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Infineon Technologies CYT2B97BACQ0AZEGS
- Part No.:
- CYT2B97BACQ0AZEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
CYT2B97BACQ0AZEGS.pdf
- Description:
- IC MCU 32BT 2.0625MB FLSH 144QFP
- Quantity:
- Payment:
- Shipping:
Inventory:600
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Product details
Overview
CYT2B97BACQ0AZEGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, integrated 2112-KB code-flash with RWW capability, 256-KB SRAM with retention control, and hardware crypto engine supporting AES-128/192/256, SHA-256/512, ECC, and TRNG - deployed in body control units requiring ASIL-B functional safety compliance.
For engineers reviewing the CYT2B97BACQ0AZEGS datasheet, CYT2B97BACQ0AZEGS pinout, CYT2B97BACQ0AZEGS application, or CYT2B97BACQ0AZEGS equivalent, key selection criteria include dual-CPU inter-processor communication, CAN FD (up to 8 channels, 8 Mbps), CXPI (4 channels), and hardware security module (HSM) support for secure boot and firmware updates over-the-air.
Technical Context
The CYT2B97BACQ0AZEGS implements a tightly coupled dual-CPU architecture: the M4F handles real-time application processing with FPU and MPU, while the M0+ manages peripheral offload, security services, and safety-critical tasks via hardware IPC. Memory subsystem includes SECDED ECC on all safety-critical SRAM and flash blocks.
It integrates three DMA controllers (P-DMA0: 92 channels, P-DMA1: 44 channels, M-DMA0: 4 channels), supports synchronized sampling across three 12-bit SAR ADCs (up to 1 Msps each), and delivers ASIL-B compliance through SMPU, PPU, watchdog supervision (MCWDT), and brown-out detection with dual thresholds (2.7 V / 3.0 V on VDDD/VDDA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, enabling real-time application + secure peripheral processing separation |
| Flash Memory | 2112-KB code-flash + 128-KB work-flash, supporting Read-While-Write and dual-bank FOTA updates |
| SRAM | 256-KB with configurable retention granularity for low-power sleep mode optimization |
| Crypto Engine | HSM-compliant engine with AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and GCM mode for secure boot and OTA integrity |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting up to 8 Mbps data rate |
| ADC Resources | Three independent 12-bit SAR ADCs (ADC0–ADC2), 67 total external channels, synchronized sampling for motor-sense applications |
| Package | 176-LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch), qualified for automotive AEC-Q100 Grade 2 (−40°C to +105°C) |
Pinout & Package
CYT2B97BACQ0AZEGS is housed in a 176-pin LQFP package (24 mm × 24 mm, 0.5 mm pitch), with dedicated power, ground, clock, debug (SWD/JTAG), CAN FD, LIN, CXPI, and GPIO pins distributed across four sides. Pin functions are fully defined in Infineon's datasheet Section 12 (Package pin list and alternate functions) and Section 14 (Alternate function pin assignments).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD, VDDA, VCCD, VSS | Power supply and ground rails | Separate analog/digital/core domains enable noise isolation and independent power gating during low-power modes |
| P0[0]–P11[15] | Programmable GPIO (152 total) | GPIO_STD and GPIO_ENH types support wakeup from Sleep/DeepSleep/Hibernate; configurable pull-up/down, drive strength, slew rate |
| TTCAN0_TX/RX – TTCAN7_TX/RX | CAN FD transceiver interface | Dedicated differential pairs per channel; supports ISO 11898-1:2015 physical layer compliance and error frame handling |
| LIN0–LIN11 | LIN bus interface | 12 independent LIN channels compliant with ISO 17987; each supports auto-baud detection and slave node response timing |
| CXPI0–CXPI3 | CXPI bus interface | 4-channel Local Interconnect extension supporting 20 kbps data rate, used for low-cost sensor/actuator communication |
| TCK, TMS, TDO, TDI, SWDIO, SWCLK | Debug interface | JTAG (IEEE-1149.1) and SWD support full-speed debugging, trace (ETM), and secure programming via SWD/JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Hardware IPC | Zero-latency inter-processor mailbox and semaphore registers enable deterministic task handoff between M4F and M0+ without software polling |
| Firmware Update Over-The-Air (FOTA) | Dual-bank flash architecture with atomic bank switching allows validated firmware activation without system reset or service interruption |
| ASIL-B Functional Safety | Integrated SMPU, PPU, MCWDT, SECDED ECC on SRAM/flash, and BOD with dual threshold levels meet ISO 26262 requirements |
| Smart I/O Logic | Five programmable Smart I/O blocks perform Boolean operations (AND/OR/XOR) on GPIO signals, reducing CPU load for signal conditioning |
| Motor Control Timers | 12 dedicated 16-bit TCPWM blocks with dead-time insertion, quadrature decoding, and PWM_PR mode support precise inverter gate driving |
Applications
| Body Control Module (BCM) | Door Module Control |
|---|---|
|
Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in modern vehicles. IC Role / Device Role / Timing Role: Primary controller executing real-time CAN FD messaging, LIN-based actuator control, and secure firmware updates. Use Value: Dual-CPU separation isolates safety-critical door lock logic (M0+) from UI/lighting tasks (M4F), meeting ASIL-B requirements without software partitioning overhead. |
Use Scenario: Distributed control of power windows, anti-pinch sensors, and interior lighting within individual door assemblies. IC Role / Device Role / Timing Role: Edge node processor interfacing with CXPI sensors and LIN actuators while synchronizing ADC sampling for torque feedback. Use Value: Integrated 3× SAR ADCs with synchronized sampling capture motor current and position data simultaneously, eliminating external timing coordination. |
| Roof Module (Sunroof/Climate) | Seat Control Unit |
|
Use Scenario: Coordinating sunroof glass movement, tilt mechanism, and ambient light sensing with HVAC integration. IC Role / Device Role / Timing Role: Real-time motion control using TCPWM timers with dead-time insertion and event-triggered ADC conversions. Use Value: 75× 16-bit TCPWM blocks and 11 EVTGEN timers enable precise cyclic wake-up from DeepSleep to execute motor ramp profiles without CPU intervention. |
Use Scenario: Managing seat position memory, heating elements, and occupancy detection via capacitive sensing. IC Role / Device Role / Timing Role: Secure execution environment for encrypted seat profile storage and authenticated user access via HSM-backed crypto engine. Use Value: Hardware-accelerated AES-256 and ECC enable fast, tamper-resistant storage of biometric seat settings without compromising MCU performance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz); no M0+ co-processor; supports CAN FD (10 ch), Ethernet AVB, but lacks CXPI and Smart I/O | Targeted at gateway and domain controller roles; less suitable for cost-sensitive body nodes requiring CXPI or Boolean I/O logic | Select when Ethernet connectivity or higher single-thread compute throughput is required over dual-CPU task isolation |
| Renesas RH850/U2A | 32-bit RXv3 core (240 MHz); proprietary architecture; supports CAN FD (6 ch), LIN (16 ch), but no hardware crypto accelerator or RWW flash | Strong legacy support in Japanese OEMs; limited OTA update flexibility due to absence of dual-bank flash and secure boot engine | Select where existing RH850 toolchain and ecosystem integration outweigh need for HSM-based secure boot and FOTA agility |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B97BACQ0AZEGS uniquely combines dual-CPU task segregation, CXPI interface, Smart I/O logic, and HSM-grade crypto in a single AEC-Q100 Grade 2 package - optimizing for secure, low-cost body electronics with minimal external components.
Availability
CYT2B97BACQ0AZEGS is available at Aetrix Electronics and suitable for automotive body control modules, door modules, roof modules, and seat control units requiring stable component supply, long lifecycle support, and AEC-Q100 qualification.
Supply support for CYT2B97BACQ0AZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT2B97BACQ0AZEGS belongs to the TRAVEO™ T2G family, designed specifically for automotive body electronics requiring functional safety (ASIL-B), secure firmware execution, and multi-protocol connectivity (CAN FD/LIN/CXPI) in cost-constrained ECUs.
FAQ
What is the maximum operating temperature range for CYT2B97BACQ0AZEGS?
CYT2B97BACQ0AZEGS is qualified to AEC-Q100 Grade 2, supporting continuous operation from −40°C to +105°C ambient temperature. This rating applies to the full 176-LQFP package variant and is verified per JEDEC JESD22-A104 and JESD22-A108 reliability test standards.
Does CYT2B97BACQ0AZEGS support hardware-based secure boot?
Yes. The device integrates a Hardware Security Module (HSM) that performs digital signature verification using ECDSA or RSA-2048 during boot, enforces immutable root-of-trust, and supports fast secure boot with measured boot log generation for attestation.
How many CAN FD channels are physically implemented in this specific part number?
CYT2B97BACQ0AZEGS implements eight fully independent CAN FD channels (TTCAN0–TTCAN7), each with dedicated TX/RX pins, message RAM, and filtering logic - confirmed in the device's peripheral I/O map (Datasheet Section 7) and pin assignment table (Section 12).
Is external flash required to enable FOTA functionality?
No. FOTA is fully supported using internal flash only: the 2112-KB code-flash and 128-KB work-flash operate in dual-bank mode, allowing one bank to run active firmware while the other receives and validates new images - no external memory needed.
CYT2B97BACQ0AZEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 160MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- 122
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 72x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2B97BACQ0AZEGS FAQ
1.How can I place an order for CYT2B97BACQ0AZEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2B97BACQ0AZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2B97BACQ0AZEGS reliable?
The price and inventory of CYT2B97BACQ0AZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B97BACQ0AZEGS is usually 5 days.
3.What payment methods are accepted for CYT2B97BACQ0AZEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B97BACQ0AZEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT2B97BACQ0AZEGS?
CYT2B97BACQ0AZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2B97BACQ0AZEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2B97BACQ0AZEGS?
For technical support, including CYT2B97BACQ0AZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B97BACQ0AZEGS requirements.
6.How does Aetrix verify that CYT2B97BACQ0AZEGS is sourced from the original manufacturer or authorized distributors?
All CYT2B97BACQ0AZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B97BACQ0AZEGS meets industry standards.
7.What is the process for return or replacement of CYT2B97BACQ0AZEGS?
All CYT2B97BACQ0AZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B97BACQ0AZEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2B97BACQ0AZEGS part is unused and in its original packaging.
Return procedure for CYT2B97BACQ0AZEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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