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Infineon Technologies CYT2B97BACQ0AZSGS
- Part No.:
- CYT2B97BACQ0AZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
CYT2B97BACQ0AZSGS.pdf
- Description:
- IC MCU 32BT 2.0625MB FLSH 144QFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,733
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Product details
Overview
CYT2B97BACQ0AZSGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, 256-KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels) for body control unit applications.
For engineers reviewing the CYT2B97BACQ0AZSGS datasheet, CYT2B97BACQ0AZSGS pinout, CYT2B97BACQ0AZSGS application, or CYT2B97BACQ0AZSGS equivalent, this part delivers ASIL-B functional safety, hardware crypto acceleration (AES-128/192/256, SHA-256/512, ECC, TRNG), and low-power DeepSleep/Hibernate modes with multi-pin wakeup capability.
Technical Context
The CYT2B97BACQ0AZSGS implements a tightly coupled dual-CPU architecture: the M4F handles real-time application processing with FPU and MPU, while the M0+ manages peripheral offload, security services (eSHE/HSM), and secure boot via digital signature verification. Inter-processor communication is handled in hardware with dedicated mailbox and semaphore resources.
It integrates three DMA controllers (P-DMA0: 92 channels, P-DMA1: 44 channels, M-DMA0: 4 channels), SECDED ECC on all safety-critical memories, and a Peripheral Protection Unit (PPU) enforcing access rights per peripheral instance. Clocking includes IMO, ILO, ECO, WCO, PLL, and FLL with runtime reconfiguration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+ |
| Flash Memory | 2112-KB code-flash + 128-KB work-flash; supports Read-While-Write and dual-bank FOTA updates |
| SRAM | 256-KB with configurable retention granularity for low-power mode optimization |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0; max 8 Mbps data rate |
| LIN Channels | Up to 12 channels compliant with ISO 17987; independent runtime-configurable interfaces |
| Crypto Engine | Hardware-accelerated AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and GCM mode |
| Functional Safety | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC, and clock/fault supervision (CSV, BOD, OVD) |
Pinout & Package
This device is packaged in a 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch) with exposed pad. Pin functions are defined across multiple I/O banks supporting GPIO_STD, GPIO_ENH, analog inputs, CAN FD transceivers, LIN drivers, CXPI, and high-speed clock inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD, VDDA, VCCD | Power supply inputs | VDDD/VDDA: 2.7–5.5 V core/analog supply; VCCD: 1.1 V internal core regulator output |
| P0[0]–P0[7], P1[0]–P1[7], ..., P10[0]–P10[7] | Programmable GPIOs | 152 total I/Os; GPIO_STD supports standard logic; GPIO_ENH adds slew-rate control and analog mux routing |
| CANFD0_TX, CANFD0_RX, ..., CANFD7_TX, CANFD7_RX | CAN FD transceiver interface | Dedicated differential pairs per channel; each supports ISO 11898-1 physical layer compliance |
| LIN0–LIN11 | LIN bus interface | 12 independent LIN PHY outputs; each supports wake-up detection and ISO 17987 protocol framing |
| CXPI0–CXPI3 | CXPI bus interface | 4 single-wire serial interfaces; 20 kbps data rate; supports master/slave roles and collision detection |
| JTAG_TCK, JTAG_TMS, JTAG_TDI, JTAG_TDO, SWDIO, SWCLK | Debug interface | IEEE-1149.1 JTAG and Arm SWD support; enables ETM instruction/data trace and flash programming |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Hardware IPC | Mailbox + semaphore registers enable deterministic, lock-free inter-core messaging without software polling overhead |
| RWW Flash Architecture | Enables concurrent firmware execution and background OTA update of code/work-flash without system interruption |
| Configurable Low-Power Modes | Five modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with granular wakeup source selection (GPIO, RTC, EVTGEN, SCB) |
| Synchronized Multi-ADC Sampling | Three SAR ADCs (67 total external channels, 12-bit, 1 Msps) support simultaneous sampling for motor current/voltage sensing |
| Smart I/O Logic Blocks | Five programmable logic units perform Boolean operations (AND/OR/XOR) on up to 36 GPIO_STD pins for hardware-level signal conditioning |
Applications
| Body Control Module (BCM) | Door Module Control |
|---|---|
|
Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in modern vehicle platforms. IC Role / Device Role / Timing Role: Primary MCU executing real-time control tasks, coordinating LIN slaves (door modules), and handling CAN FD diagnostics via gateway interface. Use Value: Dual-core separation allows M4F to run motor PWM and sensor fusion while M0+ handles LIN protocol stack and secure key provisioning - reducing latency and improving ASIL-B compliance. |
Use Scenario: Distributed control of power windows, side mirrors, and interior lighting within individual door assemblies. IC Role / Device Role / Timing Role: LIN slave node with local sensor input (switches, Hall effect), actuator drive (H-bridge), and fault reporting over LIN to BCM. Use Value: Integrated LIN PHY and 12-bit ADC enable direct connection to potentiometers and current-sense shunts - eliminating external transceivers and analog front-ends. |
| Roof Module (Sunroof/Climate) | Seat Control Unit |
|
Use Scenario: Motorized sunroof positioning and HVAC damper control with position feedback and thermal monitoring. IC Role / Device Role / Timing Role: Real-time motion controller using TCPWM blocks for precise BLDC commutation and SAR ADC for thermistor-based temperature sensing. Use Value: 75× 16-bit TCPWM timers with dead-time insertion and synchronized ADC sampling ensure smooth, jitter-free motor operation under varying load conditions. |
Use Scenario: Adjustment of seat position (forward/back, recline, lumbar), heating, and memory recall in premium automotive seating systems. IC Role / Device Role / Timing Role: Local MCU managing H-bridge drivers, seat position sensors (potentiometer, rotary encoder), and heater PWM via dedicated TCPWM blocks. Use Value: Smart I/O logic blocks implement hardware debouncing and edge detection on seat switch inputs - offloading CPU and improving response time to user commands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz); no M0+ co-processor; includes HSE security engine but lacks eSHE/HSM partitioning | Targets higher-performance gateway/routing applications; less optimized for peripheral offload and secure boot isolation | Select when higher single-thread compute throughput is required over dual-core task segregation. |
| Renesas RH850/U2A | 32-bit RH850 core (240 MHz); proprietary ISA; no Arm ecosystem toolchain support; integrated CAN FD/LIN but no CXPI | Focused on powertrain and chassis control; limited third-party middleware availability for body electronics | Select only when legacy RH850 software investment or specific OEM platform mandate applies. |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B97BACQ0AZSGS uniquely combines Arm dual-core determinism, CXPI support for next-gen body networks, and hardware-enforced security partitioning - making it optimal for scalable, future-proof BCM designs requiring ASIL-B and OTA readiness.
Availability
CYT2B97BACQ0AZSGS is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof/sunroof control units, and seat control systems requiring stable component supply, long lifecycle support, and ASIL-B certification.
Supply support for CYT2B97BACQ0AZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.
The TRAVEO™ T2G family targets automotive body electronics with dual-core processing, integrated CAN FD/LIN/CXPI, and hardware security - designed specifically for ASIL-B-compliant, OTA-capable control units.
FAQ
What package type does CYT2B97BACQ0AZSGS use?
CYT2B97BACQ0AZSGS uses a 176-pin LQFP package (24 × 24 × 1.7 mm, 0.5-mm pitch) with exposed thermal pad. This variant supports the full peripheral set including all 8 CAN FD channels, 12 LIN interfaces, and 4 CXPI ports - confirmed in Infineon's ordering information and package drawings.
Does CYT2B97BACQ0AZSGS support secure boot with cryptographic verification?
Yes. It implements fast secure boot using digital signature verification (ECDSA or RSA) enforced by the hardware crypto engine and HSM. Boot images are authenticated before execution, and the eSHE/HSM partition isolates root keys and boot ROM from application software - meeting UNECE R155 cybersecurity management system requirements.
How many CAN FD channels are implemented in this specific variant?
CYT2B97BACQ0AZSGS implements 8 fully independent CAN FD channels, each compliant with ISO 11898-1:2015 and capable of up to 8 Mbps data rates. This is confirmed in the device's peripheral instance list (Table 1-1, Datasheet Rev. *I, p.5) and pin assignment tables for 176-LQFP.
Is CXPI interface support available on CYT2B97BACQ0AZSGS?
Yes. This variant includes 4 dedicated CXPI channels operating at up to 20 kbps, with hardware support for master/slave roles, collision detection, and frame synchronization - enabling integration into next-generation automotive body networks where CXPI replaces legacy LIN for higher reliability and reduced wiring.
CYT2B97BACQ0AZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 160MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- 122
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 72x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2B97BACQ0AZSGS FAQ
1.How can I place an order for CYT2B97BACQ0AZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2B97BACQ0AZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2B97BACQ0AZSGS reliable?
The price and inventory of CYT2B97BACQ0AZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B97BACQ0AZSGS is usually 5 days.
3.What payment methods are accepted for CYT2B97BACQ0AZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B97BACQ0AZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT2B97BACQ0AZSGS?
CYT2B97BACQ0AZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2B97BACQ0AZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2B97BACQ0AZSGS?
For technical support, including CYT2B97BACQ0AZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B97BACQ0AZSGS requirements.
6.How does Aetrix verify that CYT2B97BACQ0AZSGS is sourced from the original manufacturer or authorized distributors?
All CYT2B97BACQ0AZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B97BACQ0AZSGS meets industry standards.
7.What is the process for return or replacement of CYT2B97BACQ0AZSGS?
All CYT2B97BACQ0AZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B97BACQ0AZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2B97BACQ0AZSGS part is unused and in its original packaging.
Return procedure for CYT2B97BACQ0AZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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