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Infineon Technologies CYT2B97CACQ0AZSGS

Part No.:
CYT2B97CACQ0AZSGS
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixCYT2B97CACQ0AZSGS.pdf
Description:
IC MCU 32BT 2.0625MB FLSH 144QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:600

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Product details

Overview

CYT2B97CACQ0AZSGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, 256-KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels). It targets body control modules requiring ASIL-B functional safety, secure boot, and hardware crypto acceleration including AES-128/192/256, SHA-256/512, and ECC.

For engineers reviewing the CYT2B97CACQ0AZSGS datasheet, CYT2B97CACQ0AZSGS pinout, CYT2B97CACQ0AZSGS application, or CYT2B97CACQ0AZSGS equivalent, this part delivers verified dual-CPU partitioning for real-time control + security offload, certified ISO 11898-1:2015 CAN FD compliance, and production-ready FOTA support via dual-bank flash architecture.

Technical Context

The CYT2B97CACQ0AZSGS implements hardware-enforced inter-processor communication between its M4F and M0+ cores, enabling deterministic peripheral management and secure boot execution in separate trust domains. Its three DMA controllers-P-DMA0 (92 channels), P-DMA1 (44 channels), and M-DMA0 (4 channels)-support concurrent high-bandwidth data movement across peripherals and memory without CPU intervention.

Functional safety is implemented via MPU, SMPU, PPU, SECDED ECC on all safety-critical memories, and dual-threshold BOD (2.7 V / 3.0 V on VDDD/VDDA; 1.1 V on VCCD). Clock supervision includes CSV, FLL, PLL, IMO, ILO, ECO, and WCO sources with failover capability.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, with hardware IPC and independent MPUs
Flash Memory 2112-KB code-flash + 128-KB work-flash; supports Read-While-Write and dual-bank FOTA updates
SRAM 256-KB with configurable retention granularity for low-power mode optimization
CAN FD Channels Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD Spec v1.0; max 8 Mbps data rate
Crypto Engine HSM with AES-128/192/256, SHA-256/512, ECC/RSA, TRNG, GCM, and eSHE support
ADC Three 12-bit SAR ADCs (ADC0–ADC2) supporting up to 67 external channels and synchronized sampling
Timers 75× 16-bit + 8× 32-bit TCPWM blocks; 11 EVTGEN timers for cyclic DeepSleep wakeup

Pinout & Package

CYT2B97CACQ0AZSGS is packaged in a 144-pin LQFP (20 × 20 × 1.7 mm, 0.5-mm pitch) with dedicated power, ground, clock, debug, and peripheral function pins. Pin assignments include VDDD/VDDA/VCCD supply rails, SWD/JTAG debug interface (TCK/TMS/TDO/TDI/nTRST), CAN FD transceiver I/Os (CAN0_RX/CAN0_TX through CAN7_RX/CAN7_TX), LIN bus pins (LIN0 through LIN11), and CXPI channels (CXPI0–CXPI3).

Pin/Terminal Circuit Role Design Meaning
TCK, TMS, TDO, TDI, nTRST JTAG/SWD debug interface Enables full boundary-scan, flash programming, and real-time trace via industry-standard tools (IAR, GHS)
CAN0_RX / CAN0_TX CAN FD Channel 0 differential I/O Supports ISO 11898-1:2015 physical layer; requires external CAN transceiver for bus connection
LIN0 LIN bus master/slave I/O Compliant with ISO 17987; supports auto-baud detection and slave node position detection (SNPD)
CXPI0 CXPI channel 0 bidirectional I/O 20-kbps single-wire communication for low-cost body electronics; supports multi-drop topology
VDDD, VDDA, VCCD Power supply inputs VDDD/VDDA = 2.7–5.5 V analog/digital core; VCCD = 1.1 V internal core regulator output

Key Features

Feature Design Value
Dual-CPU Security Partitioning M4F handles application logic; M0+ isolates crypto, secure boot, and peripheral drivers-enabling ASIL-B compliance
FOTA-Ready Flash Architecture Dual-bank flash with RWW allows seamless over-the-air firmware updates without system interruption
Hardware Crypto Acceleration Integrated HSM performs AES/GCM, SHA-256/512, ECC signing/verification, and TRNG generation at line rate
ASIL-B Safety Mechanisms MPU, SMPU, PPU, SECDED ECC on SRAM/flash, dual-threshold BOD, CSV, and MCWDT meet ISO 26262 requirements
Configurable Low-Power Modes Five modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with granular wakeup source selection (GPIO, RTC, EVTGEN)

Applications

Body Control Module (BCM) Roof Module Controller

Use Scenario: Centralized control of door locks, lighting, window lifts, and seat position memory in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing real-time control tasks while managing LIN-connected actuators and CAN FD gateway functions.

Use Value: Dual-core architecture enables deterministic motor control timing (via TCPWM) and concurrent secure firmware updates without interrupting safety-critical functions.

Use Scenario: Integrated control of sunroof, panoramic roof, ambient lighting, and rain sensors in premium vehicle roof assemblies.

IC Role / Device Role / Timing Role: System-on-chip controller interfacing with CXPI for low-cost sensor networks and CAN FD for high-speed actuator coordination.

Use Value: CXPI support reduces wiring harness cost and weight; synchronized ADC sampling enables precise multi-sensor fusion for automatic sunroof closure during rain detection.

Front-End Module (FEM) Smart Junction Box

Use Scenario: Power distribution and signal conditioning for front-end electronics including headlights, radar, and camera power sequencing.

IC Role / Device Role / Timing Role: High-integration MCU providing GPIO-driven power switching, CAN FD diagnostics, and LIN-based lamp dimming control.

Use Value: 152 GPIOs with GPIO_ENH support enable direct drive of high-side/low-side switches; programmable BOD ensures reliable operation under battery voltage fluctuations.

Use Scenario: Replacing discrete fuses and relays with intelligent, software-configurable power routing and load monitoring in vehicle junction boxes.

IC Role / Device Role / Timing Role: Safety-certified controller performing current sensing (via SAR ADC), thermal monitoring, and ASIL-B fault response.

Use Value: SECDED ECC on SRAM/flash prevents silent data corruption; hardware error correction enables zero-defect field operation over 15-year vehicle lifecycle.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 Single 240-MHz Arm® Cortex®-M7 core; no companion M0+; supports CAN FD but lacks CXPI Targeted at higher-performance powertrain/safety systems; not optimized for CXPI-based body networks Select when maximum compute throughput is required and CXPI integration is unnecessary
Renesas RH850/U2A 32-bit RXv3 core; 400-MHz peak; supports CAN FD and LIN but no hardware crypto engine or dual-bank flash Focused on powertrain and chassis control; limited FOTA readiness and security acceleration Select for legacy toolchain continuity in high-reliability powertrain applications where eSHE/HSM is not mandated

Compared with S32K344 and RH850/U2A, CYT2B97CACQ0AZSGS uniquely combines dual-core deterministic partitioning, CXPI integration, certified CAN FD, and production-grade HSM-making it optimal for next-generation ASIL-B body domain controllers requiring secure FOTA.

Availability

CYT2B97CACQ0AZSGS is available at Aetrix Electronics and suitable for body control modules, roof module controllers, front-end modules, and smart junction boxes requiring stable component supply, long-term automotive lifecycle support, and ASIL-B certification.

Supply support for CYT2B97CACQ0AZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

CYT2B9 belongs to the TRAVEO™ T2G family-designed specifically for automotive body electronics requiring functional safety, secure communication, and scalable dual-core processing for domain-centralized architectures.

FAQ

What package type and pin count does CYT2B97CACQ0AZSGS use?

CYT2B97CACQ0AZSGS uses a 144-pin LQFP package (20 × 20 × 1.7 mm, 0.5-mm pitch) with defined power, clock, debug, CAN FD, LIN, and CXPI pin allocations per Infineon's official datasheet Rev. *I. This variant supports full peripheral functionality including all 8 CAN FD channels and 12 LIN interfaces.

Does CYT2B97CACQ0AZSGS support functional safety certification for ASIL-B?

Yes. CYT2B97CACQ0AZSGS integrates MPU, SMPU, PPU, SECDED ECC on SRAM and flash, dual-threshold BOD, CSV, and MCWDT-features validated by Infineon to meet ISO 26262 ASIL-B requirements. The device is qualified for automotive temperature range (–40°C to +125°C) and includes safety manuals and FMEDA reports.

How many CAN FD channels are implemented, and what is their compliance status?

CYT2B97CACQ0AZSGS supports up to eight CAN FD channels compliant with ISO 11898-1:2015 and the Bosch CAN FD Specification v1.0. It holds ISO 16845:2015 conformance certification, ensuring interoperability with standard CAN FD transceivers and guaranteed bit-rate flexibility up to 8 Mbps.

Is hardware cryptographic acceleration included, and which algorithms are supported?

Yes. The integrated Hardware Security Module (HSM) supports AES-128/192/256, SHA-256/512, ECC (NIST P-256/P-384), RSA-2048/3072, TRNG, GCM, and eSHE. These capabilities are silicon-verified and enabled in CYT2B97CACQ0AZSGS per Infineon's ordering information and datasheet feature table.

CYT2B97CACQ0AZSGS Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
144-LQFP
Series:
Traveo™ T2G
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
122
Program Memory Size:
2.0625MB (2.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 72x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B97CACQ0AZSGS FAQ

1.How can I place an order for CYT2B97CACQ0AZSGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B97CACQ0AZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CYT2B97CACQ0AZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B97CACQ0AZSGS is usually 5 days.

3.What payment methods are accepted for CYT2B97CACQ0AZSGS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B97CACQ0AZSGS transactions.

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CYT2B97CACQ0AZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B97CACQ0AZSGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B97CACQ0AZSGS?

For technical support, including CYT2B97CACQ0AZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B97CACQ0AZSGS requirements.

6.How does Aetrix verify that CYT2B97CACQ0AZSGS is sourced from the original manufacturer or authorized distributors?

All CYT2B97CACQ0AZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B97CACQ0AZSGS meets industry standards.

7.What is the process for return or replacement of CYT2B97CACQ0AZSGS?

All CYT2B97CACQ0AZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B97CACQ0AZSGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B97CACQ0AZSGS part is unused and in its original packaging.

Return procedure for CYT2B97CACQ0AZSGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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