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Infineon Technologies CYT2B98CACQ0AZSGS

Name: CYT2B98CACQ0AZSGS
Brand: Infineon Technologies
SKU: CYT2B98CACQ0AZSGS
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYT2B98CACQ0AZSGS

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 176-LQFP

Datasheet:: CYT2B98CACQ0AZSGS.pdf

Description:: IC MCU 32BT 2.0625MB FLSH 176QFP

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Product details

Overview

CYT2B98CACQ0AZSGS from Infineon is a dual-core automotive microcontroller featuring a 160-MHz Arm® Cortex®-M4F CPU and a 100-MHz Arm® Cortex®-M0+ CPU, 2112 KB code-flash with RWW support, 256 KB SRAM, and integrated CAN FD (up to 8 channels), LIN (up to 12 channels), and CXPI (up to 4 channels). It targets body control modules requiring ASIL-B functional safety, secure boot, and hardware crypto acceleration including AES-128/192/256, SHA-256/512, and ECC.

For engineers reviewing the CYT2B98CACQ0AZSGS datasheet, CYT2B98CACQ0AZSGS pinout, CYT2B98CACQ0AZSGS application, or CYT2B98CACQ0AZSGS equivalent, this part supports fine-grained power management (Hibernate, DeepSleep), synchronized multi-ADC sampling for motor sensing, hardware inter-processor communication, and trace-enabled debug via SWD/JTAG - critical for automotive ECU development and FOTA-capable systems.

Technical Context

The CYT2B98CACQ0AZSGS implements a tightly coupled dual-CPU architecture: the M4F handles real-time application processing with single-cycle multiply and FPU, while the M0+ manages peripheral offload, security services (eSHE/HSM), and safe interrupt handling. Hardware IPC and three DMA controllers (P-DMA0: 92 ch, P-DMA1: 44 ch, M-DMA0: 4 ch) enable deterministic data movement across subsystems without CPU intervention.

It integrates safety-critical peripherals including SECDED ECC on flash/SRAM, Peripheral Protection Unit (PPU), dual BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA), and MCWDT. Clocking includes IMO, ILO, ECO, WCO, PLL, and FLL - supporting ISO 11898-1:2015-compliant CAN FD up to 8 Mbps and LIN compliant with ISO 17987.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Cores	Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Arm® Cortex®-M0+, with hardware IPC and separate MPUs
Memory	2112 KB code-flash (RWW, dual-bank for FOTA) + 128 KB work-flash + 256 KB SRAM (retention granularity selectable)
Crypto Engine	HSM-compliant engine with AES-128/192/256, SHA-256/512, ECC/RSA, TRNG, and Galois/Counter Mode (GCM)
Automotive Interfaces	8× CAN FD (ISO 11898-1:2015), 12× LIN (ISO 17987), 4× CXPI (20 kbps), all runtime-reconfigurable
Analog Peripherals	3× SAR ADCs (12-bit, 1 Msps each); 67 total external channels; synchronized sampling for motor control
Safety & Power	ASIL-B compliance; SECDED ECC on flash/SRAM; PPU; dual-threshold BOD; Hibernate/DeepSleep wakeup via GPIO/EVTGEN/RTC

Pinout & Package

Package: 176-pin LQFP (24 × 24 × 1.7 mm, 0.5-mm pitch), RoHS-compliant, automotive-grade (–40°C to +125°C).

Pin/Terminal	Circuit Role	Design Meaning
VDDD, VDDA, VCCD	Power supply inputs	VDDD/VDDA: 2.7–5.5 V analog/digital core; VCCD: 1.1 V internal core regulator output
P0[0]–P11[7]	GPIO banks (152 total)	Configurable as GPIO_STD or GPIO_ENH; up to 152 pins support wakeup from Sleep modes
TCPWM[0]–TCPWM[82]	Timer/counter/PWM outputs	75× 16-bit + 8× 32-bit TCPWM blocks; support PWM_DT, quadrature decode, and SR modes
CANFD0_TX–CANFD7_RX	CAN FD transceiver interface	8 independent CAN FD channels; each supports up to 8 Mbps (physical layer dependent)
SWDIO, SWCLK, TMS, TCK, TDI, TDO	Debug interface signals	Supports Arm® SWD and IEEE-1149.1 JTAG; enables ETM instruction/data trace

Key Features

Feature	Design Value
Dual-CPU Security Partitioning	M4F runs application firmware; M0+ enforces secure boot, crypto operations, and peripheral access control via eSHE/HSM
FOTA-Ready Flash Architecture	Dual-bank code-flash + RWW allows atomic firmware update without halting real-time execution
Hardware Synchronized ADC Sampling	Three SAR ADCs trigger simultaneously - essential for accurate motor phase current/voltage acquisition
Runtime-Reconfigurable SCBs	8 serial communication blocks dynamically assignable as UART/I²C/SPI - reduces BOM count and PCB footprint
ASIL-B Safety Mechanisms	MPU/SMPU, PPU, SECDED ECC, MCWDT, and dual-threshold BOD implemented in hardware per ISO 26262 requirements

Applications

Body Control Module (BCM)

Door Module Controller

Use Scenario: Centralized control of lighting, window lift, mirror adjustment, and seat position in passenger vehicles.

IC Role / Device Role / Timing Role: Primary MCU managing LIN slaves (door locks, mirrors), CAN FD gateway to powertrain domain, and real-time PWM for LED dimming.

Use Value: Dual-core isolation ensures safety-critical door lock logic (M0+) remains responsive during infotainment CAN traffic bursts handled by M4F.

Use Scenario: Localized control of power windows, side mirrors, and interior lighting within a vehicle door assembly.

IC Role / Device Role / Timing Role: Standalone LIN master interfacing with sensors/actuators; uses Smart I/O for hardware debounce and edge-triggered wakeup.

Use Value: 152 GPIOs and 12 LIN channels allow integration of all door functions onto one die - eliminating discrete LIN transceivers and reducing harness weight.

Roof Module Controller

Smart Junction Box

Use Scenario: Management of sunroof actuation, panoramic roof shading, and ambient lighting in premium vehicle roofs.

IC Role / Device Role / Timing Role: Real-time motor control via TCPWM blocks with dead-time insertion; ADC sampling for current sensing and temperature monitoring.

Use Value: Synchronized 3-ADC sampling captures simultaneous phase currents for precise BLDC commutation - enabling smooth, quiet sunroof operation.

Use Scenario: Centralized power distribution and load switching for chassis electronics (e.g., HVAC fans, wiper motors, headlight drivers).

IC Role / Device Role / Timing Role: High-side/low-side switch controller with overcurrent protection; uses CAN FD for diagnostic reporting and LIN for local sensor polling.

Use Value: Integrated HSM and secure boot prevent unauthorized firmware updates - meeting OEM cybersecurity requirements for junction box firmware integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP S32K344	Single-core Arm® Cortex®-M7 (320 MHz); no M0+ co-processor; includes Ethernet MAC and PCIe; larger package (208-LQFP)	Better suited for gateway ECUs requiring high-speed networking; lacks dedicated security co-processor for isolated crypto offload	Select when Ethernet connectivity or higher compute throughput is required over dual-core partitioning.
Renesas RH850/U2A	32-bit RXv3 core (240 MHz); proprietary ISA; no Arm® architecture; supports CAN FD and LIN but no CXPI; no integrated HSM	Strong legacy support in Japanese OEMs; requires external security IC for secure boot; limited toolchain flexibility vs. Arm® ecosystem	Select for brownfield designs already using RH850 toolchains and where CXPI or HSM are not mandatory.

Compared with S32K344 and RH850/U2A, CYT2B98CACQ0AZSGS uniquely delivers hardware-isolated dual-Arm® cores with embedded HSM, CXPI support, and FOTA-optimized flash - making it optimal for new-generation body domain controllers requiring both safety and cybersecurity certification.

Availability

CYT2B98CACQ0AZSGS is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof module controllers, and smart junction boxes requiring stable component supply, long lifecycle commitment, and AEC-Q100 Grade 1 qualification.

Supply support for CYT2B98CACQ0AZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification expertise.

CYT2B9 belongs to the TRAVEO™ T2G family - designed specifically for automotive body electronics requiring functional safety (ASIL-B), hardware-accelerated security, and mixed-signal integration in a single chip.

FAQ

What is the maximum operating temperature range for CYT2B98CACQ0AZSGS?

The CYT2B98CACQ0AZSGS is qualified per AEC-Q100 Grade 1, supporting continuous operation from –40°C to +125°C ambient temperature. This rating applies to the full 176-LQFP package variant and is validated across voltage ranges (2.7 V to 5.5 V) and all supported clock frequencies, including 160-MHz M4F core operation.

Does CYT2B98CACQ0AZSGS support Over-The-Air (OTA) firmware updates?

Yes. The device supports secure OTA updates via its dual-bank code-flash architecture and Read-While-Write capability. Firmware images can be written to the inactive bank while the active bank executes, enabling atomic swap on reset. Secure boot verification using ECDSA-signed images is enforced by the integrated HSM before execution.

How many CAN FD channels does CYT2B98CACQ0AZSGS support, and what is their data rate?

CYT2B98CACQ0AZSGS supports up to eight independent CAN FD channels, each configurable in runtime. Data rates reach up to 8 Mbps in FD mode, compliant with ISO 11898-1:2015. Actual achievable rate depends on physical layer topology and external transceiver performance - not limited by the MCU's internal controller.

Is hardware debug trace supported, and which interfaces provide it?

Yes. CYT2B98CACQ0AZSGS supports full Arm® trace: instruction and data trace via JTAG (IEEE-1149.1), and data-only trace via SWD. It integrates an Embedded Trace Macrocell (ETM) compatible with industry tools including IAR EWARM and GHS MULTI, enabling real-time code execution analysis and timing validation in safety-critical automotive software.

CYT2B98CACQ0AZSGS Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 176-LQFP

Series:: Traveo™ T2G

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Core Processor:: ARM® Cortex®-M0+, ARM® Cortex®-M4F

Core Size:: 32-Bit Dual-Core

Speed:: 100MHz, 160MHz

Connectivity:: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART

Peripherals:: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT

Number of I/O:: 152

Program Memory Size:: 2.0625MB (2.0625M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 128K x 8

RAM Size:: 256K x 8

Voltage - Supply (Vcc/Vdd):: 2.7V ~ 5.5V

Data Converters:: A/D 82x12b SAR

Oscillator Type:: External, Internal

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

CYT2B98CACQ0AZSGS FAQ

1.How can I place an order for CYT2B98CACQ0AZSGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT2B98CACQ0AZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT2B98CACQ0AZSGS reliable?

The price and inventory of CYT2B98CACQ0AZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2B98CACQ0AZSGS is usually 5 days.

3.What payment methods are accepted for CYT2B98CACQ0AZSGS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2B98CACQ0AZSGS transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT2B98CACQ0AZSGS?

CYT2B98CACQ0AZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT2B98CACQ0AZSGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT2B98CACQ0AZSGS?

For technical support, including CYT2B98CACQ0AZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2B98CACQ0AZSGS requirements.

6.How does Aetrix verify that CYT2B98CACQ0AZSGS is sourced from the original manufacturer or authorized distributors?

All CYT2B98CACQ0AZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2B98CACQ0AZSGS meets industry standards.

7.What is the process for return or replacement of CYT2B98CACQ0AZSGS?

All CYT2B98CACQ0AZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT2B98CACQ0AZSGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT2B98CACQ0AZSGS part is unused and in its original packaging.

Return procedure for CYT2B98CACQ0AZSGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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