My Inquiry
My Account
Infineon Technologies CYT2B98CACQ0AZEGS
- Part No.:
- CYT2B98CACQ0AZEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
CYT2B98CACQ0AZEGS.pdf
- Description:
- TVII-B-E-2M-176 REV A2 CFLASH 2M
- Quantity:
- Payment:
- Shipping:
Inventory:383
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT2B98CACQ0AZEGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112-KB code-flash with RWW support, 256-KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels) for body control unit applications.
For engineers reviewing the CYT2B98CACQ0AZEGS datasheet, CYT2B98CACQ0AZEGS pinout, CYT2B98CACQ0AZEGS application, or CYT2B98CACQ0AZEGS equivalent, this part delivers ASIL-B functional safety, hardware crypto acceleration (AES-128/192/256, SHA-256/512, ECC, TRNG), and low-power DeepSleep/Hibernate modes with multi-pin wakeup capability.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the M4F handles real-time application processing and the M0+ manages peripheral offload, security boot, and safety monitoring via hardware inter-processor communication and shared memory protection (SMPU). It integrates three DMA controllers-P-DMA0 (92 channels), P-DMA1 (44 channels), and M-DMA0 (4 channels)-to decouple data movement from CPU execution.
Clocking is managed through multiple sources including IMO, ILO, ECO, WCO, PLL, and FLL, enabling dynamic frequency scaling across five power modes. Safety-critical memories employ SECDED ECC, while analog subsystems include three SAR ADCs (12-bit, up to 1 Msps each) with synchronized sampling for motor-sense applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+ |
| Flash Memory | 2112-KB code-flash + 128-KB work-flash; supports Read-While-Write and dual-bank FOTA updates |
| SRAM | 256-KB with configurable retention granularity per memory region |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting up to 8 Mbps |
| Crypto Engine | Hardware-accelerated AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and GCM mode |
| Functional Safety | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC on flash/SRAM, and MCWDT |
| ADC Subsystem | Three independent 12-bit SAR ADCs (ADC0–ADC2); total 67 external channels; synchronized sampling enabled |
Pinout & Package
This device is packaged in a 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch) with dedicated power, ground, I/O, clock, debug, and peripheral function pins. Pin assignments are defined per package variant in Infineon's official datasheet Section 10–14.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD / VDDA | Analog & digital core supply | 2.7–5.5-V input powering internal 1.1-V regulator; dual BOD thresholds (2.7 V / 3.0 V) |
| P0[0]–P0[7] | GPIO_STD bank | Programmable standard I/Os supporting LIN/CXPI alternate functions and wakeup from Sleep |
| P12[0]–P12[7] | GPIO_ENH bank | Enhanced I/Os with higher drive strength and smart logic support (Boolean operations) |
| TCK / TMS / TDI / TDO | JTAG debug interface | IEEE-1149.1-compliant boundary scan and test access; supports ETM trace |
| SWDIO / SWCLK | Serial Wire Debug | Two-pin Arm® SWD interface for programming and real-time debugging |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 | Differential transceiver interface supporting up to 8 Mbps; requires external CAN FD transceiver |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Security Partitioning | M0+ enforces secure boot via digital signature verification and isolates HSM/eSHE services from M4F application domain |
| Firmware Update Flexibility | Dual-bank flash enables atomic over-the-air (FOTA) updates without runtime interruption or external memory |
| Low-Power Wakeup Granularity | Hibernate mode supports wakeup from up to two dedicated pins; Sleep mode supports wakeup from any of 152 GPIOs |
| Motor Control Timing Precision | 75× 16-bit and 8× 32-bit TCPWM blocks support PWM_DT, quadrature decoding, and synchronized ADC sampling |
| Peripheral Reconfigurability | 8 SCB blocks runtime-configurable as UART/I²C/SPI; 12 LIN channels compliant with ISO 17987 |
Applications
| Body Control Module (BCM) | Door Module Control |
|---|---|
Use Scenario: Centralized management of lighting, windows, locks, and mirrors in modern vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time control logic, CAN FD messaging, and LIN slave coordination. Use Value: Dual-core architecture enables concurrent application execution (M4F) and secure peripheral handling (M0+), reducing software complexity and latency. | Use Scenario: Distributed control of power windows, door locks, and mirror adjustment with local sensor feedback. IC Role / Device Role / Timing Role: LIN master node interfacing with up to 12 slave devices; uses Smart I/O for local Boolean logic offload. Use Value: Integrated LIN PHY support and programmable GPIO_ENH reduce external component count and PCB footprint. |
| Roof Module with Sunroof Control | Seat Control Unit |
Use Scenario: Motorized sunroof actuation with position sensing, obstacle detection, and anti-pinch logic. IC Role / Device Role / Timing Role: Real-time motor control using synchronized ADC sampling and PWM_DT outputs for precise current regulation. Use Value: Three SAR ADCs with simultaneous sampling and 75 TCPWM blocks enable closed-loop control without external timing ICs. | Use Scenario: Adjustment of seat position, heating, ventilation, and memory recall via CAN FD commands. IC Role / Device Role / Timing Role: CAN FD endpoint with secure firmware update capability and ASIL-B safety monitoring for heater element control. Use Value: Hardware crypto engine ensures authenticated FOTA updates; SECDED ECC prevents latent memory corruption in safety-critical heating control paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K344 | Single-core Arm® Cortex®-M7 at 320 MHz; no M0+ co-processor; NXP S32 Security Engine instead of Infineon eSHE/HSM | Targeted at gateway and high-performance ADAS edge nodes; lacks native LIN/CXPI integration | Select when higher single-thread compute throughput is required and LIN/CXPI are not needed. |
| TC397 | Tri-core (2× TriCore + 1× Cortex®-M7); 300-MHz main core; includes SENT, Ethernet AVB, but no CXPI | Designed for chassis/safety-critical domains; requires external LIN transceivers and lacks integrated CXPI PHY | Select for ASIL-D systems requiring triple-lockstep cores and Ethernet connectivity, not body electronics. |
Compared with S32K344 and TC397, CYT2B98CACQ0AZEGS provides optimized integration for body electronics with native LIN/CXPI, dual-core security partitioning, and lower power consumption in DeepSleep-making it uniquely suited for cost-sensitive, feature-rich BCM designs.
Availability
CYT2B98CACQ0AZEGS is available at Aetrix Electronics and suitable for automotive body control modules, door modules, roof modules, and seat control units requiring stable component supply, long lifecycle support, and ASIL-B compliance.
Supply support for CYT2B98CACQ0AZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D infrastructure.
CYT2B9 belongs to the TRAVEO™ T2G family, designed specifically for automotive body electronics requiring functional safety, secure firmware updates, and mixed-signal integration in resource-constrained ECUs.
FAQ
Does CYT2B98CACQ0AZEGS support JTAG and SWD debugging simultaneously?
Yes. The device integrates both IEEE-1149.1-compliant JTAG and Arm® Serial Wire Debug (SWD) interfaces. They share physical pins but operate independently-JTAG supports full boundary scan and ETM instruction/data trace, while SWD provides minimal-pin debugging with data trace only. Selection is configured via boot mode pins.
What is the maximum operating temperature range for CYT2B98CACQ0AZEGS?
CYT2B98CACQ0AZEGS is qualified for automotive AEC-Q100 Grade 2 operation, with a junction temperature range of –40 °C to +105 °C. This rating is validated across all electrical specifications, including flash programming, ADC accuracy, and CAN FD timing margins under thermal stress.
How many CAN FD transceivers are required for full 8-channel operation?
Each CAN FD channel requires one external transceiver. For full 8-channel operation, eight discrete CAN FD transceivers (e.g., TJA1044, IFX1050) must be used. The MCU provides all protocol logic, bit timing, and error handling; transceivers handle physical layer signaling only.
Is the 2112-KB code-flash field-programmable via SWD/JTAG after soldering?
Yes. The code-flash supports in-system programming via SWD or JTAG using standard tools (e.g., Segger J-Link, Infineon DAPLink). Flash programming includes erase, program, and verify operations with checksum validation. No external HV programming voltage is required-standard 3.3-V I/O supply suffices.
CYT2B98CACQ0AZEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP
- Series:
- Traveo CYT2B9
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+/M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 160MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 82x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2B98CACQ0AZEGS FAQ
1.How can I place an order for CYT2B98CACQ0AZEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2B98CACQ0AZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2B98CACQ0AZEGS reliable?
The price and inventory of CYT2B98CACQ0AZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B98CACQ0AZEGS is usually 5 days.
3.What payment methods are accepted for CYT2B98CACQ0AZEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B98CACQ0AZEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT2B98CACQ0AZEGS?
CYT2B98CACQ0AZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2B98CACQ0AZEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2B98CACQ0AZEGS?
For technical support, including CYT2B98CACQ0AZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B98CACQ0AZEGS requirements.
6.How does Aetrix verify that CYT2B98CACQ0AZEGS is sourced from the original manufacturer or authorized distributors?
All CYT2B98CACQ0AZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B98CACQ0AZEGS meets industry standards.
7.What is the process for return or replacement of CYT2B98CACQ0AZEGS?
All CYT2B98CACQ0AZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B98CACQ0AZEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2B98CACQ0AZEGS part is unused and in its original packaging.
Return procedure for CYT2B98CACQ0AZEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT2B98CACQ0AZEGS Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
