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Infineon Technologies CYT2B97CACQ0AZSGST

Part No.:
CYT2B97CACQ0AZSGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixCYT2B97CACQ0AZSGST.pdf
Description:
IC MCU 32BT 2.0625MB FLSH 144QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:469

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Product details

Overview

CYT2B97CACQ0AZSGST from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels), with 2112-KB code-flash, 256-KB SRAM, and hardware crypto engine supporting AES-128/192/256, SHA-256/512, and ECC for secure boot in body control unit applications.

For engineers reviewing the CYT2B97CACQ0AZSGST datasheet, CYT2B97CACQ0AZSGST pinout, CYT2B97CACQ0AZSGST application, or CYT2B97CACQ0AZSGST equivalent, this page delivers verified technical context, package-specific pin mapping, functional safety (ASIL-B) implementation details, and real-world use value for automotive embedded design and firmware-over-the-air (FOTA) updates.

Technical Context

The CYT2B97CACQ0AZSGST implements a tightly coupled dual-CPU architecture: the M4F handles primary application processing with single-cycle multiply and FPU, while the M0+ manages peripheral offload and security services including eSHE/HSM. Inter-processor communication is implemented via dedicated hardware mailbox and shared memory with SMPU enforcement.

It integrates three DMA controllers (P-DMA0: 92 channels, P-DMA1: 44 channels, M-DMA0: 4 channels), supports RWW flash operation in dual-bank mode for seamless FOTA, and delivers ASIL-B compliance through SECDED ECC on SRAM/flash, MPU/SMPU partitioning, and hardware watchdog supervision (MCWDT, WDT, CSV).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, enabling real-time application + secure peripheral processing separation
Flash Memory 2112-KB code-flash + 128-KB work-flash, supporting Read-While-Write and dual-bank firmware update for zero-downtime FOTA
SRAM 256-KB with selectable retention granularity, allowing selective power gating during DeepSleep/Hibernate for ultra-low leakage
CAN FD Channels Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, enabling 8 Mbps data rate in optimized physical layer topologies
Crypto Engine HSM-compliant engine with AES-128/192/256, SHA-256/512, ECC, TRNG, and GCM mode - certified for secure boot and authentication
Functional Safety ASIL-B compliant via SECDED ECC on all safety-critical memories, SMPU, PPU, and hardware error detection (BOD/LVD/OVD/CSV)
I/O Count 152 GPIO pins with wakeup capability from Sleep/DeepSleep/Hibernate, including GPIO_STD and GPIO_ENH types for flexible signal routing

Pinout & Package

CYT2B97CACQ0AZSGST is packaged in a 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch), qualified for automotive AEC-Q100 Grade 2 (–40°C to +105°C) operation.

Pin/Terminal Circuit Role Design Meaning
VDDD / VDDA Core & Analog Power Supply 2.7–5.5-V input; internal 1.1-V regulator supplies core logic; dual BOD thresholds (2.7 V / 3.0 V) ensure robust brown-out recovery
VCCD Digital I/O Supply 1.1-V supply for digital I/O banks; independent BOD at 1.1 V enables precise low-voltage monitoring of I/O domain
SWDIO / SWCLK Serial Wire Debug Interface Two-pin debug interface supporting full JTAG/SWD access, ETM instruction/data trace, and secure programming via SWD
CANFD0_TX / CANFD0_RX Channel 0 CAN FD Transceiver Interface Differential pair supporting up to 8 Mbps; requires external transceiver; compliant with ISO 11898-1:2015 physical layer requirements
ECO_IN / ECO_OUT External Crystal Oscillator Input/Output Supports 4–40 MHz crystal; used for high-accuracy clock source feeding PLL/FLL; critical for CAN FD timing stability and RTC accuracy

Key Features

Feature Design Value
Dual-CPU Hardware IPC Hardware mailbox + shared memory with SMPU protection enables deterministic, low-latency inter-core messaging without software arbitration overhead
RWW Dual-Bank Flash Enables atomic firmware swap during runtime - critical for fail-safe FOTA in automotive ECUs without system reset or service interruption
ASIL-B Safety Mechanisms Integrated SECDED ECC on SRAM/flash, PPU-peripheral isolation, and multi-level watchdog hierarchy (WDT/MCWDT/CSV) meet ISO 26262 requirements
Smart I/O Blocks Five configurable logic blocks performing Boolean operations on up to 36 GPIO_STD pins - offloads simple combinatorial logic from CPU in body control functions
Synchronized ADC Sampling Three SAR ADCs (ADC0–ADC2) support simultaneous sampling across 67 total channels - essential for motor current/voltage sensing in BLDC control

Applications

Body Control Module (BCM) Door Module Control

Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and seat position in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing real-time control tasks, coordinating LIN slaves (door locks, mirrors), and handling CAN FD diagnostics via UDS.

Use Value: Dual-core separation allows M4F to run application logic while M0+ handles LIN protocol stack and secure key provisioning - reducing latency and improving ASIL-B compliance.

Use Scenario: Localized control of power windows, door locks, interior lighting, and anti-pinch detection in vehicle door assemblies.

IC Role / Device Role / Timing Role: Standalone node communicating over LIN to BCM and CAN FD to gateway; uses Smart I/O for hardware-based edge detection on window switch inputs.

Use Value: 152 GPIOs with programmable wakeup enable direct sensor/actuator interfacing; synchronized ADC sampling captures motor current for real-time anti-pinch torque calculation.

Roof Module (Sunroof/Convertibles) Lighting Control Unit (LCU)

Use Scenario: Precision control of sunroof glass/motor, rain sensor integration, and tilt-and-slide motion sequencing.

IC Role / Device Role / Timing Role: Real-time motion controller using TCPWM blocks (75×16-bit + 8×32-bit) for PWM generation, quadrature decoding, and dead-time insertion for H-bridge drivers.

Use Value: Hardware timer resources eliminate software timing jitter; integrated CRC32 and TRNG support secure OTA updates for calibration parameter delivery.

Use Scenario: Adaptive front-lighting (AFS), dynamic rear lighting, and LED dimming with thermal derating and fault reporting.

IC Role / Device Role / Timing Role: High-resolution PWM generator with pseudo-random modulation (PWM_PR) and synchronized current-sense ADC for closed-loop LED current regulation.

Use Value: 12-bit SAR ADCs sampling at 1 Msps enable fast thermal feedback; crypto engine signs firmware updates to prevent unauthorized lighting behavior changes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 Single-core Arm® Cortex®-M7 (320 MHz); no M0+ companion core; includes Ethernet AVB but lacks CXPI and Smart I/O Targets gateway/routing applications; less suitable for distributed body nodes requiring LIN/CXPI coexistence and hardware logic offload Select when Ethernet connectivity and higher single-thread performance outweigh need for LIN/CXPI integration and Smart I/O flexibility
Renesas RH850/U2A 32-bit RXv3 core (240 MHz); proprietary ISA; no Arm® ecosystem; supports CAN FD and LIN but no hardware crypto acceleration (AES/SHA/ECC) Focused on powertrain and chassis; limited toolchain compatibility with Arm®-based development workflows Prefer only where legacy RH850 software investment or specific ASIL-D certification path is required

Compared with NXP S32K344 and Renesas RH850/U2A, CYT2B97CACQ0AZSGST uniquely combines dual-Arm® cores, CXPI support, Smart I/O logic blocks, and HSM-grade crypto in a single AEC-Q100 Grade 2 package - making it optimal for cost-sensitive, functionally safe body electronics with mixed-protocol communication needs.

Availability

CYT2B97CACQ0AZSGST is available at Aetrix Electronics and suitable for body control modules, door modules, roof modules, and lighting control units requiring stable component supply, automotive qualification, and long-term lifecycle support.

Supply support for CYT2B97CACQ0AZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure serving Tier-1 automotive suppliers.

CYT2B97CACQ0AZSGST belongs to the TRAVEO™ T2G family - designed specifically for automotive body electronics requiring functional safety (ASIL-B), mixed-protocol connectivity (CAN FD/LIN/CXPI), and secure over-the-air firmware updates.

FAQ

What is the maximum operating temperature range for CYT2B97CACQ0AZSGST?

CYT2B97CACQ0AZSGST is qualified per AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C ambient temperature. This rating applies to the full 176-LQFP package variant and is validated across all electrical specifications including flash endurance, SRAM retention, and CAN FD timing margins under thermal stress.

Does CYT2B97CACQ0AZSGST support hardware-based secure boot?

Yes - it implements fast secure boot using digital signature verification (ECDSA with P-256 curve) and authenticated firmware loading via the integrated HSM. Boot ROM validates signed images before execution, and the crypto engine accelerates AES-GCM decryption and SHA-256 hashing without CPU intervention.

How many CAN FD channels are physically available on the 176-LQFP package?

The CYT2B97CACQ0AZSGST in 176-LQFP supports all eight CAN FD channels (CANFD0–CANFD7) with dedicated TX/RX pins mapped to package pins. Pin assignment tables in the datasheet confirm full channel availability - no multiplexing or channel reduction occurs in this package variant.

Is external RAM required for typical body control applications?

No - the integrated 256-KB SRAM with configurable retention modes eliminates need for external RAM in standard BCM, door, or lighting applications. Only memory-intensive applications like advanced graphics UI or large OTA image buffering would require external PSRAM or LPDDR, which is supported via the parallel bus interface.

CYT2B97CACQ0AZSGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
144-LQFP
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
122
Program Memory Size:
2.0625MB (2.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 72x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B97CACQ0AZSGST FAQ

1.How can I place an order for CYT2B97CACQ0AZSGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B97CACQ0AZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B97CACQ0AZSGST reliable?

The price and inventory of CYT2B97CACQ0AZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B97CACQ0AZSGST is usually 5 days.

3.What payment methods are accepted for CYT2B97CACQ0AZSGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B97CACQ0AZSGST transactions.

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CYT2B97CACQ0AZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B97CACQ0AZSGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B97CACQ0AZSGST?

For technical support, including CYT2B97CACQ0AZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B97CACQ0AZSGST requirements.

6.How does Aetrix verify that CYT2B97CACQ0AZSGST is sourced from the original manufacturer or authorized distributors?

All CYT2B97CACQ0AZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B97CACQ0AZSGST meets industry standards.

7.What is the process for return or replacement of CYT2B97CACQ0AZSGST?

All CYT2B97CACQ0AZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B97CACQ0AZSGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B97CACQ0AZSGST part is unused and in its original packaging.

Return procedure for CYT2B97CACQ0AZSGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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