Infineon Technologies CYT2CLHBAAQ0AZSGST
- Part No.:
- CYT2CLHBAAQ0AZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
CYT2CLHBAAQ0AZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:

- Shipping:

Inventory:1,900
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT2CLHBAAQ0AZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller with dual Arm® Cortex®-M4F (160 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash + 128 KB work-flash, integrated CAN FD (up to 8 Mbps), and hardware security module (HSM) supporting AES-256, ECC, and secure boot. It targets cluster entry units requiring ASIL-B functional safety compliance.
For engineers reviewing the CYT2CLHBAAQ0AZSGST datasheet, CYT2CLHBAAQ0AZSGST pinout, CYT2CLHBAAQ0AZSGST application, or CYT2CLHBAAQ0AZSGST equivalent, key selection criteria include dual-core real-time partitioning, RWW flash for FOTA updates, 140 GPIOs with stepper motor control capability, and certified ISO 11898-1 CAN FD support.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the M4F handles primary application processing and graphics-intensive tasks while the M0+ manages peripheral offload, security services, and ASIL-B safety monitoring via SMPU/PPU. Hardware inter-processor communication enables deterministic message passing without software arbitration.
Its clock system integrates IMO, ILO, ECO, WCO, PLL, FLL, and LPECO sources with dynamic frequency scaling across five power modes. The crypto engine delivers GCM-AES-256, SHA-512, RSA/ECC acceleration, and TRNG, all validated under eSHE and HSM compliance frameworks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 160-MHz Arm® Cortex®-M4F + 100-MHz Cortex®-M0+, enabling real-time separation of safety-critical and application logic |
| Flash Memory | 4160 KB code-flash + 128 KB work-flash with Read-While-Write and dual-bank mode for atomic FOTA updates |
| CAN FD Channels | Up to 4 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting up to 8 Mbps data rate |
| Security Engine | HSM with AES-128/192/256, SHA-512/256/160, ECC/RSA acceleration, TRNG, and secure boot via digital signature verification |
| Power Modes | Five low-power states (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds and wakeup from 128 GPIOs |
| Analog Peripherals | 12-bit SAR ADC with 32 logical/48 external channels, 1 Msps sampling, internal temperature/voltage references, and autonomous sequencer |
| I/O Count | Up to 140 programmable I/Os including GPIO_STD, GPIO_ENH, GPIO_SMC, and HSIO_STDLN for noise-sensitive applications |
Pinout & Package
Package: 144-pin LQFP, 20 × 20 × 1.7 mm, 0.5-mm lead pitch, RoHS-compliant, automotive-grade (AEC-Q100 Grade 2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD | Digital core supply | 1.1-V nominal regulated input; supports brown-out detection at 2.7 V and 3.0 V thresholds |
| VDDA_ADC | Analog ADC reference supply | 2.7–5.5 V analog domain input with dedicated 3.0 V BOD threshold for precision conversion stability |
| P0[0]–P0[7] | GPIO_STD bank 0 | Configurable as UART/I2C/SPI/CAN FD TX/RX; supports wakeup from Sleep/DeepSleep modes |
| P12[0]–P12[3] | CXPI interface | Dedicated CXPI transceiver pins supporting 20 kbps local interconnect network for body electronics |
| TCK/TMS/TDO/TDI | JTAG debug interface | IEEE-1149.1-compliant boundary scan and SWD access for production programming and in-system debugging |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Inter-Processor Communication | Hardware mailbox with interrupt-driven message passing between M4F and M0+, eliminating software polling overhead |
| Firmware Update Over-The-Air (FOTA) | Dual-bank flash architecture with atomic swap and RWW capability enables zero-downtime firmware patching |
| Functional Safety Support | ASIL-B compliance via MPU, SMPU, PPU, SECDED ECC on SRAM/flash, MCWDT, and CSV clock supervision |
| Smart I/O Logic Block | Boolean combinational logic engine on 8 GPIO_STD pins for hardware-level signal conditioning without CPU intervention |
| LCD Controller Integration | Four independent LCD controllers supporting 32-segment × 4-common displays with Type A/B waveforms and digital contrast control |
Applications
| Automotive Digital Cluster | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time rendering of speedometer, tachometer, and ADAS alerts in entry-level instrument clusters. IC Role / Device Role / Timing Role: Primary application processor (M4F) driving graphics and UI, with M0+ handling CAN FD message filtering and secure boot validation. Use Value: Dual-core isolation ensures deterministic display refresh (<16 ms) while maintaining ASIL-B safety monitoring of vehicle bus traffic. | Use Scenario: Centralized control of door locks, lighting, window lifts, and seat position memory in mid-tier vehicles. IC Role / Device Role / Timing Role: System controller managing LIN slave nodes, CXPI body networks, and PWM-driven LED drivers. Use Value: Integrated CXPI (20 kbps) and 12 reconfigurable SCB channels eliminate external protocol translators and reduce BOM count by ≥3 ICs. |
| Head-Up Display (HUD) Controller | Electric Power Steering (EPS) Interface Unit |
Use Scenario: Driving TFT-LCD-based HUD projection with brightness adaptation based on ambient light and vehicle speed. IC Role / Device Role / Timing Role: LCD controller + SAR ADC + PWM generator coordinating display timing, sensor input, and backlight dimming. Use Value: On-chip LCD drivers with digital contrast control and 12-bit ADC enable closed-loop luminance regulation without external DACs or op-amps. | Use Scenario: Bridging high-speed CAN FD steering torque commands from ADAS ECU to EPS motor driver ICs. IC Role / Device Role / Timing Role: Safety gateway performing message authentication, timeout checking, and fail-safe state management. Use Value: HSM-accelerated AES-GCM and secure boot ensure integrity of torque commands; ASIL-B peripherals detect and contain faults within <100 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Arm® Cortex®-M7 core (320 MHz); no integrated LCD controller; includes Ethernet AVB but lacks CXPI | Targeted at gateway and domain controller roles rather than display-centric cluster units | Select when Ethernet connectivity and higher single-thread performance outweigh LCD/CXPI integration needs |
| Renesas RH850/U2A | Tri-core (3× RXv3); 40-nm process; no hardware crypto engine; supports CAN FD but no HSM certification | Focused on powertrain and chassis control with deterministic real-time scheduling, not infotainment or cluster UI | Select for legacy RH850 ecosystem migration where ASIL-D capability and lockstep execution are mandatory |
Compared with S32K344 and RH850/U2A, CYT2CLHBAAQ0AZSGST uniquely combines dual-core asymmetric processing, certified HSM, integrated LCD/CXPI, and FOTA-ready flash-making it optimal for cost-sensitive, display-integrated automotive clusters requiring ASIL-B compliance.
Availability
CYT2CLHBAAQ0AZSGST is available at Aetrix Electronics and suitable for automotive digital cluster development, body control module prototyping, and head-up display controller design requiring stable component supply and long-term automotive lifecycle support.
Supply support for CYT2CLHBAAQ0AZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
CYT2CL belongs to the TRAVEO™ T2G product line, engineered specifically for automotive human-machine interface (HMI) systems requiring high-resolution display control, functional safety, and secure over-the-air updates.
FAQ
What power supply voltages does CYT2CLHBAAQ0AZSGST require?
The device operates from a 2.7–5.5 V input supply, internally generating a 1.1-V core voltage. It features three independent brown-out detectors: 2.7 V and 3.0 V thresholds on VDDD/VDDA_ADC, and a 1.1 V threshold on VCCD. These are configurable per power mode to prevent erratic operation during voltage transients.
Does CYT2CLHBAAQ0AZSGST support JTAG and SWD debugging simultaneously?
Yes - the device integrates both IEEE-1149.1 JTAG and Arm® SWD interfaces on shared pins (TCK/TMS/TDO/TDI). Debug access can be selected via configuration fuses; SWD is preferred for production programming due to its 2-pin footprint, while JTAG enables full ETM instruction/data tracing during development.
How many CAN FD channels are physically implemented on this package?
This 144-LQFP variant implements four fully independent CAN FD channels, each with dedicated TX/RX pins and message RAM. All channels support ISO 11898-1:2015 compliance, bit-rate switching up to 8 Mbps, and hardware timestamping with ±1 LSB accuracy at 40 MHz clock.
Is the crypto engine enabled by default in CYT2CLHBAAQ0AZSGST?
No - the HSM and eSHE features are factory-configured but require explicit firmware initialization and key provisioning before use. Secure boot must be enabled via OTP fuse programming; AES/ECC acceleration becomes accessible only after successful HSM authentication and session key establishment.
CYT2CLHBAAQ0AZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 160MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, Crypto - AES, DMA, LCD, LVD, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- 96
- Program Memory Size:
- 4.063MB (4.063M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT2CLHBAAQ0AZSGST FAQ
1.How can I place an order for CYT2CLHBAAQ0AZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT2CLHBAAQ0AZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT2CLHBAAQ0AZSGST reliable?
The price and inventory of CYT2CLHBAAQ0AZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT2CLHBAAQ0AZSGST is usually 5 days.
3.What payment methods are accepted for CYT2CLHBAAQ0AZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT2CLHBAAQ0AZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT2CLHBAAQ0AZSGST?
CYT2CLHBAAQ0AZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT2CLHBAAQ0AZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT2CLHBAAQ0AZSGST?
For technical support, including CYT2CLHBAAQ0AZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT2CLHBAAQ0AZSGST requirements.
6.How does Aetrix verify that CYT2CLHBAAQ0AZSGST is sourced from the original manufacturer or authorized distributors?
All CYT2CLHBAAQ0AZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT2CLHBAAQ0AZSGST meets industry standards.
7.What is the process for return or replacement of CYT2CLHBAAQ0AZSGST?
All CYT2CLHBAAQ0AZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT2CLHBAAQ0AZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT2CLHBAAQ0AZSGST part is unused and in its original packaging.
Return procedure for CYT2CLHBAAQ0AZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT2CLHBAAQ0AZSGST Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

