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Infineon Technologies CYT2B94CACQ0AZEGS

Name: CYT2B94CACQ0AZEGS
Brand: Infineon Technologies
SKU: CYT2B94CACQ0AZEGS
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYT2B94CACQ0AZEGS

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 80-LQFP

Datasheet:: CYT2B94CACQ0AZEGS.pdf

Description:: IC MCU 32BT 2.0625MB FLSH 80LQFP

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Product details

Overview

CYT2B94CACQ0AZEGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, 256-KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels) for body control unit applications.

For engineers reviewing the CYT2B94CACQ0AZEGS datasheet, CYT2B94CACQ0AZEGS pinout, CYT2B94CACQ0AZEGS application, or CYT2B94CACQ0AZEGS equivalent, this part delivers ASIL-B functional safety compliance, hardware crypto acceleration (AES-128/192/256, SHA-256/512, ECC, TRNG), and low-power DeepSleep/Hibernate modes with multi-pin wakeup capability.

Technical Context

The CYT2B94CACQ0AZEGS implements a tightly coupled dual-CPU architecture where the M4F handles primary real-time control and signal processing while the M0+ manages peripheral offload, security services (eSHE/HSM), and secure boot via digital signature verification. Inter-processor communication occurs through dedicated hardware mailboxes and shared memory protected by SMPU.

Its peripheral set includes three DMA controllers (P-DMA0 with 92 channels, P-DMA1 with 44, M-DMA0 with 4), synchronized triple 12-bit SAR ADCs (67 total external channels, 1 Msps), and five Smart I/O blocks enabling Boolean logic on GPIO_STD signals - all operating across 2.7–5.5 V with BOD thresholds at 2.7 V/3.0 V (VDDD/VDDA) and 1.1 V (VCCD).

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Cores	Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, enabling real-time control and secure peripheral management in one die.
Flash Memory	2112-KB code-flash + 128-KB work-flash with Read-While-Write (RWW), supporting concurrent firmware execution and OTA updates.
SRAM	256-KB with selectable retention granularity, allowing selective memory retention during low-power Sleep/DeepSleep modes.
CAN FD Channels	Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, enabling 8 Mbps data rates for high-bandwidth body network communication.
ADC System	Three independent 12-bit SAR ADCs (ADC0–ADC2) with up to 67 external channels and synchronized sampling for motor-sense applications.
Crypto Engine	Hardware-accelerated AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and GCM mode - certified for secure boot and HSM-class operations.
Functional Safety	ASIL-B compliant with SECDED ECC on SRAM/flash, MPU/SMPU, PPU, MCWDT, and CSV for end-to-end fault detection and mitigation.

Pinout & Package

This device is packaged in a 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch) with exposed thermal pad. Pin assignments include dedicated power (VDDD, VDDA, VCCD), ground (VSSD, VSSA), clock (ECO_IN/OUT, WCO_IN/OUT), debug (SWDIO, SWCLK), and multifunction I/O supporting CAN FD, LIN, CXPI, SPI/I²C/UART, and PWM.

Pin/Terminal	Circuit Role	Design Meaning
P0[0]–P0[7]	GPIO_STD / CAN FD0_RX/TX	Configurable as standard GPIO or primary CAN FD channel interface with internal termination and loopback support.
P1[0]–P1[7]	GPIO_ENH / LIN0–LIN7	Enhanced GPIO supporting LIN bus transceiver control and automatic baud rate detection per channel.
P2[0]–P2[3]	CXPI0–CXPI3	Dedicated CXPI physical layer interfaces with 20 kbps data rate and built-in voltage regulation for low-voltage vehicle networks.
P12[0]–P12[3]	ADC0_CH0–ADC0_CH3	Analog input channels mapped to ADC0 sequencer with programmable sample-and-hold timing and internal reference routing.
SWDIO / SWCLK	Debug Interface	Two-pin serial wire debug port supporting full JTAG/SWD access, ETM instruction/data trace, and secure debug authentication.

Key Features

Feature	Design Value
Dual-CPU Hardware IPC	Zero-latency mailbox-based inter-processor communication with atomic flag signaling and shared memory coherency enforcement.
FOTA-Ready Flash Architecture	Single/dual-bank flash partitioning with RWW and atomic sector erase, enabling safe over-the-air firmware updates without runtime interruption.
Synchronized Triple ADC	Simultaneous start of conversion across ADC0–ADC2 with sub-microsecond skew, critical for vector-controlled motor current sensing.
Smart I/O Logic Blocks	Five configurable Boolean units performing AND/OR/XOR/NOT on up to 36 GPIO_STD pins, eliminating external glue logic for sensor preprocessing.
Multi-Threshold BOD	Independent brown-out detection at 2.7 V and 3.0 V on analog/digital supplies plus 1.1 V on core supply, enabling robust fail-safe reset sequencing.

Applications

Body Control Module (BCM)

Door Module Controller

Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and seat position in modern automotive platforms.

IC Role / Device Role / Timing Role: Primary MCU executing CAN FD/LIN gateway logic, PWM-driven motor control, and secure firmware update orchestration.

Use Value: Dual-core separation isolates safety-critical LIN/CXPI messaging (M0+) from compute-intensive lighting algorithms (M4F), reducing software complexity and certification effort.

Use Scenario: Integrated control of power windows, door locks, interior lighting, and anti-pinch sensors in vehicle door assemblies.

IC Role / Device Role / Timing Role: Real-time motor control hub with synchronized ADC sampling for current/voltage monitoring and Smart I/O for hardware-level debounce and edge detection.

Use Value: On-die Smart I/O eliminates external RC filters and Schmitt triggers, reducing BOM count and PCB area while improving ESD immunity.

Roof Module Controller

Smart Junction Box

Use Scenario: Coordination of sunroof actuation, ambient lighting, and rain sensor integration in overhead console systems.

IC Role / Device Role / Timing Role: Low-power DeepSleep controller with RTC-triggered wakeup and multi-pin Hibernate resume for ultra-low quiescent current (<10 µA).

Use Value: Configurable retention granularity allows only 8-KB SRAM to remain powered during Hibernate, cutting leakage current by >40% vs. full-SRAM retention.

Use Scenario: Power distribution and load switching for chassis electronics including HVAC, wipers, and horn circuits.

IC Role / Device Role / Timing Role: High-reliability system manager with ASIL-B-compliant watchdog supervision (MCWDT), voltage monitoring (LVD/BOD/OVD), and fault-tolerant GPIO protection.

Use Value: Hardware-enforced Peripheral Protection Unit (PPU) prevents unauthorized register writes to critical power-control peripherals, blocking software-induced short-circuit conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S32K344WAT0MLLR	NXP S32K3 series with 300-MHz Arm® Cortex®-M7 + M7 lockstep; no integrated CXPI; supports Ethernet AVB.	Targeted at gateway ECUs requiring time-sensitive networking; lacks native CXPI for low-cost body networks.	Select when Ethernet or lockstep redundancy outweighs CXPI integration and cost sensitivity.
TC377TP-64F200N	Infineon AURIX™ TC3xx with tri-core TriCore™ CPUs (200 MHz); no M4F/M0+ split; supports SENT and PSI5 but not CXPI.	Designed for powertrain/safety-critical ADAS; higher ASIL-D capability but larger footprint and higher power.	Select for ASIL-D motor control or brake-by-wire where CXPI is unnecessary and deterministic latency is paramount.

Compared with S32K344WAT0MLLR and TC377TP-64F200N, CYT2B94CACQ0AZEGS uniquely balances ASIL-B compliance, CXPI integration, and dual-core workload partitioning-making it optimal for cost-constrained, feature-rich body domain controllers without Ethernet or lockstep requirements.

Availability

CYT2B94CACQ0AZEGS is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof module controllers, and smart junction boxes requiring stable component supply across extended temperature ranges (–40°C to +125°C) and long product lifecycles.

Supply support for CYT2B94CACQ0AZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with leadership in automotive microcontrollers and silicon carbide devices.

The TRAVEO™ T2G family targets automotive body electronics with dual-core processing, integrated legacy and emerging vehicle network interfaces (CAN FD, LIN, CXPI), and hardware security extensions for secure firmware deployment.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CYT2B94CACQ0AZEGS?

The Arm® Cortex®-M4F core operates at a maximum frequency of 160 MHz, confirmed in the datasheet's "Device-level specifications" section (Rev. *I, page 93). This frequency is achievable under specified voltage (2.7–5.5 V) and temperature (–40°C to +125°C) conditions with appropriate clock source configuration using the onboard PLL.

Does CYT2B94CACQ0AZEGS support hardware-based secure boot with cryptographic verification?

Yes. The device implements fast secure boot using digital signature verification (ECDSA or RSA) via its integrated crypto engine. Boot ROM validates signed firmware images before execution, leveraging hardware-accelerated SHA-256 and ECC operations - documented in the "Crypto engine" and "Secure boot and authentication" sections (pages 2–3).

How many CAN FD channels does CYT2B94CACQ0AZEGS support, and what is their compliance status?

CYT2B94CACQ0AZEGS supports up to eight CAN FD channels, compliant with ISO 11898-1:2015 and the Bosch CAN FD Specification V1.0. It holds ISO 16845:2015 conformance certification for interoperability testing, as stated in the "Communication interfaces" section (page 3).

What package type and pin count does CYT2B94CACQ0AZEGS use?

CYT2B94CACQ0AZEGS uses a 176-pin LQFP package (24 × 24 × 1.7 mm, 0.5-mm lead pitch) with an exposed thermal pad. This is explicitly listed in the "Packages" section (page 4) and confirmed in the ordering information table (page 142) as the "EGS" suffix variant.

CYT2B94CACQ0AZEGS Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 80-LQFP

Series:: Traveo™ T2G

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Core Processor:: ARM® Cortex®-M0+, ARM® Cortex®-M4F

Core Size:: 32-Bit Dual-Core

Speed:: 100MHz, 160MHz

Connectivity:: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART

Peripherals:: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT

Number of I/O:: 63

Program Memory Size:: 2.0625MB (2.0625M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 128K x 8

RAM Size:: 256K x 8

Voltage - Supply (Vcc/Vdd):: 2.7V ~ 5.5V

Data Converters:: A/D 52x12b SAR

Oscillator Type:: External, Internal

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

CYT2B94CACQ0AZEGS FAQ

1.How can I place an order for CYT2B94CACQ0AZEGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B94CACQ0AZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B94CACQ0AZEGS reliable?

The price and inventory of CYT2B94CACQ0AZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B94CACQ0AZEGS is usually 5 days.

3.What payment methods are accepted for CYT2B94CACQ0AZEGS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B94CACQ0AZEGS transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT2B94CACQ0AZEGS?

CYT2B94CACQ0AZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B94CACQ0AZEGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B94CACQ0AZEGS?

For technical support, including CYT2B94CACQ0AZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B94CACQ0AZEGS requirements.

6.How does Aetrix verify that CYT2B94CACQ0AZEGS is sourced from the original manufacturer or authorized distributors?

All CYT2B94CACQ0AZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B94CACQ0AZEGS meets industry standards.

7.What is the process for return or replacement of CYT2B94CACQ0AZEGS?

All CYT2B94CACQ0AZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B94CACQ0AZEGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B94CACQ0AZEGS part is unused and in its original packaging.

Return procedure for CYT2B94CACQ0AZEGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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