Infineon Technologies CYT2B95BACQ0AZSGS
- Part No.:
- CYT2B95BACQ0AZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CYT2B95BACQ0AZSGS.pdf
- Description:
- IC MCU 32BT 2.0625MB FLSH 100QFP
- Quantity:
- Payment:

- Shipping:

Inventory:860
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT2B95BACQ0AZSGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, hardware crypto engine (AES-128/192/256, SHA-256/512, TRNG), and ASIL-B functional safety compliance. It targets body control modules requiring CAN FD (up to 8 channels), LIN (up to 12), and CXPI (up to 4) in 12–24 V vehicle electrical systems.
For engineers reviewing the CYT2B95BACQ0AZSGS datasheet, CYT2B95BACQ0AZSGS pinout, CYT2B95BACQ0AZSGS application, or CYT2B95BACQ0AZSGS equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use cases in automotive body electronics, and validated alternative parts for design continuity and supply resilience.
Technical Context
The CYT2B95BACQ0AZSGS implements a tightly coupled dual-CPU architecture: the M4F handles primary application tasks with single-cycle multiply and FPU, while the M0+ manages peripheral offload and security services including secure boot via digital signature verification and HSM-compliant crypto acceleration. Inter-processor communication is handled by dedicated hardware messaging units.
It integrates three DMA controllers (P-DMA0: 92 channels, P-DMA1: 44, M-DMA0: 4), SECDED ECC on all safety-critical memories, and a Peripheral Protection Unit (PPU) enforcing memory-mapped peripheral access control. Clocking includes IMO, ILO, ECO, WCO, PLL, and FLL with runtime reconfiguration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, enabling real-time task partitioning and security isolation |
| Flash Memory | 2112-KB code-flash + 128-KB work-flash, supporting Read-While-Write and dual-bank firmware updates for OTA reliability |
| Crypto Engine | AES-128/192/256, SHA-256/512, TRNG, RSA/ECC vector unit, and GCM mode - certified for eSHE and HSM-level secure boot |
| Automotive Interfaces | Up to 8 CAN FD channels (ISO 11898-1:2015 compliant, up to 8 Mbps), 12 LIN (ISO 17987), and 4 CXPI (20 kbps) |
| Analog Peripherals | Three 12-bit SAR ADCs (67 total external channels, 1 Msps max sampling), synchronized acquisition for motor sensing |
| Safety Certification | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC on SRAM/flash, MCWDT, and BOD with dual thresholds (2.7 V / 3.0 V) |
| Power Range | 2.7 V to 5.5 V operation with DeepSleep, Hibernate, and configurable retention granularity in 256-KB SRAM |
Pinout & Package
CYT2B95BACQ0AZSGS is packaged in a 144-pin LQFP (20 × 20 × 1.7 mm, 0.5-mm pitch), RoHS-compliant and automotive-grade AEC-Q100 qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog Power Supply | 1.1-V core analog rail derived internally; requires external 2.7–5.5 V input to VDDD/VDDA pins |
| P0[0]–P0[7] | GPIO_STD Bank 0 | Programmable digital I/Os supporting event generation, wakeup from Sleep, and Smart I/O Boolean logic |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 Interface | Dedicated differential pair for high-speed CAN FD communication (up to 8 Mbps); supports ISO 11898-1:2015 |
| SWDIO / SWCLK | Serial Wire Debug Interface | Two-pin debug port supporting Arm® SWD protocol, flash programming, and real-time trace via ETM |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator Input/Output | Supports 1–25 MHz crystal for precise clock source; used with PLL/FLL for system clock generation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Hardware Messaging | Zero-latency inter-processor communication via dedicated mailbox registers, eliminating software polling overhead |
| RWW Flash Architecture | Enables concurrent firmware execution and background update of code-flash or work-flash without system stall |
| Configurable Wakeup Sources | 152 GPIOs can wake from Sleep; two dedicated pins support Hibernate wakeup - critical for low-power BCM sleep states |
| Synchronized ADC Sampling | All three SAR ADCs trigger simultaneously for phase-aligned current/voltage capture in 3-phase motor control |
| Smart I/O Logic Blocks | Five independent blocks perform real-time Boolean operations (AND/OR/XOR) on GPIO signals without CPU intervention |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lifts, locks, and mirrors in modern vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time CAN FD bus arbitration, LIN slave coordination, and secure firmware updates. Use Value: Dual-core separation ensures deterministic response to door lock commands while M0+ validates signatures for FOTA patches. | Use Scenario: Localized control of power windows, side mirrors, and interior lighting per vehicle door. IC Role / Device Role / Timing Role: LIN master node communicating with BCM over LIN bus; uses CXPI for low-bandwidth sensor data aggregation. Use Value: 12 LIN channels and 4 CXPI interfaces allow full door module integration without external bridge ICs. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Sunroof actuation, ambient lighting control, and rain sensor interface in roof console assemblies. IC Role / Device Role / Timing Role: Real-time TCPWM timer block drives brushed DC motors; RTC enables scheduled sunroof closure at sunset. Use Value: 75× 16-bit TCPWM blocks provide independent PWM outputs for multi-zone LED dimming and motor position feedback. | Use Scenario: Motorized seat adjustment (forward/back, recline, lumbar) with position sensing and memory recall. IC Role / Device Role / Timing Role: Synchronized triple ADC sampling captures simultaneous current, voltage, and temperature for closed-loop motor control. Use Value: Three SAR ADCs with hardware sequencers and synchronized start enable precise 3-phase current reconstruction at 1 Msps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC375LP-40F200N AC | Tri-core (TriCore™ TC3xx), 200-MHz main core, no integrated CXPI; supports SENT and PSI5 instead | Targeted at powertrain and chassis control; lacks native CXPI required for roof/console modules | Select when migrating from Infineon TRAVEO™ T2G to higher-performance TriCore™ platform with existing AUTOSAR stack |
| S32K344WAT0VLQY | Arm® Cortex®-M7 + M33 dual-core, 320-MHz main core, includes Ethernet MAC; no CXPI or Smart I/O | Designed for gateway and domain controller roles; lacks motor-sensing ADC synchronization and GPIO logic blocks | Prefer for central gateway designs needing CAN FD + Ethernet convergence, not distributed body nodes |
Compared with TC375LP-40F200N AC and S32K344WAT0VLQY, CYT2B95BACQ0AZSGS uniquely combines CXPI support, Smart I/O Boolean logic, and synchronized triple ADC - making it optimal for cost-sensitive, functionally safe body electronics where interface consolidation and analog determinism are critical.
Availability
CYT2B95BACQ0AZSGS is available at Aetrix Electronics and suitable for body control modules, door module controllers, roof console systems, and seat control units requiring stable component supply across automotive production lifecycles.
Supply support for CYT2B95BACQ0AZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT2B95BACQ0AZSGS belongs to the TRAVEO™ T2G family, designed specifically for automotive body electronics requiring functional safety (ASIL-B), secure firmware updates, and consolidated communication interfaces (CAN FD/LIN/CXPI) in cost-optimized LQFP packages.
FAQ
What is the maximum operating frequency of each CPU core in CYT2B95BACQ0AZSGS?
The Arm® Cortex®-M4F core operates at up to 160 MHz, delivering deterministic real-time performance for application tasks. The Arm® Cortex®-M0+ core runs at up to 100 MHz, optimized for peripheral management and security services. Both cores are independently clocked and support dynamic frequency scaling based on workload and power state.
Does CYT2B95BACQ0AZSGS support Over-The-Air (OTA) firmware updates?
Yes - it supports robust OTA updates via dual-bank flash architecture (code-flash + work-flash) and Read-While-Write capability. Secure boot validation using ECDSA signatures and AES-GCM encrypted images ensures authenticity and integrity during field updates, meeting UNECE R155 cybersecurity management system requirements.
Which communication protocols does CYT2B95BACQ0AZSGS natively support without external transceivers?
CYT2B95BACQ0AZSGS integrates physical-layer agnostic controllers for CAN FD, LIN, and CXPI. However, external transceivers are required for CAN FD and LIN bus interfacing. CXPI operates directly from GPIO pins with internal driver circuitry, enabling transceiver-less implementation for low-speed sensor networks in roof or seat modules.
Is CYT2B95BACQ0AZSGS qualified for automotive use, and what is its temperature grade?
Yes - it is AEC-Q100 Grade 2 qualified (−40 °C to +105 °C ambient), with built-in functional safety features including ASIL-B compliance, SECDED ECC on SRAM/flash, dual-threshold BOD, and hardware watchdog timers. All silicon and packaging meet automotive reliability and qualification standards per ISO/TS 16949.
CYT2B95BACQ0AZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 160MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 57x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2B95BACQ0AZSGS FAQ
1.How can I place an order for CYT2B95BACQ0AZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2B95BACQ0AZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2B95BACQ0AZSGS reliable?
The price and inventory of CYT2B95BACQ0AZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B95BACQ0AZSGS is usually 5 days.
3.What payment methods are accepted for CYT2B95BACQ0AZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B95BACQ0AZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT2B95BACQ0AZSGS?
CYT2B95BACQ0AZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2B95BACQ0AZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2B95BACQ0AZSGS?
For technical support, including CYT2B95BACQ0AZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B95BACQ0AZSGS requirements.
6.How does Aetrix verify that CYT2B95BACQ0AZSGS is sourced from the original manufacturer or authorized distributors?
All CYT2B95BACQ0AZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B95BACQ0AZSGS meets industry standards.
7.What is the process for return or replacement of CYT2B95BACQ0AZSGS?
All CYT2B95BACQ0AZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B95BACQ0AZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2B95BACQ0AZSGS part is unused and in its original packaging.
Return procedure for CYT2B95BACQ0AZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT2B95BACQ0AZSGS Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

