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Infineon Technologies CYT2B97BACQ0AZEGST
- Part No.:
- CYT2B97BACQ0AZEGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
CYT2B97BACQ0AZEGST.pdf
- Description:
- IC MCU 32BT 2.0625MB FLSH 144QFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,943
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Product details
Overview
CYT2B97BACQ0AZEGST from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, 256-KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels). It targets body control modules requiring ASIL-B functional safety, secure boot, and hardware crypto acceleration including AES-128/192/256, SHA-256/512, and ECC.
For engineers reviewing the CYT2B97BACQ0AZEGST datasheet, CYT2B97BACQ0AZEGST pinout, CYT2B97BACQ0AZEGST application, or CYT2B97BACQ0AZEGST equivalent, key selection criteria include dual-CPU inter-processor communication, flash bank configuration for FOTA updates, SECDED ECC on SRAM/flash, eSHE/HSM crypto engine availability, and 152-GPIO wakeup capability across Sleep/DeepSleep/Hibernate modes.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the M4F handles primary application execution and signal processing while the M0+ manages peripheral offload, security services, and real-time response-communicating via hardware-accelerated inter-processor mailboxes and shared memory protected by SMPU. All safety-critical memories employ SECDED ECC, and clock supervision includes CSV, PLL/FLL, IMO/ILO/ECO/WCO sources.
Peripheral integration includes three DMA controllers (P-DMA0: 92 channels, P-DMA1: 44 channels, M-DMA0: 4 channels), programmable Smart I/O blocks for Boolean logic on GPIO_STD signals, and synchronized SAR ADC sampling across three 12-bit converters (ADC0–ADC2) supporting up to 67 external channels at 1 Msps for motor-sense applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, with hardware IPC and separate MPUs |
| Flash Memory | 2112-KB code-flash + 128-KB work-flash; supports Read-While-Write and single/dual-bank FOTA update modes |
| SRAM | 256-KB with configurable retention granularity per memory region |
| Crypto Engine | Hardware-accelerated AES-128/192/256, SHA-256/512, ECC/RSA, TRNG/PRNG, GCM, and eSHE/HSM compliance |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0; max 8 Mbps data rate |
| ADC System | Three 12-bit SAR ADCs (ADC0: 24+1 ch, ADC1: 32+1 ch, ADC2: 8+1 ch); synchronized sampling for motor control |
| GPIO & Wakeup | Up to 152 programmable I/Os; supports wakeup from Hibernate (2 pins), Sleep (152 pins), and DeepSleep (EVTGEN/RTC/SCB) |
Pinout & Package
Package: 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch), RoHS-compliant, automotive-grade (AEC-Q100 Grade 2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD, VDDA, VCCD | Power supply inputs | VDDD/VDDA: 2.7–5.5 V analog/digital core; VCCD: 1.1 V internal core rail generated by on-chip regulator |
| P0[0]–P11[15] | Programmable GPIO | 152 total I/Os; GPIO_STD (36 supported by Smart I/O) and GPIO_ENH types with configurable drive strength and slew rate |
| CANFD0_TX–CANFD7_RX | CAN FD transceiver interface | Dedicated differential pairs per channel; each supports ISO 11898-1:2015 physical layer signaling |
| LIN0–LIN11 | LIN bus interface | 12 independent LIN channels compliant with ISO 17987; each supports slave/master mode and auto-baud detection |
| CXPI0–CXPI3 | CXPI bus interface | 4 dedicated CXPI channels operating at 20 kbps; supports bidirectional half-duplex communication for automotive body networks |
| TCK, TMS, TDI, TDO, nTRST, SWDIO, SWCLK | Debug interface | IEEE-1149.1 JTAG and Arm® SWD compliant; enables ETM instruction/data trace and secure debug authentication |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Hardware IPC | Zero-latency mailbox and shared memory access between M4F and M0+ with SMPU-enforced isolation |
| FOTA-Ready Flash Architecture | Dual-bank flash enables atomic firmware swap without runtime interruption; RWW allows concurrent execution and programming |
| ASIL-B Functional Safety | MPU/SMPU, SECDED ECC on all safety-critical memories, BOD/LVD/OVD monitoring, and clock supervisor (CSV) |
| Secure Boot & Authentication | Hardware-verified digital signature validation using RSA/ECC keys; fast secure boot with authenticated bootloader execution |
| Smart I/O Logic Blocks | Five configurable logic units performing Boolean operations (AND/OR/XOR/NOT) on GPIO_STD signals without CPU intervention |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, windows, locks, and mirrors in modern vehicle body electronics. IC Role / Device Role / Timing Role: Primary MCU executing BCM application firmware, coordinating CAN FD/LIN/CXPI communications, and managing secure OTA updates. Use Value: Dual-core architecture isolates safety-critical functions (e.g., door lock actuation) on M0+ while M4F handles UI rendering and diagnostics-enabling ASIL-B compliance and deterministic response. | Use Scenario: Distributed control unit inside vehicle doors handling window lift, mirror fold, and anti-pinch sensing. IC Role / Device Role / Timing Role: Real-time motor control MCU interfacing with 12-bit SAR ADCs for current/voltage feedback and PWM_DT outputs for BLDC drivers. Use Value: Synchronized triple ADC sampling and 75+ TCPWM blocks enable precise closed-loop motor control with dead-time compensation and fault-safe shutdown. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Integrated control of sunroof, panoramic roof, and ambient lighting with LIN-connected sensors and actuators. IC Role / Device Role / Timing Role: LIN master node managing up to 12 slave devices; uses Smart I/O to debounce mechanical switches and generate timed LED fade effects. Use Value: Hardware Smart I/O offloads GPIO timing and logic from CPU, reducing interrupt load and enabling consistent 20-ms LIN frame scheduling. | Use Scenario: Motorized seat positioning with memory presets, heating, and occupancy detection via capacitive sensing. IC Role / Device Role / Timing Role: Secure HSM-enabled MCU authenticating user profiles and encrypting seat position data stored in dual-bank flash. Use Value: eSHE/HSM crypto engine provides tamper-resistant key storage and AES-GCM encryption for over-the-air seat profile synchronization across vehicle domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP-64F200N AC | TriCore™ AURIX™ dual-core (200-MHz TriCore + 100-MHz TriCore); no native CXPI; 12-bit ADC with 48 ch only | Targeted at powertrain/safety-critical steering; lacks CXPI and Smart I/O; higher ASIL-D readiness | Select when ASIL-D functional safety or high-speed motor control dominates over body-network protocol diversity |
| S32K344WAT0VLHT | Arm® Cortex®-M7/M4 dual-core (320/160 MHz); 4 MB flash; supports CAN FD/LIN but no CXPI; no Smart I/O blocks | Optimized for gateway and domain controller roles; larger memory footprint; no hardware Boolean logic on GPIO | Select when high-bandwidth CAN FD routing, Ethernet bridging, or large OTA image storage is required over localized body-node intelligence |
Compared with TC377TP-64F200N AC and S32K344WAT0VLHT, CYT2B97BACQ0AZEGST uniquely balances protocol breadth (CAN FD + LIN + CXPI), localized hardware acceleration (Smart I/O, synchronized ADC), and FOTA-optimized flash-making it optimal for cost-sensitive, feature-rich body control nodes rather than centralized gateways or ASIL-D powertrain systems.
Availability
CYT2B97BACQ0AZEGST is available at Aetrix Electronics and suitable for automotive body control modules, door/roof/seat control units, and LIN/CXPI networked ECUs requiring stable component supply, long-term lifecycle commitment, and AEC-Q100 Grade 2 qualification.
Supply support for CYT2B97BACQ0AZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT2B9 belongs to the TRAVEO™ T2G family-designed specifically for automotive body electronics requiring multi-protocol connectivity, functional safety up to ASIL-B, and hardware-accelerated security for OTA firmware updates and secure boot.
FAQ
Does CYT2B97BACQ0AZEGST support hardware-based secure boot with cryptographic verification?
Yes. The part integrates a hardware crypto engine supporting RSA/ECC signature verification, AES-GCM decryption, and secure key storage via eSHE/HSM. Secure boot executes an authenticated bootloader from flash, validating firmware integrity before loading application code-no software-only fallback path exists.
What is the maximum number of CAN FD channels supported, and are they electrically isolated?
CYT2B97BACQ0AZEGST supports up to eight CAN FD channels, each with dedicated TX/RX pins and full ISO 11898-1:2015 compliance. Electrical isolation is not provided on-die; external CAN transceivers (e.g., TJA1044) must be used, and galvanic isolation requires discrete components or isolated transceivers.
How does the dual-bank flash architecture enable safe firmware updates?
The 2112-KB code-flash supports dual-bank mode where one bank runs active firmware while the other receives new code. Atomic bank swap occurs after CRC validation, ensuring zero downtime and rollback capability. RWW allows background programming without halting CPU execution-critical for uninterrupted vehicle operation during OTA updates.
Is Smart I/O functionality available on all 152 GPIO pins?
No. Smart I/O logic blocks support only GPIO_STD-type pins, with up to 36 such pins accessible across the 176-LQFP package. GPIO_ENH pins lack Smart I/O capability and are reserved for high-drive or analog functions like ADC inputs or PWM outputs.
CYT2B97BACQ0AZEGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 160MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- 122
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 72x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2B97BACQ0AZEGST FAQ
1.How can I place an order for CYT2B97BACQ0AZEGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2B97BACQ0AZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2B97BACQ0AZEGST reliable?
The price and inventory of CYT2B97BACQ0AZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B97BACQ0AZEGST is usually 5 days.
3.What payment methods are accepted for CYT2B97BACQ0AZEGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B97BACQ0AZEGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT2B97BACQ0AZEGST?
CYT2B97BACQ0AZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2B97BACQ0AZEGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2B97BACQ0AZEGST?
For technical support, including CYT2B97BACQ0AZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B97BACQ0AZEGST requirements.
6.How does Aetrix verify that CYT2B97BACQ0AZEGST is sourced from the original manufacturer or authorized distributors?
All CYT2B97BACQ0AZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B97BACQ0AZEGST meets industry standards.
7.What is the process for return or replacement of CYT2B97BACQ0AZEGST?
All CYT2B97BACQ0AZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B97BACQ0AZEGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2B97BACQ0AZEGST part is unused and in its original packaging.
Return procedure for CYT2B97BACQ0AZEGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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