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Infineon Technologies CYT2B98BACQ0AZEGST

Part No.:
CYT2B98BACQ0AZEGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixCYT2B98BACQ0AZEGST.pdf
Description:
IC MCU 32BT 2.0625MB FLSH 176QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,558

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Product details

Overview

CYT2B98BACQ0AZEGST from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, 256-KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels); deployed in body control modules requiring ASIL-B functional safety compliance.

For engineers reviewing the CYT2B98BACQ0AZEGST datasheet, CYT2B98BACQ0AZEGST pinout, CYT2B98BACQ0AZEGST application, or CYT2B98BACQ0AZEGST equivalent, this part supports secure boot via eSHE/HSM, hardware-accelerated crypto (AES-128/192/256, SHA-256/512, ECC, RSA), synchronized SAR ADC sampling for motor sensing, and fine-grained low-power modes including Hibernate with dual-pin wakeup.

Technical Context

The CYT2B98BACQ0AZEGST implements a tightly coupled dual-CPU architecture: the M4F handles real-time application processing with FPU and MPU, while the M0+ manages peripheral offload, security services, and inter-processor communication via dedicated hardware mailbox. Its clock system integrates IMO, ILO, ECO, WCO, PLL, and FLL for flexible timing control across power states.

Peripheral protection is enforced by PPU, SMPU, and SECDED ECC on all safety-critical memories; analog subsystems include three 12-bit SAR ADCs (67 total external channels, 1 Msps max rate) with sequencer-driven autonomous scanning and synchronized sampling capability for motor control feedback loops.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, enabling real-time application + secure peripheral management
Flash Memory 2112-KB code-flash + 128-KB work-flash, supporting Read-While-Write and dual-bank firmware updates for FOTA
SRAM 256-KB with selectable retention granularity, allowing selective memory retention during low-power Sleep/DeepSleep modes
CAN FD Channels Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, enabling 8 Mbps data rates in automotive network backbones
ADC System Three independent 12-bit SAR ADCs (ADC0–ADC2), 67 total external channels, 1 Msps sampling, synchronized acquisition for motor current/voltage sensing
Crypto Engine HSM-compliant engine with AES-128/192/256, SHA-256/512, ECC/RSA acceleration, TRNG, and GCM mode for secure boot and OTA authentication
Functional Safety ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC on flash/SRAM, BOD/LVD/OVD, and MCWDT for fault detection and recovery

Pinout & Package

CYT2B98BACQ0AZEGST is packaged in a 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch) with 152 programmable GPIOs - including GPIO_STD and GPIO_ENH types - and dedicated power, clock, debug, and peripheral interface pins.

Pin/Terminal Circuit Role Design Meaning
VDDD / VDDA / VCCD Core, Analog, and Digital Supply Rails Independent 2.7–5.5-V inputs with internal 1.1-V core regulator; separate analog rail enables noise-sensitive ADC operation
P0[0]–P11[15] Programmable GPIO Banks 152 total I/Os supporting multiple alternate functions (CAN FD, LIN, CXPI, SCB, TCPWM), configurable pull-up/down, drive strength, and slew rate
TCK / TMS / TDI / TDO / nTRST JTAG Debug Interface IEEE-1149.1-compliant boundary-scan and debug access; supports ETM instruction/data trace via JTAG or SWD
SWDIO / SWCLK Serial Wire Debug Interface 2-pin debug port enabling programming, real-time tracing, and secure debug authentication in production and development
CANFD0_TX / CANFD0_RX CAN FD Channel 0 Transceiver Interface Differential signaling pair supporting up to 8 Mbps; requires external transceiver for physical layer connection to automotive bus

Key Features

Feature Design Value
Dual-CPU Inter-Processor Communication Hardware mailbox with interrupt signaling enables deterministic, low-latency task handoff between M4F and M0+ without software polling
Firmware Update Over The Air (FOTA) Dual-bank flash architecture with RWW allows seamless background firmware update while maintaining active application execution
Synchronized ADC Sampling Simultaneous start of conversion across all three SAR ADCs ensures phase-aligned current/voltage measurements for field-oriented motor control
Smart I/O Logic Blocks Five configurable logic units perform Boolean operations (AND/OR/XOR) on GPIO signals, enabling hardware-level signal conditioning without CPU intervention
Low-Power Hibernate Mode Consumes <1 µA typical with RTC running; supports wakeup via two dedicated pins or external event triggers, ideal for always-on vehicle entry systems

Applications

Body Control Module (BCM) Electronic Power Steering (EPS)

Use Scenario: Centralized control of door locks, lighting, window lifts, and seat position memory in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU managing LIN/CAN FD gateway functions, PWM-driven actuator control, and secure keyless entry authentication.

Use Value: Dual-core separation isolates safety-critical LIN messaging (M0+) from UI/application logic (M4F), meeting ASIL-B decomposition requirements.

Use Scenario: Real-time torque assist calculation and motor phase current regulation in steer-by-wire systems.

IC Role / Device Role / Timing Role: Motor controller executing FOC algorithms with synchronized 12-bit ADC sampling and high-resolution PWM_DT generation.

Use Value: Hardware-accelerated crypto secures firmware updates; synchronized ADCs capture simultaneous phase currents with <100 ns skew.

Automotive Gateway Climate Control Unit

Use Scenario: Protocol translation and message routing between CAN FD backbone, LIN subnets, and CXPI sensors in multi-domain architectures.

IC Role / Device Role / Timing Role: Network bridge with eight CAN FD ports, twelve LIN controllers, and four CXPI interfaces operating concurrently.

Use Value: Runtime-reconfigurable SCBs allow dynamic assignment of UART/I2C/SPI per channel, reducing BOM count and PCB footprint.

Use Scenario: HVAC blower motor control, temperature sensor fusion, and user interface management in cabin climate systems.

IC Role / Device Role / Timing Role: Mixed-signal controller integrating SAR ADCs for NTC thermistors, PWM for DC brushless fan motors, and LIN for actuator feedback.

Use Value: Low-power DeepSleep mode (<5 µA) with 11 EVTGEN timers enables precise cyclic sensor polling while minimizing battery drain.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S32K344 Single-core Arm® Cortex®-M7 (320 MHz), no M0+ co-processor; includes HSE security module but lacks hardware mailbox IPC Targeted at higher-performance gateway/radar applications; less suitable for strict ASIL-B decomposition requiring physical core isolation Prefer when raw M7 compute throughput >160 MHz is required and security tasks can be software-managed
TC397 Tri-core (2× TriCore + 1× Cortex®-M7), 300 MHz, AURIX™ safety architecture with lockstep cores; no CAN FD native support (requires external PHY) Designed for chassis/safety-critical domains (ASIL-D); larger die size and higher cost than CYT2B9 for body electronics Prefer when ASIL-D certification or lockstep redundancy is mandatory, not for cost-sensitive BCM designs

Compared with S32K344 and TC397, CYT2B98BACQ0AZEGST delivers optimal balance of ASIL-B compliance, dual-core hardware isolation, CAN FD integration, and power efficiency for body electronics-without over-specifying for non-safety-critical domains.

Availability

CYT2B98BACQ0AZEGST is available at Aetrix Electronics and suitable for automotive body control modules, electronic power steering systems, climate control units, and gateway nodes requiring stable component supply, long lifecycle support, and ASIL-B certified silicon.

Supply support for CYT2B98BACQ0AZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

CYT2B98BACQ0AZEGST belongs to the TRAVEO™ T2G family, designed specifically for automotive body electronics requiring functional safety, secure firmware updates, and multi-protocol connectivity in space-constrained LQFP packages.

FAQ

Does CYT2B98BACQ0AZEGST support CAN FD without external transceivers?

No. CYT2B98BACQ0AZEGST provides CAN FD protocol logic and physical layer signaling (TX/RX differential pairs) but requires external CAN FD transceivers (e.g., TJA1044, IFX1050) to drive the bus. The MCU handles bit timing, arbitration, and frame formatting internally.

What is the maximum operating temperature range for this device?

CYT2B98BACQ0AZEGST is qualified for automotive AEC-Q100 Grade 2 operation, supporting ambient temperatures from −40 °C to +105 °C. Junction temperature must remain ≤125 °C under continuous operation, verified per thermal derating curves in Section 27.2 of the datasheet.

How is secure boot implemented in CYT2B98BACQ0AZEGST?

Secure boot uses hardware-enforced digital signature verification of the boot image using ECDSA with P-256 curve. The public key is fused into eFuses; only images signed with the corresponding private key execute. Boot ROM validates signatures before loading code into SRAM or flash, preventing unauthorized firmware execution.

Can the 176-LQFP package be used with standard reflow profiles?

Yes. CYT2B98BACQ0AZEGST's 176-LQFP package complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) and supports standard lead-free reflow profiles (peak 260 °C, 20–40 sec above 217 °C). Pre-bake at 125 °C for 8 hours is required if exposed >168 hours at >30 °C/60% RH.

CYT2B98BACQ0AZEGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
152
Program Memory Size:
2.0625MB (2.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT2B98BACQ0AZEGST FAQ

1.How can I place an order for CYT2B98BACQ0AZEGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B98BACQ0AZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B98BACQ0AZEGST reliable?

The price and inventory of CYT2B98BACQ0AZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B98BACQ0AZEGST is usually 5 days.

3.What payment methods are accepted for CYT2B98BACQ0AZEGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B98BACQ0AZEGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT2B98BACQ0AZEGST?

CYT2B98BACQ0AZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B98BACQ0AZEGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B98BACQ0AZEGST?

For technical support, including CYT2B98BACQ0AZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B98BACQ0AZEGST requirements.

6.How does Aetrix verify that CYT2B98BACQ0AZEGST is sourced from the original manufacturer or authorized distributors?

All CYT2B98BACQ0AZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B98BACQ0AZEGST meets industry standards.

7.What is the process for return or replacement of CYT2B98BACQ0AZEGST?

All CYT2B98BACQ0AZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B98BACQ0AZEGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B98BACQ0AZEGST part is unused and in its original packaging.

Return procedure for CYT2B98BACQ0AZEGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYT2B98BACQ0AZEGST Tags

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