Unit

Use Scenario: Precision control of sunroof glass/motorized canvas movement with obstacle detection and soft-stop behavior.

IC Role / Device Role / Timing Role: Real-time motion controller using synchronized ADC sampling and hardware PWM with PRNG-based jitter reduction.

Use Value: Smart I/O blocks autonomously manage limit switch debouncing and direction sequencing-freeing CPU cycles for safety monitoring.

Use Scenario: Motorized seat adjustment (fore/aft, recline, lumbar) with position memory, heating, and occupancy sensing.

IC Role / Device Role / Timing Role: Integrated motor driver interface with 12-bit ADC for current sensing and temperature monitoring across six motors.

Use Value: Triple ADCs sample motor currents simultaneously, enabling vector control algorithms without external analog front-end components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 Single 240-MHz Arm® Cortex®-M7 core; no companion M0+; includes HSE security module but lacks integrated CXPI Targets higher-performance gateway/routing roles; requires external transceivers for LIN/CXPI Prefer when higher single-thread throughput is required and CXPI is not needed.
Renesas RH850/U2A 32-bit RXv3 core (not Arm); 400-MHz max; supports CAN FD and LIN but no native crypto engine or RWW flash Used in legacy Japanese OEM platforms; relies on external secure element for HSM functionality Choose only for backward compatibility with existing RH850 toolchains and ecosystem.

Compared with S32K344 and RH850/U2A, CYT2B94BACQ0AZEGST uniquely combines dual-Arm cores, on-die CXPI, RWW flash, and HSM-grade crypto in a single 176-LQFP package-enabling consolidated body domain control without external security or protocol bridging ICs.

Availability

CYT2B94BACQ0AZEGST is available at Aetrix Electronics and suitable for body control modules, door modules, roof modules, and seat control units requiring stable component supply, long-term automotive lifecycle support, and ASIL-B compliance.

Supply support for CYT2B94BACQ0AZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and automotive qualification expertise.

CYT2B9 belongs to the TRAVEO™ T2G family-designed specifically for automotive body electronics requiring functional safety, secure boot, and integrated high-speed serial interfaces (CAN FD/LIN/CXPI) in cost-sensitive LQFP packages.

FAQ

What is the maximum operating frequency of each CPU core in CYT2B94BACQ0AZEGST?

The Arm® Cortex®-M4F core operates at up to 160 MHz, delivering 200+ DMIPS performance with single-cycle multiply and hardware FPU. The companion Arm® Cortex®-M0+ core runs at up to 100 MHz, optimized for deterministic peripheral handling and security services without competing for M4F resources.

Does CYT2B94BACQ0AZEGST support over-the-air (OTA) firmware updates?

Yes-it supports secure OTA updates via its dual-bank flash architecture and Read-While-Write capability. Firmware images can be written to the inactive bank while the active bank executes, then switched atomically using hardware-supported bank swap logic and cryptographic signature verification.

How many CAN FD channels does CYT2B94BACQ0AZEGST provide, and what is their compliance status?

This device supports up to eight CAN FD channels, fully compliant with ISO 11898-1:2015 and the Bosch CAN FD Specification v1.0. It holds ISO 16845:2015 conformance certification, ensuring interoperability with industry-standard transceivers and physical layer topologies.

Is hardware-based cryptographic acceleration included, and which algorithms are supported?

Yes-the integrated HSM-compliant crypto engine supports AES-128/192/256, SHA-256/512, ECC (NIST P-256/P-384), RSA-2048/3072, TRNG, PRNG, and Galois/Counter Mode (GCM). All operations execute in hardened hardware with key isolation and side-channel resistance.

CYT2B94BACQ0AZEGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-LQFP
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
2.0625MB (2.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B94BACQ0AZEGST FAQ

1.How can I place an order for CYT2B94BACQ0AZEGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B94BACQ0AZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B94BACQ0AZEGST reliable?

The price and inventory of CYT2B94BACQ0AZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B94BACQ0AZEGST is usually 5 days.

3.What payment methods are accepted for CYT2B94BACQ0AZEGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B94BACQ0AZEGST transactions.

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4.How is shipping managed for CYT2B94BACQ0AZEGST?

CYT2B94BACQ0AZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B94BACQ0AZEGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B94BACQ0AZEGST?

For technical support, including CYT2B94BACQ0AZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B94BACQ0AZEGST requirements.

6.How does Aetrix verify that CYT2B94BACQ0AZEGST is sourced from the original manufacturer or authorized distributors?

All CYT2B94BACQ0AZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B94BACQ0AZEGST meets industry standards.

7.What is the process for return or replacement of CYT2B94BACQ0AZEGST?

All CYT2B94BACQ0AZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B94BACQ0AZEGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B94BACQ0AZEGST part is unused and in its original packaging.

Return procedure for CYT2B94BACQ0AZEGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYT2B94BACQ0AZEGST Tags

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